Lee; Sang S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Sang S..The latest application filed is for "method for creating on-package inductors for use with integrated circuits".

Company Profile

0.16.0

Lee; Sang S. - Sunnyvale CA
Lee; Sang S. - Suwon KR
Lee; Sang S. - Dong-ku KR
Lee; Sang S. - Kyungki-Do KR
Lee; Sang S. - Chungnam KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for creating on-package inductors for use with integrated circuits Grant 5,839,184 - Ho , et al. November 24, 1	1998-11-24
Multi-layered, integrated circuit package having reduced parasitic noise characteristics Grant 5,641,988 - Huang , et al. June 24, 1	1997-06-24
Multi-layered, integrated circuit package having reduced parasitic noise characteristics Grant 5,625,225 - Huang , et al. April 29, 1	1997-04-29
Electrically and thermally enhanced package using a separate silicon substrate Grant 5,598,031 - Groover , et al. January 28, 1	1997-01-28
Video signal selection circuit Grant 5,572,263 - Kim , et al. November 5, 1	1996-11-05
Method for controlling a muscial medley function in a karaoke television Grant 5,510,573 - Cho , et al. April 23, 1	1996-04-23
Musical medley function controlling method in a televison with a video/accompaniment-music player Grant 5,486,645 - Suh , et al. January 23, 1	1996-01-23
Chip type capacitor for removing radio frequency noise Grant 5,450,278 - Lee , et al. September 12, 1	1995-09-12
Method of forming molded plastic packages with integrated heat sinks Grant 5,441,684 - Lee August 15, 1	1995-08-15
Plastic encapsulated integrated circuit package having an embedded thermal dissipator Grant 5,430,331 - Hamzehdoost , et al. July 4, 1	1995-07-04
Design for encapsulation of thermally enhanced integrated circuits Grant 5,379,187 - Lee , et al. January 3, 1	1995-01-03
Lead frame assembly and method for wiring same Grant 5,359,227 - Liang , et al. October 25, 1	1994-10-25
Integrated circuit package having an interposer Grant 5,332,864 - Liang , et al. July 26, 1	1994-07-26
Lead frame assembly and method for wiring same Grant 5,296,744 - Liang , et al. March 22, 1	1994-03-22
Method of fingerprint verification Grant 5,105,467 - Kim , et al. April 14, 1	1992-04-14
Transport device for wafers of variable diameter Grant 4,971,512 - Lee , et al. November 20, 1	1990-11-20

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