Lee; Peng-Hsin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Peng-Hsin.The latest application filed is for "package structures".
- Lee; Peng-Hsin - Taoyuan TW
- LEE; Peng-Hsin - Taoyuan City TW
- Lee; Peng-Hsin - Kuei San TW
- Lee; Peng-Hsin - Taoyuan Hsien TW
- Lee; Peng Hsin - Taoyuan County TW
| Patent | Date |
|---|---|
| Package structures Grant 11,315,857 - Lee April 26, 2 | 2022-04-26 |
| Chip packaging with multilayer conductive circuit Grant 11,189,555 - Lee November 30, 2 | 2021-11-30 |
| Package Structures App 20210249339 - LEE; Peng-Hsin | 2021-08-12 |
| Package Structures App 20210249338 - LEE; Peng-Hsin | 2021-08-12 |
| Manufacturing method of packaging device Grant 11,049,796 - Tsai , et al. June 29, 2 | 2021-06-29 |
| Package structures Grant 10,892,210 - Tsai , et al. January 12, 2 | 2021-01-12 |
| Manufacturing Method Of Packaging Device App 20200251405 - Kind Code | 2020-08-06 |
| Semiconductor Device App 20200243434 - LEE; Peng-Hsin | 2020-07-30 |
| Package Structure And Forming Method Of The Same App 20200243430 - LEE; Peng-Hsin | 2020-07-30 |
| Packaging device and manufacturing method thereof Grant 10,685,904 - Tsai , et al. | 2020-06-16 |
| Interconnection structure having a via structure and fabrication thereof Grant 10,424,508 - Tsai , et al. Sept | 2019-09-24 |
| Power module package having patterned insulation metal substrate Grant 10,056,319 - Lee , et al. August 21, 2 | 2018-08-21 |
| Package Structures App 20180096921 - TSAI; Hsin-Chang ; et al. | 2018-04-05 |
| Power module package having patterned insulation metal substrate Grant 9,905,439 - Tsai , et al. February 27, 2 | 2018-02-27 |
| Power module package having patterned insulation metal substrate Grant 9,865,531 - Tsai , et al. January 9, 2 | 2018-01-09 |
| Package structure Grant 9,847,312 - Tsai , et al. December 19, 2 | 2017-12-19 |
| Power Module Package Having Patterned Insulation Metal Substrate App 20170317014 - TSAI; Hsin-Chang ; et al. | 2017-11-02 |
| Power Module Package Having Patterned Insulation Metal Substrate App 20170317015 - LEE; Chia-Yen ; et al. | 2017-11-02 |
| Power Module Package Having Patterned Insulation Metal Substrate App 20170316955 - TSAI; Hsin-Chang ; et al. | 2017-11-02 |
| Packaging structure Grant 9,748,165 - Tsai , et al. August 29, 2 | 2017-08-29 |
| Package Structure App 20170092570 - TSAI; Hsin-Chang ; et al. | 2017-03-30 |
| Semiconductor device Grant 9,431,327 - Tsai , et al. August 30, 2 | 2016-08-30 |
| Semiconductor component having a lateral semiconductor device and a vertical semiconductor device Grant 9,385,070 - Tsai , et al. July 5, 2 | 2016-07-05 |
| Packaging Structure App 20160172281 - TSAI; Hsin-Chang ; et al. | 2016-06-16 |
| Packaging Device And Manufacturing Method Thereof App 20160148855 - TSAI; Hsin-Chang ; et al. | 2016-05-26 |
| Method of forming interconnection structure of package structure Grant 9,275,982 - Lee , et al. March 1, 2 | 2016-03-01 |
| Interconnection structure of package structure and method of forming the same Grant 9,209,164 - Lee , et al. December 8, 2 | 2015-12-08 |
| Semiconductor Device App 20150348889 - TSAI; Hsin-Chang ; et al. | 2015-12-03 |
| Embedded packaging device Grant 9,177,957 - Lee , et al. November 3, 2 | 2015-11-03 |
| Interconnection Structure Having A Via Structure And Fabrication Thereof App 20150294910 - TSAI; Hsin-Chang ; et al. | 2015-10-15 |
| Method Of Forming Package Structure App 20150125995 - LEE; Chia-Yen ; et al. | 2015-05-07 |
| Semiconductor Component Having A Lateral Semiconductor Device And A Vertical Semiconductor Device App 20150001692 - TSAI; Hsin-Chang ; et al. | 2015-01-01 |
| Embedded Package Structure And Method For Manufacturing Thereof App 20150001727 - LEE; Chia-Yen ; et al. | 2015-01-01 |
| Embedded package structure and method for manufacturing thereof Grant 8,912,663 - Lee , et al. December 16, 2 | 2014-12-16 |
| Package Structure And Method Of Forming The Same App 20140131887 - LEE; Chia-Yen ; et al. | 2014-05-15 |
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