Lee; Seongoo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Seongoo.The latest application filed is for "package structure and package process of light emitting diode".

Company Profile

0.9.6

Lee; Seongoo - Kyunggi-Do N/A KR
Lee; SeonGoo - KyungKi-Do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Light emitting package structure Grant 8,450,770 - Jeong , et al. May 28, 2	2013-05-28
Package structure and package process of light emitting diode Grant 8,330,178 - Jeong , et al. December 11, 2	2012-12-11
Package Structure And Package Process Of Light Emitting Diode App 20110278610 - Jeong; Hyunsoo ; et al.	2011-11-17
Package Structure And Package Process Of Light Emitting Diode App 20110278609 - Jeong; Hyunsoo ; et al.	2011-11-17
Light emitting diode package structure Grant 8,044,420 - Lee , et al. October 25, 2	2011-10-25
Method For Manufacturing Light Emitting Diode Package And Package Structure Thereof App 20100176407 - Lee; Seongoo ; et al.	2010-07-15
Stackable semiconductor package having semiconductor chip within central through hole of substrate Grant 7,061,120 - Shin , et al. June 13, 2	2006-06-13
Semiconductor package and method for manufacturing the same Grant 6,830,955 - Shin , et al. December 14, 2	2004-12-14
Stackable semiconductor package having semiconductor chip within central through hole of substrate App 20040175916 - Shin, WonSun ; et al.	2004-09-09
Semiconductor package having semiconductor chip within central aperture of substrate Grant 6,762,078 - Shin , et al. July 13, 2	2004-07-13
Semiconductor package and method for manufacturing the same App 20030001285 - Shin, WonSun ; et al.	2003-01-02
Semiconductor package and method for manufacturing the same Grant 6,501,184 - Shin , et al. December 31, 2	2002-12-31
Semiconductor package and method for fabricating the same Grant 6,395,578 - Shin , et al. May 28, 2	2002-05-28
Semiconductor Package Having Semiconductor Chip Within Central Aperture Of Substrate App 20010005601 - Shin, WonSun ; et al.	2001-06-28

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