Lee; Mihee
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Mihee.The latest application filed is for "multi-layered thermally conductive sheet".
- Lee; Mihee - GyungsangBuk-Do KR
- Lee; Mihee - Gyunggu-Do KR
- Lee; Mihee - Guynggi-Do KR
- Lee; Mihee - Gyunggi-Do KR
- Lee; Mihee - Kyungki-do KR
| Patent | Date |
|---|---|
| Multi-layered Thermally Conductive Sheet App 20200332154 - Noh; Taehoon ; et al. | 2020-10-22 |
| Electronic circuit board assembly including EMI shielding structure and thermal pad Grant 10,104,763 - Lee , et al. October 16, 2 | 2018-10-16 |
| Electronic Circuit Board Assembly Including Emi Shielding Structure And Thermal Pad App 20170251549 - Lee; Mihee ; et al. | 2017-08-31 |
| Heat Spreading Tape App 20160120068 - Tien; Pei ; et al. | 2016-04-28 |
| Heat Dissipating Sheet App 20160076829 - Lee; Mihee ; et al. | 2016-03-17 |
| Apparatus and method for inducing emotions Grant 7,955,259 - Lee , et al. June 7, 2 | 2011-06-07 |
| Apparatus and method for inducing emotions App 20050075532 - Lee, Mihee ; et al. | 2005-04-07 |
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