loadpatents
name:-0.092372179031372
name:-0.025823831558228
name:-0.0005500316619873
Lee; Ming-Tung Patent Filings

Lee; Ming-Tung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Ming-Tung.The latest application filed is for "semiconductor structure and manufacturing method of the same".

Company Profile
0.17.17
  • Lee; Ming-Tung - Taoyuan County TW
  • Lee; Ming-Tung - Taoyun County TW
  • Lee; Ming-Tung - Longtan Shiang N/A TW
  • Lee; Ming-Tung - Taoyuan TW
  • Lee; Ming-Tung - Hsinchu TW
  • Lee; Ming-Tung - Taichung TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of fabricating integrated semiconductor device and structure thereof
Grant 9,302,904 - Huang , et al. April 5, 2
2016-04-05
Semiconductor structure and manufacturing method of the same
Grant 9,202,862 - Lee , et al. December 1, 2
2015-12-01
Semiconductor Structure And Manufacturing Method Of The Same
App 20150263085 - Lee; Ming-Tung ;   et al.
2015-09-17
Method Of Fabricating Integrated Semiconductor Device And Structure Thereof
App 20150044808 - Huang; Hsueh-I ;   et al.
2015-02-12
MOS device and method of manufacturing the same
Grant 8,940,609 - Chen , et al. January 27, 2
2015-01-27
Semiconductor device having reduced leakage current at breakdown and method of fabricating thereof
Grant 8,928,095 - Chen , et al. January 6, 2
2015-01-06
Method of fabricating integrated semiconductor device with MOS, NPN BJT, LDMOS, pre-amplifier and MEMS unit
Grant 8,897,470 - Huang , et al. November 25, 2
2014-11-25
MOS device and method of manufacturing the same
App 20140302654 - Chen; Chien-Chung ;   et al.
2014-10-09
Semiconductor Composite Layer Structure And Semiconductor Packaging Structure Having The Same Thereof
App 20140264855 - Lee; Ming-Tung ;   et al.
2014-09-18
Semiconductor Device Having Reduced Leakage Current At Breakdown And Method Of Fabricating Thereof
App 20140264599 - Chen; Chien-Chung ;   et al.
2014-09-18
MOS device and method of manufacturing the same
Grant 8,829,615 - Chen , et al. September 9, 2
2014-09-09
Structure of NPN-BJT for improving punch through between collector and emitter
Grant 8,581,339 - Chang , et al. November 12, 2
2013-11-12
Schottky diode with enhanced breakdown voltage
App 20130285136 - LU; Chin-Hsien ;   et al.
2013-10-31
Mos Device And Method Of Manufacturing The Same
App 20130056825 - Chen; Chien-Chung ;   et al.
2013-03-07
Novel Structure Of Npn-bjt For Improving Punch Through Between Collector And Emitter
App 20130037914 - Chang; Chin-Wei ;   et al.
2013-02-14
Semiconductor bio-sensors and methods of manufacturing the same
Grant 8,357,547 - Lee , et al. January 22, 2
2013-01-22
Semiconductor devices and methods of manufacturing the same
Grant 8,354,716 - Huang , et al. January 15, 2
2013-01-15
Semiconductor Bio-sensors And Methods Of Manufacturing The Same
App 20120270350 - Lee; Ming-Tung ;   et al.
2012-10-25
Semiconductor bio-sensors and methods of manufacturing the same
Grant 8,227,877 - Lee , et al. July 24, 2
2012-07-24
Ldmos Having Single-strip Source Contact And Method For Manufacturing Same
App 20120037989 - Huang; Hsueh-I ;   et al.
2012-02-16
Semiconductor Bio-sensors And Methods Of Manufacturing The Same
App 20120012900 - LEE; Ming-Tung ;   et al.
2012-01-19
Semiconductor Devices And Methods Of Manufacturing The Same
App 20120001260 - Huang; Hsueh I. ;   et al.
2012-01-05
Method Of Fabricating Integrated Semiconductor Device And Structure Thereof
App 20110026742 - Huang; Hsueh-I ;   et al.
2011-02-03
Method for fabricating a non-volatile memory and metal interconnect process
Grant 6,881,619 - Lee , et al. April 19, 2
2005-04-19
Hermetically sealed electrical switch assembly
Grant 6,762,662 - Lee , et al. July 13, 2
2004-07-13
Hermetically sealed electrical switch assembly
App 20030090352 - Lee, Wen-Fong ;   et al.
2003-05-15

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