Lee; Rong-Shen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Rong-Shen.The latest application filed is for "package structure".
- Lee; Rong-Shen - Hsinchu County TW
- Lee; Rong-Shen - Hsinchu TW
- LEE; Rong-Shen - Zhubei City TW
- Lee; Rong-Shen - Hsin-chu TW
- Lee; Rong-Shen - Chupei TW
- Lee, Rong-Shen - Chupei City TW
| Patent | Date |
|---|---|
| Package Structure App 20160043239 - Chang; Hsiang-Hung ; et al. | 2016-02-11 |
| Wafer-to-wafer stack with supporting post Grant 9,111,774 - Chang , et al. August 18, 2 | 2015-08-18 |
| Conductive Via Structure, Package Structure, And Package Of Photosensitive Device App 20150097259 - CHANG; Hsiang-Hung ; et al. | 2015-04-09 |
| Wafer-to-wafer stack with supporting pedestal Grant 8,810,031 - Chang , et al. August 19, 2 | 2014-08-19 |
| Wafer-to-wafer Stack With Supporting Post App 20130161829 - CHANG; Chi-Shih ; et al. | 2013-06-27 |
| Electrode Connection Structure Of Speaker Unit App 20120321108 - Lin; Yu-Min ; et al. | 2012-12-20 |
| Electrode connection structure of speaker unit Grant 8,280,081 - Lin , et al. October 2, 2 | 2012-10-02 |
| Assembly structure of a flat speaker Grant 8,243,966 - Lin , et al. August 14, 2 | 2012-08-14 |
| Wafer-to-wafer Stack With Supporting Pedestal App 20120178212 - Chang; Chi-Shih ; et al. | 2012-07-12 |
| Wafer-to-wafer stack with supporting pedestal Grant 8,164,165 - Chang , et al. April 24, 2 | 2012-04-24 |
| Wafer-to-wafer Stack With Supporting Pedestal App 20110156249 - Chang; Chi-Shih ; et al. | 2011-06-30 |
| Wafer-to-wafer stacking Grant 7,948,072 - Tain , et al. May 24, 2 | 2011-05-24 |
| Assembly Structure Of A Flat Speaker App 20100158284 - Lin; Yu-Min ; et al. | 2010-06-24 |
| Electrode Connection Structure Of Speaker Unit App 20100034402 - Lin; Yu-Min ; et al. | 2010-02-11 |
| Wafer-To-Wafer Stacking App 20100020502 - Tain; Ra-Min ; et al. | 2010-01-28 |
| Wafer-to-wafer stack with supporting pedestal App 20070090490 - Chang; Chi-Shih ; et al. | 2007-04-26 |
| Stacked semiconductor package formed on a substrate and method for fabrication Grant 6,590,282 - Wang , et al. July 8, 2 | 2003-07-08 |
| One-step bumping/bonding method for forming semiconductor packages Grant 6,536,653 - Wang , et al. March 25, 2 | 2003-03-25 |
| One-step semiconductor stack packaging method Grant 6,479,321 - Wang , et al. November 12, 2 | 2002-11-12 |
| Electronic substrate having an aperture position through a substrate, conductive pads, and an insulating layer Grant 6,459,150 - Wu , et al. October 1, 2 | 2002-10-01 |
| One-step Semiconductor Stack Packaging Method App 20020137255 - Wang, Hsing-Seng ; et al. | 2002-09-26 |
| One-step bumping/bonding method for forming semiconductor packages App 20020092894 - Wang, Hsing-Seng ; et al. | 2002-07-18 |
| Thermally and electrically enhanced PBGA package Grant 5,977,626 - Wang , et al. November 2, 1 | 1999-11-02 |
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