Lee; Myung Kil

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Myung Kil.The latest application filed is for "thin package system with external terminals and method of manufacture thereof".

Company Profile

0.9.9

Lee; Myung Kil - Seoul KR
Lee; Myung Kil - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit packaging system with package-in-package and method of manufacture thereof Grant 8,816,487 - Bae , et al. August 26, 2	2014-08-26
Thin package system with external terminals and method of manufacture thereof Grant 8,481,371 - Kim , et al. July 9, 2	2013-07-09
Integrated circuit package system using interposer Grant 8,089,143 - Lee January 3, 2	2012-01-03
Integrated circuit package system with internal stacking module adhesive Grant 8,026,582 - Lee , et al. September 27, 2	2011-09-27
Thin Package System With External Terminals And Method Of Manufacture Thereof App 20110215456 - Kim; Youngcheol ; et al.	2011-09-08
Thin package system with external terminals Grant 7,947,535 - Kim , et al. May 24, 2	2011-05-24
Stacked die package system Grant 7,674,640 - Ha , et al. March 9, 2	2010-03-09
Integrated Circuit Packaging System With Package-in-package And Method Of Manufacture Thereof App 20090236723 - Bae; Hyunil ; et al.	2009-09-24
Integrated Circuit Package System With Internal Stacking Module Adhesive App 20090194867 - Lee; Myung Kil ; et al.	2009-08-06
Stacked Die Package System App 20070284718 - Ha; Jong-Woo ; et al.	2007-12-13
Spacerless Semiconductor Package Chip Stacking System App 20070268660 - Ahn; Seungyun ; et al.	2007-11-22
Stacked die package system Grant 7,279,785 - Ha , et al. October 9, 2	2007-10-09
Integrated Circuit Package System App 20070109750 - Lee; Myung Kil ; et al.	2007-05-17
Thin Package System With External Terminals App 20070090495 - Kim; Youngcheol ; et al.	2007-04-26
Stacked Die Package System App 20060180914 - Ha; Jong-Woo ; et al.	2006-08-17
Integrated Circuit Package System Using Interposer App 20060175695 - Lee; Myung Kil	2006-08-10

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