LEE; SEOKHYUN

Patent Applications and Registrations

Patent applications and USPTO patent grants for LEE; SEOKHYUN.The latest application filed is for "semiconductor package".

Company Profile

31.32.61

LEE; SEOKHYUN - Hwaseong-si KR
Lee; Seokhyun - Seoul KR
Lee; Seokhyun - Daejeon KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package App 20220310577 - LEE; DOOHWAN ; et al.	2022-09-29
Semiconductor package Grant 11,456,241 - Lee , et al. September 27, 2	2022-09-27
Semiconductor Package App 20220302002 - Kim; Dongkyu ; et al.	2022-09-22
Semiconductor Package Including Redistribution Substrate App 20220285328 - KIM; DONGKYU ; et al.	2022-09-08
Redistribution Substrate And Semiconductor Package Including The Same App 20220270959 - LEE; SEOKHYUN ; et al.	2022-08-25
Video Decoding Apparatus And Video Decoding Method App 20220224927 - Lee; Seokhyun ; et al.	2022-07-14
Display Module Package App 20220199880 - Kim; Dahye ; et al.	2022-06-23
Redistribution substrate having redistribution pattern including via seed patterns covering bottom surface and sidewall surface of wiring conductive patterns and semiconductor package including the same Grant 11,348,864 - Lee , et al. May 31, 2	2022-05-31
Semiconductor package and method of fabricating the same Grant 11,348,876 - Suk , et al. May 31, 2	2022-05-31
Semiconductor Package With Redistribution Substrate App 20220157810 - SUK; Kyoung Lim ; et al.	2022-05-19
Semiconductor Packages App 20220130685 - Lee; Seokhyun ; et al.	2022-04-28
Semiconductor Package App 20220102282 - SUK; KYOUNG LIM ; et al.	2022-03-31
Display module package Grant 11,282,995 - Kim , et al. March 22, 2	2022-03-22
Semiconductor Package Device App 20220084993 - KIM; DONGKYU ; et al.	2022-03-17
Semiconductor Package And Method Of Fabricating The Same App 20220077041 - JEON; Gwangjae ; et al.	2022-03-10
Semiconductor Package App 20220077048 - Suk; Kyoung Lim ; et al.	2022-03-10
Semiconductor Package App 20220077066 - KIM; Jongyoun ; et al.	2022-03-10
Semiconductor Package And Method Of Fabricating The Same App 20220077007 - KIM; MINJUNG ; et al.	2022-03-10
Strip Cutting Apparatus For Diagnostic Reagent Kit App 20220063951 - LEE; SEOKHYUN	2022-03-03
Semiconductor Package App 20220037294 - HWANG; HYEONJEONG ; et al.	2022-02-03
Semiconductor Package And Method Of Manufacturing The Same App 20210407940 - Kim; Jongyoun ; et al.	2021-12-30
Semiconductor Pacakge App 20210398890 - KIM; DONGKYU ; et al.	2021-12-23
Semiconductor package and method of manufacturing the same Grant 11,145,611 - Kim , et al. October 12, 2	2021-10-12
Method Of Manufacturing Redistribution Substrate App 20210296163 - LEE; Seokhyun	2021-09-23
Semiconductor package and method of manufacturing the semiconductor package Grant 11,094,636 - Jang , et al. August 17, 2	2021-08-17
Redistribution substrate, method of manufacturing the same, and semiconductor package including the same Grant 11,075,149 - Lee July 27, 2	2021-07-27
Method of manufacturing fan-out wafer level package Grant 11,056,461 - Jang , et al. July 6, 2	2021-07-06
Semiconductor Package And Method Of Fabricating The Same App 20210193636 - SUK; KYOUNG LIM ; et al.	2021-06-24
Redistribution Substrate, Method Of Fabricating The Same, And Semiconductor Package Including The Same App 20210183766 - Kim; Jongyoun ; et al.	2021-06-17
Method of fabricating semiconductor package Grant 11,018,108 - Min , et al. May 25, 2	2021-05-25
Redistribution Substrate And Semiconductor Package Including The Same App 20210118788 - LEE; SEOKHYUN ; et al.	2021-04-22
Semiconductor Package App 20210111114 - LEE; Seokhyun ; et al.	2021-04-15
Semiconductor Package And Method Of Fabricating The Same App 20210111128 - SUK; KYOUNG LIM ; et al.	2021-04-15
Semiconductor package and method of fabricating the same Grant 10,964,643 - Suk , et al. March 30, 2	2021-03-30
Redistribution substrate, method of fabricating the same, and semiconductor package including the same Grant 10,950,539 - Kim , et al. March 16, 2	2021-03-16
Semiconductor Package And Method Of Manufacturing The Same App 20210074754 - JANG; JAEGWON ; et al.	2021-03-11
Display Module Package App 20210066560 - Kim; Dahye ; et al.	2021-03-04
Semiconductor package and method of fabricating the same Grant 10,930,625 - Suk , et al. February 23, 2	2021-02-23
Semiconductor device Grant 10,923,407 - Kim , et al. February 16, 2	2021-02-16
Method Of Manufacturing Fan-out Wafer Level Package App 20210020600 - JANG; Yeonho ; et al.	2021-01-21
Method Of Manufacturing A Semiconductor Package App 20210020505 - Jang; Jaegwon ; et al.	2021-01-21
Semiconductor Package And Method Of Manufacturing The Same App 20200411458 - Kim; Jongyoun ; et al.	2020-12-31
Semiconductor package and method of manufacturing the same Grant 10,879,292 - Jang , et al. December 29, 2	2020-12-29
Semiconductor package and method of fabricating the same Grant 10,879,187 - Suk , et al. December 29, 2	2020-12-29
Electro-luminescent display device with improved contact structure Grant 10,861,927 - Park , et al. December 8, 2	2020-12-08
Semiconductor Package And Method Of Manufacturing The Semiconductor Package App 20200373243 - JANG; Jaegwon ; et al.	2020-11-26
Method Of Fabricating Semiconductor Package App 20200328175 - Min; Youn Ji ; et al.	2020-10-15
Semiconductor package, package-on-package device, and method of fabricating the same Grant 10,756,015 - Lee , et al. A	2020-08-25
Redistribution Substrate, Method Of Manufacturing The Same, And Semiconductor Package Including The Same App 20200266136 - LEE; Seokhyun	2020-08-20
Method of fabricating semiconductor package Grant 10,741,518 - Min , et al. A	2020-08-11
Semiconductor package having redistribution pattern and passivation patterns and method of fabricating the same Grant 10,685,890 - Kim , et al.	2020-06-16
Semiconductor Package, Package-on-package Device, And Method Of Fabricating The Same App 20200111738 - Lee; Seokhyun ; et al.	2020-04-09
Semiconductor Package And Method Of Fabricating The Same App 20200098694 - SUK; Kyoung Lim ; et al.	2020-03-26
Method Of Fabricating Semiconductor Package App 20200098716 - MIN; Youn Ji ; et al.	2020-03-26
Redistribution Substrate, Method Of Fabricating The Same, And Semiconductor Package Including The Same App 20200091066 - KIM; Jongyoun ; et al.	2020-03-19
Semiconductor Package And Method Of Manufacturing The Same App 20200091215 - JANG; JAEGWON ; et al.	2020-03-19
Semiconductor Package And Method Of Fabricating The Same App 20200083201 - SUK; KYOUNG LIM ; et al.	2020-03-12
Method of fabricating semiconductor package Grant 10,546,829 - Min , et al. Ja	2020-01-28
Semiconductor package, package-on-package device, and method of fabricating the same Grant 10,541,201 - Lee , et al. Ja	2020-01-21
Semiconductor package and method of fabricating the same Grant 10,522,471 - Suk , et al. Dec	2019-12-31
Semiconductor Package, Package-on-package Device, And Method Of Fabricating The Same App 20190378795 - LEE; Seokhyun ; et al.	2019-12-12
Electro-luminescent Display Device With Improved Contact Structure App 20190326382 - Park; SangMoo ; et al.	2019-10-24
Semiconductor Package Having Redistribution Pattern And Passivation Patterns And Method Of Fabricating The Same App 20190181064 - Kim; Jongyoun ; et al.	2019-06-13
Semiconductor package having redistribution pattern and passivation patterns and method of fabricating the same Grant 10,319,650 - Kim , et al.	2019-06-11
Semiconductor Package And Method Of Fabricating The Same App 20190051607 - SUK; Kyoung Lim ; et al.	2019-02-14
Method Of Fabricating Semiconductor Package App 20190035756 - MIN; YOUN JI ; et al.	2019-01-31
Semiconductor Package And Method Of Fabricating The Same App 20180366411 - SUK; KYOUNG LIM ; et al.	2018-12-20
Semiconductor Package And Method Of Fabricating Redistribution Pattern App 20180076123 - KIM; Jongyoun ; et al.	2018-03-15
Semiconductor Device App 20170294360 - KIM; Sundae ; et al.	2017-10-12
Semiconductor device having a peripheral-region defect detection structure Grant 9,716,048 - Kim , et al. July 25, 2	2017-07-25
Semiconductor package and method of fabricating the same Grant 9,640,513 - Lee , et al. May 2, 2	2017-05-02
Semiconductor Device App 20160233171 - KIM; Sundae ; et al.	2016-08-11
Apparatus and method of attaching solder ball and method of fabricating semiconductor package including solder ball Grant 9,364,914 - Lee , et al. June 14, 2	2016-06-14
Semiconductor package devices Grant 9,343,437 - Jang , et al. May 17, 2	2016-05-17
Semiconductor Package And Method Of Fabricating The Same App 20160005714 - LEE; SEOKHYUN ; et al.	2016-01-07
Methods of fabricating fan-out wafer level packages and packages formed by the methods Grant 9,202,716 - Park , et al. December 1, 2	2015-12-01
Semiconductor Package Devices App 20150318266 - Jang; Ae-nee ; et al.	2015-11-05
Method and apparatus for stacked semiconductor chips Grant 9,087,883 - Lee , et al. July 21, 2	2015-07-21
Apparatus And Method Of Attaching Solder Ball And Method Of Fabricating Semiconductor Package Including Solder Ball App 20150125999 - LEE; Seokhyun ; et al.	2015-05-07
Method And Apparatus For Stacked Semiconductor Chips App 20150031170 - Lee; SeokHyun ; et al.	2015-01-29
Apparatus for stacked semiconductor chips Grant 8,890,333 - Lee , et al. November 18, 2	2014-11-18
Method And Apparatus For Stacked Semiconductor Chips App 20140008818 - Lee; SeokHyun ; et al.	2014-01-09
Semiconductor Package And Method Of Forming The Same App 20130295725 - PARK; Jin-Woo ; et al.	2013-11-07
Methods Of Fabricating Fan-out Wafer Level Packages And Packages Formed By The Methods App 20130147063 - PARK; Jin-Woo ; et al.	2013-06-13
Quay-wall System For Loading And Unloading Containers, Mobile Harbor And Transporting Device For Use Therein App 20110150606 - Lee; Tae-Eog ; et al.	2011-06-23

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