Patent | Date |
---|
Method of fabricating integrated semiconductor device and structure thereof Grant 9,302,904 - Huang , et al. April 5, 2 | 2016-04-05 |
Semiconductor structure and manufacturing method of the same Grant 9,202,862 - Lee , et al. December 1, 2 | 2015-12-01 |
Semiconductor Structure And Manufacturing Method Of The Same App 20150263085 - Lee; Ming-Tung ;   et al. | 2015-09-17 |
Method Of Fabricating Integrated Semiconductor Device And Structure Thereof App 20150044808 - Huang; Hsueh-I ;   et al. | 2015-02-12 |
MOS device and method of manufacturing the same Grant 8,940,609 - Chen , et al. January 27, 2 | 2015-01-27 |
Semiconductor device having reduced leakage current at breakdown and method of fabricating thereof Grant 8,928,095 - Chen , et al. January 6, 2 | 2015-01-06 |
Method of fabricating integrated semiconductor device with MOS, NPN BJT, LDMOS, pre-amplifier and MEMS unit Grant 8,897,470 - Huang , et al. November 25, 2 | 2014-11-25 |
MOS device and method of manufacturing the same App 20140302654 - Chen; Chien-Chung ;   et al. | 2014-10-09 |
Semiconductor Composite Layer Structure And Semiconductor Packaging Structure Having The Same Thereof App 20140264855 - Lee; Ming-Tung ;   et al. | 2014-09-18 |
Semiconductor Device Having Reduced Leakage Current At Breakdown And Method Of Fabricating Thereof App 20140264599 - Chen; Chien-Chung ;   et al. | 2014-09-18 |
MOS device and method of manufacturing the same Grant 8,829,615 - Chen , et al. September 9, 2 | 2014-09-09 |
Structure of NPN-BJT for improving punch through between collector and emitter Grant 8,581,339 - Chang , et al. November 12, 2 | 2013-11-12 |
Schottky diode with enhanced breakdown voltage App 20130285136 - LU; Chin-Hsien ;   et al. | 2013-10-31 |
Mos Device And Method Of Manufacturing The Same App 20130056825 - Chen; Chien-Chung ;   et al. | 2013-03-07 |
Novel Structure Of Npn-bjt For Improving Punch Through Between Collector And Emitter App 20130037914 - Chang; Chin-Wei ;   et al. | 2013-02-14 |
Semiconductor bio-sensors and methods of manufacturing the same Grant 8,357,547 - Lee , et al. January 22, 2 | 2013-01-22 |
Semiconductor devices and methods of manufacturing the same Grant 8,354,716 - Huang , et al. January 15, 2 | 2013-01-15 |
Semiconductor Bio-sensors And Methods Of Manufacturing The Same App 20120270350 - Lee; Ming-Tung ;   et al. | 2012-10-25 |
Semiconductor bio-sensors and methods of manufacturing the same Grant 8,227,877 - Lee , et al. July 24, 2 | 2012-07-24 |
Ldmos Having Single-strip Source Contact And Method For Manufacturing Same App 20120037989 - Huang; Hsueh-I ;   et al. | 2012-02-16 |
Semiconductor Bio-sensors And Methods Of Manufacturing The Same App 20120012900 - LEE; Ming-Tung ;   et al. | 2012-01-19 |
Semiconductor Devices And Methods Of Manufacturing The Same App 20120001260 - Huang; Hsueh I. ;   et al. | 2012-01-05 |
Method Of Fabricating Integrated Semiconductor Device And Structure Thereof App 20110026742 - Huang; Hsueh-I ;   et al. | 2011-02-03 |
Method for fabricating a non-volatile memory and metal interconnect process Grant 6,881,619 - Lee , et al. April 19, 2 | 2005-04-19 |
Hermetically sealed electrical switch assembly Grant 6,762,662 - Lee , et al. July 13, 2 | 2004-07-13 |
Hermetically sealed electrical switch assembly App 20030090352 - Lee, Wen-Fong ;   et al. | 2003-05-15 |