Lee; Seh-kwang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Seh-kwang.The latest application filed is for "chemical mechanical polishing method, method of manufacturing semiconductor device, and semiconductor manufacturing apparatus".

Company Profile

4.12.13

Lee; Seh-kwang - Yongin-si KR
Lee; Seh Kwang - Gyeonggi-do N/A KR
Lee; Seh-Kwang - Kyunggido KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Preparing conditioning disk for chemical mechanical polishing and chemical mechanical polishing method including the same Grant 10,525,566 - Hong , et al. J	2020-01-07
Scribing wheel having fine structure recess Grant 10,358,375 - Jeon , et al. July 23, 2	2019-07-23
CMP pad conditioner Grant 10,166,653 - Lee , et al. J	2019-01-01
Chemical Mechanical Polishing Method, Method Of Manufacturing Semiconductor Device, And Semiconductor Manufacturing Apparatus App 20180104792 - HONG; Myung-ki ; et al.	2018-04-19
Method for manufacturing an electrodeposited diamond wire saw using patterned non-conductive materials Grant 9,776,306 - Lee , et al. October 3, 2	2017-10-03
CMP apparatus Grant 9,421,668 - Lee , et al. August 23, 2	2016-08-23
CMP pad conditioner, and method for producing the CMP pad conditioner Grant 9,314,901 - Lee , et al. April 19, 2	2016-04-19
Scribing Wheel Having Fine Structure Recess App 20150175470 - Jeon; Chang Ho ; et al.	2015-06-25
Cmp Apparatus App 20150140900 - Lee; Seh Kwang ; et al.	2015-05-21
Method For Manufacturing An Electrodeposited Diamond Wire Saw Using Patterned Non-conductive Materials App 20140246005 - Lee; Seh-Kwang ; et al.	2014-09-04
Cmp Pad Conditioner App 20140154960 - Lee; Seh Kwang ; et al.	2014-06-05
Pad Conditioning and Wafer Retaining Ring and Manufacturing Method Thereof App 20140154956 - LEE; Seh Kwang ; et al.	2014-06-05
Cmp Pad Conditioner, And Method For Producing The Cmp Pad Conditioner App 20140094101 - Lee; Seh Kwang ; et al.	2014-04-03
Conditioner For Soft Pad And Method For Manufacturing Same App 20130344779 - Lee; Seh Kwang ; et al.	2013-12-26
Microreactors Grant 8,187,553 - Lee May 29, 2	2012-05-29
Microreactors App 20110259834 - LEE; Seh Kwang	2011-10-27
Collimated and long throw magnetron sputtering of nickel/iron films for magnetic recording head applications Grant 7,294,242 - Hashim , et al. November 13, 2	2007-11-13

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