Lee; Naewon
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Naewon.The latest application filed is for "double side stack packaging method".
- Lee; Naewon - Seoul KR
| Patent | Date |
|---|---|
| Multi-stack chip size packaging method Grant 7,374,967 - Lee May 20, 2 | 2008-05-20 |
| Double side stack packaging method Grant 7,112,473 - Lee September 26, 2 | 2006-09-26 |
| Multi-stack chip size packaging method App 20040150098 - Lee, Naewon | 2004-08-05 |
| Double side stack packaging method App 20040152235 - Lee, Naewon | 2004-08-05 |
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