| Patent | Date |
|---|
Semiconductor Structure Inspection Using A High Atomic Number Material
App 20220301944 - LEE; Pei-Hsuan ; et al. | 2022-09-22 |
Interconnect Structure and Method of Forming Thereof
App 20220293528 - Chin; Shu-Cheng ; et al. | 2022-09-15 |
Package Structure And Manufacturing Method Thereof
App 20220293505 - Wu; Sung-Yueh ; et al. | 2022-09-15 |
Package structure
Grant 11,444,002 - Lai , et al. September 13, 2 | 2022-09-13 |
Selective capping processes and structures formed thereby
Grant 11,380,542 - Chi , et al. July 5, 2 | 2022-07-05 |
Integrated fan-out package and manufacturing method thereof
Grant 11,282,810 - Wan , et al. March 22, 2 | 2022-03-22 |
Package Structure
App 20220037228 - Lai; Yu-Chia ; et al. | 2022-02-03 |
Electronic Device And Manufacturing Method Thereof
App 20210351491 - Lee; Pei-Hsuan ; et al. | 2021-11-11 |
Method of forming an interconnect in a semiconductor device
Grant 11,152,258 - Lee , et al. October 19, 2 | 2021-10-19 |
Method And System For Scanning Wafer
App 20210304397 - LEE; PEI-HSUAN ; et al. | 2021-09-30 |
Wafer-level testing method and test structure thereof
Grant 11,121,046 - Lee , et al. September 14, 2 | 2021-09-14 |
Debranching Enzyme Modified Starch, The Preparing Method And Use Thereof In Hard Capsule Production
App 20210275675 - CHANG; Ruei-Jan ; et al. | 2021-09-09 |
Integrated Circuit Package and Method
App 20210265228 - Chun; Shu-Rong ; et al. | 2021-08-26 |
Nitrogen Plasma Treatment For Improving Interface Between Etch Stop Layer And Copper Interconnect
App 20210257293 - Lee; Hui ; et al. | 2021-08-19 |
Electronic device and manufacturing method thereof
Grant 11,075,439 - Lee , et al. July 27, 2 | 2021-07-27 |
Method and system for scanning wafer
Grant 11,037,289 - Lee , et al. June 15, 2 | 2021-06-15 |
Integrated circuit package and method
Grant 11,004,758 - Chun , et al. May 11, 2 | 2021-05-11 |
Method of Forming an Interconnect in a Semiconductor Device
App 20210082752 - Lee; Pei-Hsuan ; et al. | 2021-03-18 |
Overlay error and process window metrology
Grant 10,879,135 - Fang , et al. December 29, 2 | 2020-12-29 |
Selective Capping Processes and Structures Formed Thereby
App 20200402795 - Chi; Chih-Chien ; et al. | 2020-12-24 |
Integrated Circuit Package and Method
App 20200395257 - Chun; Shu-Rong ; et al. | 2020-12-17 |
Method For Forming Semiconductor Device
App 20200357693 - WU; Jung-Tang ; et al. | 2020-11-12 |
Acid resistant capsule shell composition
Grant 10,813,887 - Chang , et al. October 27, 2 | 2020-10-27 |
Integrated Fan-out Package And Manufacturing Method Thereof
App 20200335477 - Wan; Albert ; et al. | 2020-10-22 |
Selective capping processes and structures formed thereby
Grant 10,790,142 - Chi , et al. September 29, 2 | 2020-09-29 |
Selective capping processes and structures formed thereby
Grant 10,770,288 - Chi , et al. Sep | 2020-09-08 |
Method of manufacturing integrated fan-out package
Grant 10,756,052 - Wan , et al. A | 2020-08-25 |
Method for manufacturing semiconductor device and pre-clean apparatus for semiconductor device
Grant 10,727,118 - Wu , et al. | 2020-07-28 |
Integrated Circuit Package and Method
App 20200211922 - Chun; Shu-Rong ; et al. | 2020-07-02 |
Method And System For Scanning Wafer
App 20200134810 - LEE; PEI-HSUAN ; et al. | 2020-04-30 |
Overlay Error And Process Window Metrology
App 20200118893 - FANG; Shang-Wei ; et al. | 2020-04-16 |
Wafer-level Testing Method And Test Structure Thereof
App 20200043815 - LEE; PEI-HSUAN ; et al. | 2020-02-06 |
Electronic Device And Manufacturing Method Thereof
App 20200044306 - Lee; Pei-Hsuan ; et al. | 2020-02-06 |
Debranching Enzyme Modified Starch, The Preparing Method And Use Thereof In Hard Capsule Production
App 20200023064 - CHANG; Ruei-Jan ; et al. | 2020-01-23 |
Overlay error and process window metrology
Grant 10,510,623 - Fang , et al. Dec | 2019-12-17 |
Method Of Manufacturing Integrated Fan-out Package
App 20190355694 - Wan; Albert ; et al. | 2019-11-21 |
Acid Resistant Capsule Shell Composition
App 20190321301 - CHANG; RUEI-JAN ; et al. | 2019-10-24 |
Method of manufacturing integrated fan-out package
Grant 10,366,966 - Wan , et al. July 30, 2 | 2019-07-30 |
Overlay Error And Process Window Metrology
App 20190198403 - FANG; Shang-Wei ; et al. | 2019-06-27 |
Selective Capping Processes and Structures Formed Thereby
App 20190164752 - Chi; Chih-Chien ; et al. | 2019-05-30 |
Method For Manufacturing Semiconductor Device And Pre-clean Apparatus For Semiconductor Device
App 20190164826 - WU; Jung-Tang ; et al. | 2019-05-30 |
Selective Capping Processes and Structures Formed Thereby
App 20190164751 - CHI; Chih-Chien ; et al. | 2019-05-30 |
Physical vapor deposition system and physical vapor depositing method using the same
Grant 9,887,073 - Chi , et al. February 6, 2 | 2018-02-06 |
Method of integration process for metal CMP
Grant 9,805,951 - Chi , et al. October 31, 2 | 2017-10-31 |
Method of Integration Process for Metal CMP
App 20170301557 - Chi; Chih-Chien ; et al. | 2017-10-19 |
Package-on-package structures and methods of manufacture thereof
Grant 9,460,939 - Lee , et al. October 4, 2 | 2016-10-04 |
Chip packages and methods of manufacture thereof
Grant 9,425,179 - Hwang , et al. August 23, 2 | 2016-08-23 |
Physical Vapor Deposition System And Physical Vapor Depositing Method Using The Same
App 20160240357 - CHI; Chih-Chien ; et al. | 2016-08-18 |
Package-on-package Structures And Methods Of Manufacture Thereof
App 20160148820 - Lee; Pei-Hsuan ; et al. | 2016-05-26 |
Chip Packages And Methods Of Manufacture Thereof
App 20160064367 - Hwang; Chien Ling ; et al. | 2016-03-03 |
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