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name:-0.033748149871826
name:-0.023055076599121
name:-0.0067181587219238
Lee; Seung Yeop Patent Filings

Lee; Seung Yeop

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Seung Yeop.The latest application filed is for "semiconductor package including stacked semiconductor chips".

Company Profile
5.23.32
  • Lee; Seung Yeop - Daejeon KR
  • Lee; Seung Yeop - Icheon-si KR
  • LEE; Seung Yeop - Icheon-si Gyeonggi-do KR
  • Lee; Seung Yeop - Gyeonggi-do KR
  • Lee; Seung Yeop - Suwon-si KR
  • LEE; Seung Yeop - Seosan-Si KR
  • LEE; Seung Yeop - Suwon-si Gyeonggi-do KR
  • LEE; Seung-Yeop - Hanam-si KR
  • Lee; Seung Yeop - Seoul KR
  • Lee; Seung-Yeop - Cheonan-si KR
  • Lee; Seung-Yeop - Asan-si KR
  • Lee; Seung-Yeop - Chungcheongnam-do KR
  • Lee; Seung Yeop - Gyungbuk KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Mineralogical method and apparatus for removal of aqueous cesium ion
Grant 11,309,098 - Lee , et al. April 19, 2
2022-04-19
Semiconductor package including stacked semiconductor chips
Grant 11,309,303 - Eom , et al. April 19, 2
2022-04-19
Semiconductor Package Including Stacked Semiconductor Chips
App 20220037304 - EOM; Ju Il ;   et al.
2022-02-03
Semiconductor Package Including Stacked Semiconductor Chips
App 20220028847 - EOM; Ju Il ;   et al.
2022-01-27
Semiconductor integrated circuit device including an electro-static discharge protection circuit
Grant 11,195,827 - Lee , et al. December 7, 2
2021-12-07
Semiconductor device using wires and stacked semiconductor package
Grant 11,164,833 - Park , et al. November 2, 2
2021-11-02
Semiconductor integrated circuit device including an electrostatic discharge protection circuit
Grant 11,158,626 - Lee , et al. October 26, 2
2021-10-26
Stack packages including a supporting substrate
Grant 11,152,335 - Lee October 19, 2
2021-10-19
Preparation Method Of Catalyst For Ethylene Polymerization
App 20210189026 - LEE; Seung Yeop ;   et al.
2021-06-24
Preparation Method Of Catalyst For Ethylene Polymerization
App 20210187491 - LEE; Seung Yeop ;   et al.
2021-06-24
Stack packages including a fan-out sub-package
Grant 11,004,831 - Lee May 11, 2
2021-05-11
Semiconductor Device Using Wires And Stacked Semiconductor Package
App 20210104479 - PARK; Young Jo ;   et al.
2021-04-08
Stack Packages Including A Supporting Substrate
App 20200395340 - LEE; Seung Yeop
2020-12-17
Stack Packages Including A Fan-out Sub-package
App 20200350290 - LEE; Seung Yeop
2020-11-05
Mineralogical Method And Apparatus For Removal Of Aqueous Cesium Ion
App 20200258646 - A1
2020-08-13
Semiconductor Integrated Circuit Device Including An Electro-static Discharge Protection Circuit
App 20190379204 - LEE; Chang Hwi ;   et al.
2019-12-12
Method for preparing organic acid by fed-batch-feeding carbon source substrate and base
Grant 10,337,035 - Park , et al.
2019-07-02
Semiconductor packages including stacked chips
Grant 10,262,972 - Lee , et al.
2019-04-16
Semiconductor Integrated Circuit Device Including An Electrostatic Discharge Protection Circuit
App 20180350797 - LEE; Chang Hwi ;   et al.
2018-12-06
Semiconductor Packages Including Stacked Chips
App 20180342481 - LEE; Seung Yeop ;   et al.
2018-11-29
Engine Having Shearing Resistance Reduction Patterns
App 20180066602 - PARK; Jun-Sik ;   et al.
2018-03-08
Flexible device including sliding interconnection structure
Grant 9,888,567 - Lee , et al. February 6, 2
2018-02-06
Biomineralogical Method And Apparatus For Removing Cesium Ions
App 20180002210 - LEE; Seung Yeop ;   et al.
2018-01-04
Flexible Device Including Sliding Interconnection Structure
App 20170064832 - Lee; Seung Yeop ;   et al.
2017-03-02
Semiconductor devices with optical through via structures, memory cards including the same, and electronic systems including the same
Grant 9,397,024 - Lee July 19, 2
2016-07-19
Semiconductor Devices With Optical Through Via Structures, Memory Cards Including The Same, And Electronic Systems Including The Same
App 20160035649 - LEE; Seung Yeop
2016-02-04
Semiconductor chip and semiconductor package having the same
Grant 9,184,137 - Lee November 10, 2
2015-11-10
Mineralogical removal method and apparatus for highly concentrated iodine in radioactive wastewater
Grant 9,181,114 - Lee , et al. November 10, 2
2015-11-10
Pharmaceutical Composite Capsule Formulation Comprising Irbesartan And Hmg-coa Reductase Inhibitor
App 20150231085 - Kim; Yong Il ;   et al.
2015-08-20
Mineralogical Removal Method And Apparatus For Highly Concentrated Iodine In Radioactive Wastewater
App 20150191376 - Lee; Seung Yeop ;   et al.
2015-07-09
Method For Preparing Organic Acid By Fed-batch-feeding Carbon Source Substrate And Base
App 20150140615 - Park; Jae Yeon ;   et al.
2015-05-21
Method of preparing alkyl butyrate from fermented liquid using microorganisms
Grant 9,034,614 - Kang , et al. May 19, 2
2015-05-19
Purification Method And Apparatus For Radioactive Wastewater Containing Iodine Radionuclides
App 20150076045 - LEE; Seung Yeop ;   et al.
2015-03-19
Method For Removing Radionuclides Using Microalgae
App 20150004674 - LEE; Seung-Yop ;   et al.
2015-01-01
Multi-chip package cross-reference to related applications
Grant 8,816,360 - Lee August 26, 2
2014-08-26
Semiconductor device including inner interconnection structure able to conduct signals or voltages in the semiconductor chip with vertical connection vias and horizontal buried conductive lines
Grant 8,772,937 - Seo , et al. July 8, 2
2014-07-08
Semiconductor Chip And Semiconductor Package Having The Same
App 20140061866 - LEE; Seung Yeop
2014-03-06
Light guide plate stamp and method of manufacturing the same
Grant 8,616,875 - Ryu , et al. December 31, 2
2013-12-31
Method Of Preparing Alkyl Butyrate From Fermented Liquid Using Microorganisms
App 20130164801 - Kang; Sin Young ;   et al.
2013-06-27
Multi-chip Package Cross-reference To Related Applications
App 20130099256 - LEE; Seung Yeop
2013-04-25
Semiconductor Chip Module And Planar Stack Package Having The Same
App 20120286398 - LEE; Seung Yeop
2012-11-15
Semiconductor Chip Module And Semiconductor Pacakge Having The Same
App 20120205672 - SEO; Hyun Chul ;   et al.
2012-08-16
Display apparatus and method of manufacturing the same
Grant 8,233,015 - Lee July 31, 2
2012-07-31
Semiconductor Device Including Inner Interconnection Structure
App 20120126373 - SEO; Hyun Chul ;   et al.
2012-05-24
Light Guide Plate Stamp And Method Of Manufacturing The Same
App 20120006090 - RYU; Ho-Han ;   et al.
2012-01-12
Semiconductor chip capable of increased number of pads in limited region and semiconductor package using the same
Grant 7,999,370 - Lee August 16, 2
2011-08-16
Biofilm Reactor Containing Spiral Structure and Water Treatment Device Using the Same
App 20110163028 - Hwang; Seok Hwan ;   et al.
2011-07-07
Semiconductor Chip Capable Of Increased Number Of Pads In Limited Region And Semiconductor Package Using The Same
App 20100059874 - LEE; Seung Yeop
2010-03-11
Display Apparatus And Method Of Manufacturing The Same
App 20090310288 - LEE; Seung-Yeop
2009-12-17

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