Lee; Seung Seoup

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Seung Seoup.The latest application filed is for "micro-iris unit and camera module including the same".

Company Profile

0.28.33

Lee; Seung Seoup - Yongin KR
Lee; Seung Seoup - Suwon KR
Lee; Seung Seoup - Gyunggi-do KR
Lee; Seung Seoup - Suwon-Si KR
Lee; Seung Seoup - Yongin-si N/A KR
LEE; Seung Seoup - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of manufacturing optical image stabilizer Grant 9,502,464 - Lee November 22, 2	2016-11-22
Variable capacitor and integrated circuit including the same Grant 9,331,070 - Lee May 3, 2	2016-05-03
Wafer level package having cylindrical capacitor and method of fabricating the same Grant 9,153,641 - Lee , et al. October 6, 2	2015-10-06
Micro-iris Unit And Camera Module Including The Same App 20150277210 - Lee; Seung Seoup	2015-10-01
Micro-iris unit and camera module including the same Grant 9,128,350 - Lee September 8, 2	2015-09-08
Fixed focus transducer array and ultrasonic wave transceiving apparatus using the same Grant 9,060,734 - Lee June 23, 2	2015-06-23
Method for manufacturing optical image stabilizer employing scratch drive actuator Grant 8,921,146 - Lee December 30, 2	2014-12-30
Method Of Manufacturing Optical Image Stabilizer App 20140248737 - LEE; Seung Seoup	2014-09-04
Optical image stabilizer and method of manufacturing the same Grant 8,736,139 - Lee May 27, 2	2014-05-27
Method For Manufacturing Optical Image Stabilizer Employing Scratch Drive Actuator App 20140080244 - LEE; Seung Seoup	2014-03-20
Device For Converting Energy And Method For Manufacturing The Device, And Electronic Apparatus With The Device App 20140073078 - LEE; Seung Seoup	2014-03-13
Fingerprint detection sensor and method of detecting fingerprint Grant 8,666,126 - Lee , et al. March 4, 2	2014-03-04
Method of attaching die using self-assembling monolayer and package substrate including die attached thereto using self-assembling monolayer Grant 8,656,582 - Lee , et al. February 25, 2	2014-02-25
Variable Capacitor And Integrated Circuit Including The Same App 20140049119 - LEE; Seung Seoup	2014-02-20
Apparatus and method for inspecting circuit of substrate Grant 8,624,618 - Lee January 7, 2	2014-01-07
Device for converting energy and method for manufacturing the device, and electronic apparatus with the device Grant 8,614,391 - Lee December 24, 2	2013-12-24
Optical image stabilizer employing a scratch drive actuator Grant 8,593,532 - Lee November 26, 2	2013-11-26
Apparatus and method for inspecting defects in circuit pattern of substrate Grant 8,471,581 - Lee , et al. June 25, 2	2013-06-25
Wafer Level Package Having Cylindrical Capacitor and Method Of Fabrication The Same App 20130147014 - Lee; Seung Seoup ; et al.	2013-06-13
Fingerprint Detection Sensor And Method Of Detecting Fingerprint App 20130136321 - LEE; Seung Seoup ; et al.	2013-05-30
Fingerprint Detection Sensor And Method Of Manufacturing The Same App 20130133428 - Lee; Seung Seoup ; et al.	2013-05-30
Fingerprint Sensor And Method Of Operating The Same App 20130129163 - CHUNG; Il Kwon ; et al.	2013-05-23
Fixed Focus Transducer Array And Ultrasonic Wave Transceiving Apparatus Using The Same App 20130131515 - LEE; Seung Seoup	2013-05-23
Camera Module App 20130121681 - LEE; Seung Seoup	2013-05-16
Apparatus and method for inspecting defects of a circuit pattern formed on a substrate using a laser and a non-contact capacitor sensor Grant 8,410,465 - Lee , et al. April 2, 2	2013-04-02
Wafer level package having cylindrical capacitor and method of fabricating the same Grant 8,378,452 - Lee , et al. February 19, 2	2013-02-19
Apparatus And Method For Spin-coating, And Method For Manufacturing Substrate Having Structure App 20120315578 - LEE; Seung Seoup ; et al.	2012-12-13
Method of manufacturing wafer level package Grant 8,283,251 - Lee , et al. October 9, 2	2012-10-09
Method of inspecting defects in circuit pattern of substrate Grant 8,111,389 - Lee , et al. February 7, 2	2012-02-07
Optical image stabilizer and method of manufacturing the same App 20120013754 - Lee; Seung Seoup	2012-01-19
Method of manufacturing wafer level package App 20120015500 - Lee; Seung Seoup ; et al.	2012-01-19
Optical image stabilizer and method of manufacturing the same App 20110299842 - Lee; Seung Seoup	2011-12-08
Device For Converting Energy And Method For Manufacturing The Device, And Electronic Apparatus With The Device App 20110290294 - Lee; Seung Seoup	2011-12-01
Wafer Level Package And Method Of Manufacturing The Same App 20110281430 - LEE; Seung-Seoup	2011-11-17
Wafer level packaging image sensor module having lens actuator and method of manufacturing the same Grant 7,982,982 - Lee , et al. July 19, 2	2011-07-19
Apparatus And Method For Inspecting Defects In Circuit Pattern App 20110128011 - LEE; Seung Seoup ; et al.	2011-06-02
Apparatus And Method For Inspecting Defects In Circuit Pattern Of Substrate App 20110115516 - Lee; Seung Seoup ; et al.	2011-05-19
Method Of Inspecting Defects In Circuit Pattern Of Substrate App 20110116084 - LEE; Seung Seoup ; et al.	2011-05-19
Apparatus And Method For Inspecting Circuit Of Substrate App 20110109339 - Lee; Seung Seoup	2011-05-12
Wafer Level Package Having Cylindrical Capacitor And Method Of Fabricating The Same App 20110037145 - LEE; Seung Seoup ; et al.	2011-02-17
Wafer Level Package And Method Of Manufacturing The Same App 20100187677 - Lee; Seung-Seoup	2010-07-29
Method Of Attaching Die Using Self-assembling Monolayer And Package Substrate Including Die Attached Thereto Using Self-assembling Monolayer App 20100187002 - Lee; Seung Seoup ; et al.	2010-07-29
Wafer level packaging image sensor module having lens actuator and method of manfacturing the same App 20100084726 - Lee; Seung Seoup ; et al.	2010-04-08
Wafer level package and method of manufacturing the same App 20100052164 - Lee; Seung Seoup ; et al.	2010-03-04
Wafer level camera module and method of manufacturing the same App 20090309177 - Jeung; Won Kyu ; et al.	2009-12-17

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