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Method for preparing secondary battery and the secondary battery prepared by using the same Grant 9,356,312 - Lee , et al. May 31, 2 | 2016-05-31 |
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Voice Coil Motor, Coil Block For Voice Coil Motor, Method Of Manufacturing The Coil Block, And Voice Coil Motor Having The Coil Block App 20160043622 - Lee; Seongmin ;   et al. | 2016-02-11 |
Voice Coil Motor App 20160033736 - Lee; Seongmin ;   et al. | 2016-02-04 |
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Voice Coil Motor App 20140347556 - Lee; Seongmin ;   et al. | 2014-11-27 |
Voice coil motor Grant 8,836,177 - Lee , et al. September 16, 2 | 2014-09-16 |
Distributed Wireless Transmission And Reception System, And Expanded Wireless Network App 20140248835 - Lee; Seongmin ;   et al. | 2014-09-04 |
Integrated circuit packaging system with interposer shield and method of manufacture thereof Grant 8,779,562 - Lee , et al. July 15, 2 | 2014-07-15 |
Voice Coil Motor, Coil Block For Voice Coil Motor, Method Of Manufacturing The Coil Block, And Voice Coil Motor Having The Coil Block App 20140103747 - Lee; Seongmin ;   et al. | 2014-04-17 |
Voice coil motor, coil block for voice coil motor, method of manufacturing the coil block, and voice coil motor having the coil block Grant 8,638,510 - Lee , et al. January 28, 2 | 2014-01-28 |
Method For Preparing Secondary Battery And The Secondary Battery Prepared By Using The Same App 20130316224 - Lee; YounKyoung ;   et al. | 2013-11-28 |
Anode Active Material And Lithium Secondary Battery Comprising The Same App 20130316223 - Lee; SeongMin ;   et al. | 2013-11-28 |
Cathode Active Material And Lithium Secondary Battery Comprising The Same App 20130313470 - KIM; Daehong ;   et al. | 2013-11-28 |
Anode Active Material And The Secondary Battery Comprising The Same App 20130302680 - LIM; SooHyun ;   et al. | 2013-11-14 |
Electrode Active Material Containing Polydopamine And Lithium Secondary Battery Including The Same App 20130302666 - PARK; Tae Jin ;   et al. | 2013-11-14 |
Moisture-limited Electrode Active Material, Moisture-limited Electrode And Lithium Secondary Battery Comprising The Same App 20130295440 - LEE; YounKyoung ;   et al. | 2013-11-07 |
Integrated circuit packaging system with stacking option and method of manufacture thereof Grant 8,378,476 - Lee , et al. February 19, 2 | 2013-02-19 |
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Integrated circuit package system with package stacking and method of manufacture thereof Grant 8,299,595 - Yoon , et al. October 30, 2 | 2012-10-30 |
Integrated Circuit Packaging System With Interposer Shield And Method Of Manufacture Thereof App 20120241921 - Lee; SeongMin ;   et al. | 2012-09-27 |
Integrated circuit packaging system with interposer Grant 8,227,925 - Song , et al. July 24, 2 | 2012-07-24 |
Integrated Circuit Packaging System With Interposer App 20120146243 - Song; Sungmin ;   et al. | 2012-06-14 |
Mountable integrated circuit package system with substrate having a conductor-free recess Grant 8,129,832 - Carson , et al. March 6, 2 | 2012-03-06 |
Integrated circuit package system and method of package stacking Grant 8,130,512 - Yoon , et al. March 6, 2 | 2012-03-06 |
Integrated circuit packaging system with interposer Grant 8,124,451 - Song , et al. February 28, 2 | 2012-02-28 |
Voice Coil Motor App 20120025633 - Lee; Seongmin ;   et al. | 2012-02-02 |
Voice Coil Motor, Coil Block For Voice Coil Motor, Method Of Manufacturing The Coil Block, And Voice Coil Motor Having The Coil Block App 20120008220 - Lee; Seongmin ;   et al. | 2012-01-12 |
Voice Coil Motor App 20110291495 - LEE; SEONGMIN ;   et al. | 2011-12-01 |
Stacked integrated circuit package system and method for manufacturing thereof Grant 8,067,268 - Carson , et al. November 29, 2 | 2011-11-29 |
Integrated circuit package system with heat slug Grant 8,035,237 - Lee , et al. October 11, 2 | 2011-10-11 |
Integrated Circuit Packaging System With Stacking Option And Method Of Manufacture Thereof App 20110233747 - Lee; SeongMin ;   et al. | 2011-09-29 |
Integrated Circuit Package System With Package Stacking And Method Of Manufacture Thereof App 20110227209 - Yoon; In Sang ;   et al. | 2011-09-22 |
Voice Coil Motor App 20110121666 - Park; Sangok ;   et al. | 2011-05-26 |
Integrated Circuit Package Stacking System With Redistribution And Method Of Manufacture Thereof App 20100314741 - Lee; SeongMin ;   et al. | 2010-12-16 |
Stacked Integrated Circuit Package System And Method For Manufacturing Thereof App 20100224979 - Carson; Flynn ;   et al. | 2010-09-09 |
Stacked integrated circuit package system Grant 7,750,454 - Carson , et al. July 6, 2 | 2010-07-06 |
Integrated circuit package system with stacking module Grant 7,741,154 - Ha , et al. June 22, 2 | 2010-06-22 |
Integrated Circuit Package System And Method Of Package Stacking App 20100123233 - Yoon; In Sang ;   et al. | 2010-05-20 |
Mountable integrated circuit package-in-package system with adhesive spacing structures Grant 7,687,897 - Ha , et al. March 30, 2 | 2010-03-30 |
Stacked Integrated Circuit Package System App 20090243072 - Ha; Jong-Woo ;   et al. | 2009-10-01 |
Integrated Circuit Package System With Stacking Module App 20090243071 - Ha; Jong-Woo ;   et al. | 2009-10-01 |
Stacked Integrated Circuit Package System App 20090243073 - Carson; Flynn ;   et al. | 2009-10-01 |
Integrated Circuit Package System With Heat Slug App 20090174064 - Lee; Seongmin ;   et al. | 2009-07-09 |
Mountable Integrated Circuit Package System With Substrate Having A Conductor-free Recess App 20090108428 - Carson; Flynn ;   et al. | 2009-04-30 |
Multichip package system Grant 7,521,297 - Lee , et al. April 21, 2 | 2009-04-21 |
Integrated circuit package system with heat slug Grant 7,517,729 - Lee , et al. April 14, 2 | 2009-04-14 |
Integrated Circuit Packaging System With Interposer App 20090079091 - Song; Sungmin ;   et al. | 2009-03-26 |
Stacked integrated circuit package-in-package system Grant 7,482,203 - Song , et al. January 27, 2 | 2009-01-27 |
Mountable Integrated Circuit Package-in-package System With Adhesive Spacing Structures App 20080157319 - Ha; Jong-Woo ;   et al. | 2008-07-03 |
Stacked integrated circuit package-in-package system App 20080105965 - Song; Sungmin ;   et al. | 2008-05-08 |
Stacked integrated circuit package-in-package system Grant 7,312,519 - Song , et al. December 25, 2 | 2007-12-25 |
Stacked integrated circuit package-in-package system with recessed spacer Grant 7,298,037 - Yim , et al. November 20, 2 | 2007-11-20 |
Multichip Package System App 20070216007 - Lee; SeongMin ;   et al. | 2007-09-20 |
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Stacked integrated circuit package-in-package system App 20070158810 - Song; Sungmin ;   et al. | 2007-07-12 |
Catalytic oxidation of C--H bonds Grant 7,196,191 - Fuchs , et al. March 27, 2 | 2007-03-27 |
Encapsulation method for semiconductor device having center pad App 20060192275 - Lee; Seongmin ;   et al. | 2006-08-31 |
Integrated Circuit Package System With Heat Slug App 20060103009 - Lee; Seongmin ;   et al. | 2006-05-18 |
Catalytic oxidation of C-H bonds App 20040087820 - Fuchs, Philip ;   et al. | 2004-05-06 |