Lee; Sa-Yong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Sa-Yong.The latest application filed is for "printed circuit board".

Company Profile

11.9.32

Lee; Sa-Yong - Suwon-si KR
Lee; Sa Yong - Suwon KR
Lee; Sa Yong - Gyunggi-do KR
Lee; Sa Yong - Raleigh NC

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Flexible printed circuit board with embedded electronic element Grant 11,430,737 - Ham , et al. August 30, 2	2022-08-30
Printed circuit board Grant 11,013,114 - Kang , et al. May 18, 2	2021-05-18
Coil electronic component Grant 10,902,994 - Kim , et al. January 26, 2	2021-01-26
Inductor and method of manufacturing the same Grant 10,847,300 - Choi , et al. November 24, 2	2020-11-24
Printed Circuit Board App 20200176386 - HAM; Ho-Hyung ; et al.	2020-06-04
Printed Circuit Board App 20200170110 - KANG; Seon-Ha ; et al.	2020-05-28
Printed Circuit Board App 20200163228 - LEE; Sa-Yong ; et al.	2020-05-21
Coil electronic component and method of manufacturing the same Grant 10,636,562 - Kim , et al.	2020-04-28
Magnetic Substrate And Method Of Manufacturing The Same, Bonding Structure Between Magnetic Substrate And Insulating Material, A App 20200090848 - LEE; Sa Yong ; et al.	2020-03-19
Inductor And Manufacturing Method Thereof App 20190318867 - LEE; Sa Yong ; et al.	2019-10-17
Coil Component App 20190267182 - LEE; Sa Yong ; et al.	2019-08-29
Coil Electronic Component App 20190122808 - JO; Dae Hui ; et al.	2019-04-25
Coil Electronic Component App 20190115145 - KIM; Chi Seong ; et al.	2019-04-18
Inductor And Method Of Manufacturing The Same App 20180130595 - Choi; Jung Woo ; et al.	2018-05-10
Coil Electronic Component And Method Of Manufacturing The Same App 20180122557 - KIM; Ki Seok ; et al.	2018-05-03
Coil component and method of manufacturing the same Grant 9,899,136 - Lee , et al. February 20, 2	2018-02-20
Coil Component And Method Of Manufacturing The Same App 20170330674 - LEE; Sa Yong ; et al.	2017-11-16
Coil Component App 20170148562 - LEE; Sa Yong ; et al.	2017-05-25
Prepreg, Printed Circuit Board Including Prepreg, And Method Of Fabricating The Same App 20170086290 - LEE; Keun-Yong ; et al.	2017-03-23
Printed circuit board and method of manufacturing the same Grant 9,288,902 - Kim , et al. March 15, 2	2016-03-15
Common mode filter Grant 9,236,177 - Yang , et al. January 12, 2	2016-01-12
Multilayer inductor and method for manufacturing the same Grant 9,035,738 - Lee , et al. May 19, 2	2015-05-19
Core Substrate And Method For Manufacturing The Same App 20150114696 - Hong; Jin Ho ; et al.	2015-04-30
Core Substrate And Method For Manufacturing The Same App 20150114691 - HONG; Jin Ho ; et al.	2015-04-30
Common Mode Filter App 20150102886 - Yang; Ju-Hwan ; et al.	2015-04-16
Prepreg For Printed Circuit Board, Manufacturing Method Thereof, And Printed Circuit Board Including The Same App 20150104630 - Moon; Jin Seok ; et al.	2015-04-16
Magnetic Substrate And Method Of Manufacturing The Same, Bonding Structure Between Magnetic Substrate And Insulating Material, And Chip Component Having The Bonding Structure App 20150097647 - Lee; Sa Yong ; et al.	2015-04-09
Copper Clad Laminate For Printed Circuit Board And Manufacturing Method Thereof App 20150060115 - Lee; Sa Yong ; et al.	2015-03-05
Printed Circuit Board And Method Of Manufacturing The Same App 20150053457 - KIM; SUNG HAN ; et al.	2015-02-26
Printed Circuit Board And Method Of Manufacturing The Same App 20150053469 - Kim; Eun Sil ; et al.	2015-02-26
Core Substrate And Method Of Manufacturing The Same App 20150050504 - Lee; Sa Yong ; et al.	2015-02-19
Inorganic Filler, And Insulating Resin Composition, Insulating Film, Prepreg And Printed Circuit Board Including The Same App 20150027763 - HONG; Jin Ho ; et al.	2015-01-29
Resin Composition For Printed Circuit Board, Insulating Film, Prepreg And Printed Circuit Board App 20140154479 - Yun; Geum Hee ; et al.	2014-06-05
Multilayer Inductor And Method For Manufacturing The Same App 20140145812 - LEE; Sa Yong ; et al.	2014-05-29
Copper-clad Laminate. Method For Manufacturing The Same, And Printed Circuit Board Including The Same App 20140127483 - Moon; Jin Seok ; et al.	2014-05-08
Resin Composition For Insulation, Insulating Film, Prepreg, And Printed Circuit Board. App 20140080940 - Lee; Sa Yong ; et al.	2014-03-20
Epoxy Resin Composition For Insulation, Insulating Film, Prepreg, And Printed Circuit Board App 20140076198 - Kim; Jin Young ; et al.	2014-03-20
Insulating Composition For Multilayer Printed Circuit Board, Method For Preparing The Same, And Multilayer Printed Circuit Board Comprising The Same As Insulating Layer App 20140080941 - LEE; Sa Yong ; et al.	2014-03-20
Insulating Epoxy Resin Composition, Insulating Film Manufactured Therefrom, And Multilayer Printed Circuit Board Having The Same App 20130337268 - Jeon; Kee Su ; et al.	2013-12-19
Carbohydrate-gypsum composite App 20090178591 - Pawlak; Joel J. ; et al.	2009-07-16

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