Lee; Sang-Heui

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Sang-Heui.The latest application filed is for "test pad structure, a pad structure for inspecting a semiconductor chip and a wiring substrate for a tape packaging having the same".

Company Profile

0.4.8

Lee; Sang-Heui - Cheonan-si KR
LEE; Sang-Heui - Chungcheongnam-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring substrate for a tape packaging having the same Grant 9,869,717 - Lim , et al. January 16, 2	2018-01-16
Test Pad Structure, A Pad Structure For Inspecting A Semiconductor Chip And A Wiring Substrate For A Tape Packaging Having The Same App 20160334463 - LIM; So-Young ; et al.	2016-11-17
Semiconductor chip and film and tab package comprising the chip and film Grant 8,952,510 - Cho , et al. February 10, 2	2015-02-10
Semiconductor Chip And Film And Tab Package Comprising The Chip And Film App 20140084430 - Cho; Young-Sang ; et al.	2014-03-27
Test Pad Structure, A Pad Structure For Inspecting A Semiconductor Chip And A Wiring Substrate For A Tape Package Having The Same App 20130127486 - LIM; So-Young ; et al.	2013-05-23
Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same Grant 8,222,089 - Choi , et al. July 17, 2	2012-07-17
Tape For Heat Dissipating Member, Chip On Film Type Semiconductor Package Including Heat Dissipating Member, And Electronic Apparatus Including The Same App 20110143625 - Choi; Kyoung-sei ; et al.	2011-06-16
Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same Grant 7,915,727 - Choi , et al. March 29, 2	2011-03-29
Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring subtrate for a tape package having the same App 20090322362 - Lim; So-Young ; et al.	2009-12-31
Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and elctronic apparatus including the same App 20090273076 - CHOI; Kyong-sei ; et al.	2009-11-05
Semiconductor Chip Having Bumps Of Different Heights And Semiconductor Package Including The Same App 20080119061 - HWANG; Ji-hwan ; et al.	2008-05-22
Pattern Film, Method Of Manufacturing The Pattern Film, And Printed Circuit Board And Semiconductor Package Having The Pattern Film App 20080111254 - PARK; Ji-Yong ; et al.	2008-05-15

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