| Patent | Date |
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Method and system for controlling chip warpage during bonding
Grant 8,975,092 - Uchibori , et al. March 10, 2 | 2015-03-10 |
Method and system for controlling chip inclination during flip-chip mounting
Grant 8,859,335 - Lee , et al. October 14, 2 | 2014-10-14 |
Method And System For Controlling Chip Warpage During Bonding
App 20140145324 - Uchibori; Chihiro ; et al. | 2014-05-29 |
Method And System For Controlling Chip Inclination During Flip-chip Mounting
App 20140124917 - Lee; Michael G. ; et al. | 2014-05-08 |
Hybrid interconnect technology
Grant 8,633,592 - Lee , et al. January 21, 2 | 2014-01-21 |
Method and system for providing a reliable semiconductor assembly
Grant 8,487,428 - Lee July 16, 2 | 2013-07-16 |
Hybrid Interconnect Technology
App 20130026634 - Lee; Michael G. ; et al. | 2013-01-31 |
Method and system for providing a low-profile semiconductor assembly
Grant 8,236,606 - Lee August 7, 2 | 2012-08-07 |
Systems And Methods For Reinforcing Chip Packages
App 20120032327 - Lee; Michael G. ; et al. | 2012-02-09 |
Alignment structures for an optical assembly
Grant 7,855,377 - Lee December 21, 2 | 2010-12-21 |
Method and System for Providing a Low-Profile Semiconductor Assembly
App 20100267201 - Lee; Michael G. | 2010-10-21 |
Method and system for providing an aligned semiconductor assembly
Grant 7,781,867 - Lee August 24, 2 | 2010-08-24 |
Optical beam splitter
Grant 7,742,666 - Lee , et al. June 22, 2 | 2010-06-22 |
Dynamic Reconfigurable Optical Interconnect System
App 20100054655 - Glebov; Alexei L. ; et al. | 2010-03-04 |
Optical Modulator
App 20100046879 - Lee; Michael G. ; et al. | 2010-02-25 |
Optical Beam Splitter
App 20100046890 - Lee; Michael G. ; et al. | 2010-02-25 |
Alignment Tolerances for an Optical Assembly
App 20100032553 - Lee; Michael G. | 2010-02-11 |
Flexible Optical Pillars for an Optical Assembly
App 20100034497 - Glebov; Alexei L. ; et al. | 2010-02-11 |
Method and System for Providing an Aligned Semiconductor Assembly
App 20090166857 - Lee; Michael G. | 2009-07-02 |
Method and System for Providing a Reliable Semiconductor Assembly
App 20090127704 - Lee; Michael G. | 2009-05-21 |
Method and System for Providing a Low-Profile Semiconductor Assembly
App 20090127703 - Lee; Michael G. | 2009-05-21 |
Optical interconnect apparatuses and electro-optic modulators for processing systems
Grant 7,522,783 - Glebov , et al. April 21, 2 | 2009-04-21 |
Method and apparatus for securely transmitting encrypted data through a firewall and for monitoring user traffic
Grant 7,516,485 - Lee , et al. April 7, 2 | 2009-04-07 |
High density interconnections with nanowiring
Grant 7,504,014 - Lee , et al. March 17, 2 | 2009-03-17 |
Optical bumps for low-loss interconnection between a device and its supported substrate and related methods
Grant 7,453,058 - Lee , et al. November 18, 2 | 2008-11-18 |
Integrated linear polarizer
Grant 7,403,672 - Zhou , et al. July 22, 2 | 2008-07-22 |
Integrated Linear Polarizer
App 20080144161 - Zhou; Dashun Steve ; et al. | 2008-06-19 |
Opto-electronic processors with reconfigurable chip-to-chip optical interconnections
Grant 7,376,295 - Lee , et al. May 20, 2 | 2008-05-20 |
Integrated electro-optic module for high speed data transmission
Grant 7,343,054 - Lee , et al. March 11, 2 | 2008-03-11 |
Optical interconnect apparatuses and electro-optic modulators for processing systems
App 20070280578 - Glebov; Alexei ; et al. | 2007-12-06 |
Methods and apparatuses for measuring the refractive index and other optical properties of liquids, gels, and solids
Grant 7,283,220 - Huang , et al. October 16, 2 | 2007-10-16 |
Network communication authentication
Grant 7,275,109 - Lee September 25, 2 | 2007-09-25 |
Call features for automatic call distribution system
Grant 7,257,217 - Lee August 14, 2 | 2007-08-14 |
Apparatuses and methods for integrating opto-electric components into the optical pathways of routing substrates with precision optical coupling and compact electrical interconnection
Grant 7,229,219 - Lee , et al. June 12, 2 | 2007-06-12 |
Optical apparatuses providing optical interconnections among a plurality of electronic components
Grant 7,209,621 - Glebov , et al. April 24, 2 | 2007-04-24 |
Compact optical devices and methods for making the same
Grant 7,171,065 - Lee , et al. January 30, 2 | 2007-01-30 |
Compact optical devices and methods for making the same
App 20060210216 - Lee; Michael G. ; et al. | 2006-09-21 |
Optical bumps for low-loss interconnection and related methods
App 20060208165 - Lee; Michael G. ; et al. | 2006-09-21 |
High density interconnections with nanowiring
App 20060211327 - Lee; Michael G. ; et al. | 2006-09-21 |
Methods of forming LaNiO.sub.3 conductive layers, ferro-electric devices with LaNiO.sub.3 layers, and precursor formation solutions
Grant 7,083,869 - Liu , et al. August 1, 2 | 2006-08-01 |
Thin film electro-optical deflector device and a method of fabrication of such a device
Grant 7,035,489 - Glebov , et al. April 25, 2 | 2006-04-25 |
Apparatuses and methods for integrating opto-electric components into the optical pathways of routing substrates with precision optical coupling and compact electrical interconnection
App 20060062522 - Lee; Michael G. ; et al. | 2006-03-23 |
Opto-electronic processors with reconfigurable chip-to-chip optical interconnections
App 20060062512 - Lee; Michael G. ; et al. | 2006-03-23 |
Optical apparatuses providing optical interconnections among a plurality of electronic components
App 20060008199 - Glebov; Alexei ; et al. | 2006-01-12 |
Methods of forming LaNiO3 conductive layers, ferro-electric devices with LaNiO3 layers, and precursor formation solutions
App 20050211135 - Liu, Kuo-Chuan ; et al. | 2005-09-29 |
Methods and apparatuses for measuring the refractive index and other optical properties of liquids, gels, and solids
App 20050213080 - Huang, Lidu ; et al. | 2005-09-29 |
Thin film electro-optical deflector device and a method of fabrication of such a device
App 20050163412 - Glebov, Alexei ; et al. | 2005-07-28 |
Method and system for joining and an ultra-high density interconnect
Grant 6,884,313 - Liu , et al. April 26, 2 | 2005-04-26 |
Thin film electro-optical deflector device and a method of fabrication of such a device
Grant 6,885,781 - Glebov , et al. April 26, 2 | 2005-04-26 |
Method for joining large substrates
Grant 6,866,741 - Chan , et al. March 15, 2 | 2005-03-15 |
Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making
Grant 6,845,184 - Yoshimura , et al. January 18, 2 | 2005-01-18 |
Method for joining conductive structures and an electrical conductive article
Grant 6,800,169 - Liu , et al. October 5, 2 | 2004-10-05 |
Methods of planarizing structures on wafers and substrates by polishing
Grant 6,733,685 - Beilin , et al. May 11, 2 | 2004-05-11 |
Method for depositing conductive paste using stencil
Grant 6,730,358 - Yamuni , et al. May 4, 2 | 2004-05-04 |
Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for making
Grant 6,690,845 - Yoshimura , et al. February 10, 2 | 2004-02-10 |
Method of fabricating a substrate with a via connection
Grant 6,662,443 - Chou , et al. December 16, 2 | 2003-12-16 |
Thin film electro-optical deflector device and a method of fabrication of such a device
App 20030206675 - Glebov, Alexei ; et al. | 2003-11-06 |
Opto-electronic substrates with electrical and optical interconnections and methods for making
Grant 6,611,635 - Yoshimura , et al. August 26, 2 | 2003-08-26 |
Method for depositing conductive paste using stencil
App 20030035886 - Yamuni, Charbel ; et al. | 2003-02-20 |
Interconnect assembly and Z-connection method for fine pitch substrates
Grant 6,518,096 - Chan , et al. February 11, 2 | 2003-02-11 |
Method for joining conductive structures and an electrical conductive article
App 20030019568 - Liu, Kuo-Chuan ; et al. | 2003-01-30 |
Conductive interconnect structures and methods for forming conductive interconnect structures
Grant 6,469,394 - Wong , et al. October 22, 2 | 2002-10-22 |
Method for joining and an ultra-high density interconnect
App 20020129894 - Liu, Kuo-Chuan ; et al. | 2002-09-19 |
Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like
Grant 6,444,921 - Wang , et al. September 3, 2 | 2002-09-03 |
Three dimensional packaging
App 20020117753 - Lee, Michael G. ; et al. | 2002-08-29 |
Multilayer interconnection and method
App 20020104873 - Lee, Michael G. ; et al. | 2002-08-08 |
Interconnect assembly and z-connection method for fine pitch substrates
App 20020090754 - Chan, Albert W. ; et al. | 2002-07-11 |
Method for joining large substrates
App 20020088540 - Chan, Albert W. ; et al. | 2002-07-11 |
Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making
Grant 6,343,171 - Yoshimura , et al. January 29, 2 | 2002-01-29 |
Method of fabricating a substrate with a via connection
App 20020000037 - Chou, William T. ; et al. | 2002-01-03 |
Stencil and method for depositing solder
App 20010046586 - Chan, Albert W. ; et al. | 2001-11-29 |
Methods of planarizing structures on wafers and substrates by polishing
App 20010042734 - Beilin, Solomon I. ; et al. | 2001-11-22 |
Method Of Forming Multilayer Circuit Structure
App 20010018796 - LEE, MICHAEL G. ; et al. | 2001-09-06 |
Reduced cross-talk noise high density signal interposer with power and ground wrap
Grant 6,239,485 - Peters , et al. May 29, 2 | 2001-05-29 |
Method for electroplating vias or through holes in substrates having conductors on both sides
Grant 6,197,664 - Lee , et al. March 6, 2 | 2001-03-06 |
Controlled impedance interposer substrate and method of making
Grant 6,102,710 - Beilin , et al. August 15, 2 | 2000-08-15 |
High density signal interposer with power and ground wrap
Grant 6,081,026 - Wang , et al. June 27, 2 | 2000-06-27 |
Method of paste printing using stencil and masking layer
Grant 6,047,637 - Chan , et al. April 11, 2 | 2000-04-11 |
Methods of planarizing structures on wafers and substrates by polishing
Grant 5,916,453 - Beilin , et al. June 29, 1 | 1999-06-29 |
Methods of etching through wafers and substrates with a composite etch stop layer
Grant 5,891,354 - Lee , et al. April 6, 1 | 1999-04-06 |
Controlled impedence interposer substrate
Grant 5,854,534 - Beilin , et al. December 29, 1 | 1998-12-29 |
Method of making a multichip module substrate
Grant 5,778,529 - Beilin , et al. July 14, 1 | 1998-07-14 |
Fabrication procedure for a stable post
Grant 5,722,162 - Chou , et al. March 3, 1 | 1998-03-03 |
Multichip module substrate
Grant 5,544,017 - Beilin , et al. August 6, 1 | 1996-08-06 |
Exercise treadmill with variable response to foot impact induced speed variation
Grant 5,476,430 - Lee , et al. December 19, 1 | 1995-12-19 |
Through hole interconnect substrate fabrication process
Grant 5,454,161 - Beilin , et al. October 3, 1 | 1995-10-03 |
Method for fabricating thin-film interconnector
Grant 5,419,038 - Wang , et al. May 30, 1 | 1995-05-30 |
Process for fabricating a substrate with thin film capacitor
Grant 5,323,520 - Peters , et al. June 28, 1 | 1994-06-28 |
Automated milk inclusive coffee apparatus
Grant 5,207,148 - Anderson , et al. May 4, 1 | 1993-05-04 |
Recorder for a medical monitor
Grant D300,359 - Lee , et al. March 21, 1 | 1989-03-21 |
Medical monitor
Grant D299,861 - Hunsdale , et al. February 14, 1 | 1989-02-14 |
Medical monitor
Grant D296,240 - Albright , et al. June 14, 1 | 1988-06-14 |
Raster display smoothing technique
Grant 4,677,431 - Lee June 30, 1 | 1987-06-30 |
Control system for audio-visual projector
Grant 4,363,055 - Lee December 7, 1 | 1982-12-07 |
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