| Patent | Date |
|---|
Semiconductor substrate and method for manufacturing the same
Grant 11,398,421 - Lee , et al. July 26, 2 | 2022-07-26 |
Semiconductor device package and method of manufacturing the same
Grant 10,797,022 - Fang , et al. October 6, 2 | 2020-10-06 |
Semiconductor Substrate And Method For Manufacturing The Same
App 20190148280 - Lee; Chun-Che ; et al. | 2019-05-16 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20190109117 - Fang; Hsu-Nan ; et al. | 2019-04-11 |
Semiconductor substrate mitigating bridging
Grant 10,181,438 - Lee , et al. Ja | 2019-01-15 |
Substrate structure and package structure using the same
Grant 9,578,737 - Chen , et al. February 21, 2 | 2017-02-21 |
Embedded component device and manufacturing methods thereof
Grant 9,406,658 - Lee , et al. August 2, 2 | 2016-08-02 |
Semiconductor package with single sided substrate design and manufacturing methods thereof
Grant 9,196,597 - Su , et al. November 24, 2 | 2015-11-24 |
Semiconductor package structure and semiconductor process
Grant 9,190,367 - Liao , et al. November 17, 2 | 2015-11-17 |
Semiconductor Substrate And Method For Manufacturing The Same
App 20150115469 - LEE; Chun-Che ; et al. | 2015-04-30 |
Semiconductor Package With Single Sided Substrate Design And Manufacturing Methods Thereof
App 20140346670 - Su; Yuan-Chang ; et al. | 2014-11-27 |
Semiconductor package with single sided substrate design and manufacturing methods thereof
Grant 8,884,424 - Su , et al. November 11, 2 | 2014-11-11 |
Substrate Structure And Package Structure Using The Same
App 20140144683 - CHEN; Kuo-Hua ; et al. | 2014-05-29 |
Substrate structure and package structure using the same
Grant 8,665,605 - Chen , et al. March 4, 2 | 2014-03-04 |
Semiconductor Package With Single Sided Substrate Design And Manufacturing Methods Thereof
App 20140021636 - Su; Yuan-Chang ; et al. | 2014-01-23 |
Semiconductor package with single sided substrate design and manufacturing methods thereof
Grant 8,569,894 - Su , et al. October 29, 2 | 2013-10-29 |
Method of fabricating a multi-trace via substrate
Grant 8,510,940 - Chen , et al. August 20, 2 | 2013-08-20 |
Chip package
Grant 8,497,585 - Lee July 30, 2 | 2013-07-30 |
Semiconductor package with embedded die and manufacturing methods thereof
Grant 8,487,426 - Essig , et al. July 16, 2 | 2013-07-16 |
Coreless substrate and method for making the same
Grant 8,416,577 - Wang , et al. April 9, 2 | 2013-04-09 |
Manufacturing method of embedded circuit substrate
Grant 8,387,239 - Wang , et al. March 5, 2 | 2013-03-05 |
Wafer-level semiconductor device packages with three-dimensional fan-out and manufacturing methods thereof
Grant 8,372,689 - Lee , et al. February 12, 2 | 2013-02-12 |
Embedded component substrate and manufacturing methods thereof
Grant 8,320,134 - Su , et al. November 27, 2 | 2012-11-27 |
Semiconductor package with substrate having single metal layer and manufacturing methods thereof
Grant 8,288,869 - Huang , et al. October 16, 2 | 2012-10-16 |
Embedded component package structure
Grant 8,284,561 - Su , et al. October 9, 2 | 2012-10-09 |
Semiconductor Package with Embedded Die and Manufacturing Methods Thereof
App 20120235309 - Essig; Kay Stephan ; et al. | 2012-09-20 |
Embedded Component Device And Manufacturing Methods Thereof
App 20120153493 - LEE; CHUN-CHE ; et al. | 2012-06-21 |
Multi-layered Substrate
App 20120073871 - Appelt; Bernd Karl ; et al. | 2012-03-29 |
Method Of Fabricating Embedded Component Package Structure And The Package Structure Thereof
App 20120033394 - Su; Yuan-Chang ; et al. | 2012-02-09 |
Method of fabricating multi-layered substrate
Grant 8,104,171 - Appelt , et al. January 31, 2 | 2012-01-31 |
Thermally enhanced package structure
Grant 8,059,422 - Tong , et al. November 15, 2 | 2011-11-15 |
Chip Package
App 20110260327 - Lee; Ming-Chiang | 2011-10-27 |
Embedded Component Substrate and Manufacturing Methods Thereof
App 20110194265 - Su; Yuan-Chang ; et al. | 2011-08-11 |
Quad flat non-leaded package and manufacturing method thereof
Grant 7,993,982 - Lee August 9, 2 | 2011-08-09 |
Wafer-Level Semiconductor Device Packages with Three-Dimensional Fan-Out and Manufacturing Methods Thereof
App 20110177654 - Lee; Ming-Chiang ; et al. | 2011-07-21 |
Structure Having Multi-trace Via Substrate And Method Of Fabricating The Same
App 20110174529 - CHEN; Min-Yao ; et al. | 2011-07-21 |
Semiconductor Package with Single Sided Substrate Design and Manufacturing Methods Thereof
App 20110169150 - Su; Yuan-Chang ; et al. | 2011-07-14 |
Semiconductor Package With Substrate Having Single Metal Layer And Manufacturing Methods Thereof
App 20100320610 - HUANG; SHIH-FU ; et al. | 2010-12-23 |
Substrate Structure And Package Structure Using The Same
App 20100206622 - Chen; Kuo-Hua ; et al. | 2010-08-19 |
Coreless Substrate and Method for Making the Same
App 20100206618 - Wang; Chien-Hao ; et al. | 2010-08-19 |
Quad Flat Non-leaded Package And Manufacturing Method Thereof
App 20100140781 - Lee; Ming-Chiang | 2010-06-10 |
Embedded Circuit Substrate And Manufacturing Method Thereof
App 20100139965 - Wang; Chien-Hao ; et al. | 2010-06-10 |
Micro-electro-mechanical-system package and method for manufacturing the same
Grant 7,706,149 - Yang , et al. April 27, 2 | 2010-04-27 |
Method Of Fabricating Multi-layered Substrate And The Substrate Thereof
App 20100055392 - Appelt; Bernd Karl ; et al. | 2010-03-04 |
Flip chip package process
Grant 7,614,888 - Tong , et al. November 10, 2 | 2009-11-10 |
Flip Chip Package Process
App 20090087947 - Tong; Ho-Ming ; et al. | 2009-04-02 |
Manufacturing Process And Structure Of A Thermally Enhanced Package
App 20090075027 - Tong; Ho-Ming ; et al. | 2009-03-19 |
Micro-electro-mechanical-system Package And Method For Manufacturing The Same
App 20090046436 - YANG; Hsueh An ; et al. | 2009-02-19 |
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