loadpatents
name:-0.025269031524658
name:-0.020405054092407
name:-0.0012738704681396
Lee; Peter Wai-Man Patent Filings

Lee; Peter Wai-Man

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Peter Wai-Man.The latest application filed is for "long-period grating device and tunable gain flattening filter having same".

Company Profile
0.16.16
  • Lee; Peter Wai-Man - Hong Kong HK
  • Lee; Peter Wai-Man - San Jose CA
  • Lee; Peter Wai-Man - Fremont CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Long-period Grating Device And Tunable Gain Flattening Filter Having Same
App 20160223744 - Hoo; Yeuk Lai ;   et al.
2016-08-04
Reusable Long Period Microfiber Grating for detection of DNA Hybridization
App 20150353996 - HOO; Yeuk Lai ;   et al.
2015-12-10
Durable, Germicide-Free and Antibacterial Coating
App 20140242363 - HUEN; Ngar Yee ;   et al.
2014-08-28
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)
Grant 7,745,328 - Yim , et al. June 29, 2
2010-06-29
Low Dielectric (low K) Barrier Films With Oxygen Doping By Plasma-enhanced Chemical Vapor Deposition (pecvd)
App 20090053902 - Yim; Kang Sub ;   et al.
2009-02-26
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)
Grant 7,465,659 - Yim , et al. December 16, 2
2008-12-16
Adhesion improvement for low k dielectrics
Grant 7,459,404 - Li , et al. December 2, 2
2008-12-02
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)
Grant 7,157,384 - Yim , et al. January 2, 2
2007-01-02
CVD plasma assisted lower dielectric constant SICOH film
Grant 7,153,787 - Cho , et al. December 26, 2
2006-12-26
New Low Dielectric (low K) Barrier Films With Oxygen Doping By Plasma-enhanced Chemical Vapor Deposition (pecvd)
App 20060246737 - Yim; Kang Sub ;   et al.
2006-11-02
Adhesion improvement for low k dielectrics
App 20060189162 - Huang; Lihua Li ;   et al.
2006-08-24
Adhesion improvement for low k dielectrics
Grant 7,030,041 - Li , et al. April 18, 2
2006-04-18
Substrate heater assembly
Grant 7,024,105 - Fodor , et al. April 4, 2
2006-04-04
Adhesion improvement for low k dielectrics
App 20050202685 - Huang, Lihua Li ;   et al.
2005-09-15
CVD plasma assisted lower dielectric constant SICOH film
Grant 6,943,127 - Cho , et al. September 13, 2
2005-09-13
CVD plasma assisted lower dielectric constant sicoh film
App 20050153572 - Cho, Seon-Mee ;   et al.
2005-07-14
Methods of reducing plasma-induced damage for advanced plasma CVD dielectrics
Grant 6,911,403 - Li , et al. June 28, 2
2005-06-28
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)
App 20050130440 - Yim, Kang Sub ;   et al.
2005-06-16
Substrate heater assembly
App 20050078953 - Fodor, Mark A. ;   et al.
2005-04-14
Methods of reducing plasma-induced damage for advanced plasma CVD dielectrics
App 20050042885 - Li, Lihua ;   et al.
2005-02-24
Method for producing semiconductor including forming a layer containing at least silicon carbide and forming a second layer containing at least silicon oxygen carbide
Grant 6,838,393 - Yim , et al. January 4, 2
2005-01-04
Method for depositing a low-k material having a controlled thickness range
App 20040161536 - Lang, Chi-I ;   et al.
2004-08-19
Plasma enhanced chemical vapor deposition of copolymer of parylene N and comonomers with various double bonds
Grant 6,709,715 - Lang , et al. March 23, 2
2004-03-23
Method and apparatus for forming a thin polymer layer on an integrated circuit structure
Grant 6,663,713 - Robles , et al. December 16, 2
2003-12-16
Reacting an organosilicon compound with an oxidizing gas to form an ultra low k dielectric
App 20030211244 - Li, Lihua ;   et al.
2003-11-13
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (pecvd)
App 20030139035 - Yim, Kang Sub ;   et al.
2003-07-24
CVD plasma assisted lower dielectric constant sicoh film
App 20030104708 - Cho, Seon-Mee ;   et al.
2003-06-05
Cvd Plasma Assisted Lower Dielectric Constant Sicoh Film
App 20030003768 - Cho, Seon-Mee ;   et al.
2003-01-02
CVD plasma assisted lower dielectric constant sicoh film
Grant 6,486,082 - Cho , et al. November 26, 2
2002-11-26
Method for depositing low dielectric constant oxide films
Grant 6,149,987 - Perng , et al. November 21, 2
2000-11-21
Chemical vapor deposition of a copolymer of p-xylylene and a multivinyl silicon/oxygen comonomer
Grant 6,086,952 - Lang , et al. July 11, 2
2000-07-11
Gas distribution for CVD systems
Grant 5,792,269 - Deacon , et al. August 11, 1
1998-08-11

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