Lee; Myung June
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Myung June.The latest application filed is for "integrated circuit packages with dual-sided stacking structure".
- Lee; Myung June - Cupertino CA
| Patent | Date |
|---|---|
| Integrated circuit package with vacant cavity Grant 9,607,863 - Lee March 28, 2 | 2017-03-28 |
| Integrated circuit package substrate with openings surrounding a conductive via Grant 9,478,491 - Zhang , et al. October 25, 2 | 2016-10-25 |
| Integrated Circuit Packages With Dual-sided Stacking Structure App 20160240457 - Lee; Myung June | 2016-08-18 |
| Heat spreading structures for integrated circuits Grant 9,330,997 - Lim , et al. May 3, 2 | 2016-05-03 |
| Through-silicon vias with metal system fill Grant 9,236,341 - Kim , et al. January 12, 2 | 2016-01-12 |
| Integrated circuit package with cavity in substrate Grant 9,196,575 - Lee , et al. November 24, 2 | 2015-11-24 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 