Lee; Meng-Tsan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Meng-Tsan.The latest application filed is for "semiconductor package with redistribution structure and manufacturing method thereof".

Company Profile

7.7.11

Lee; Meng-Tsan - Hsinchu TW
Lee; Meng-Tsan - Hsin-Chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package With Redistribution Structure And Manufacturing Method Thereof App 20220093526 - Wu; Wei-Cheng ; et al.	2022-03-24
Semiconductor package including shielding plate in redistribution structure, semiconductor package including conductive via in redistribution structure, and manufacturing method thereof Grant 11,195,802 - Wu , et al. December 7, 2	2021-12-07
Fan-Out Package Having a Main Die and a Dummy Die App 20210375775 - Lin; Yan-Fu ; et al.	2021-12-02
Fan-out package having a main die and a dummy die Grant 11,094,641 - Lin , et al. August 17, 2	2021-08-17
Routing design of dummy metal cap and redistribution line Grant 11,031,352 - Yu , et al. June 8, 2	2021-06-08
Device and Method for UBM/RDL Routing App 20210143131 - Lee; Meng-Tsan ; et al.	2021-05-13
Semiconductor Package And Manufacturing Method Thereof App 20210098391 - Wu; Wei-Cheng ; et al.	2021-04-01
Fan-Out Package Having a Main Die and a Dummy Die, and Method of Forming App 20200111749 - Lin; Yan-Fu ; et al.	2020-04-09
Device and Method for UBM/RDL Routing App 20190393195 - Lee; Meng-Tsan ; et al.	2019-12-26
Fan-out package having a main die and a dummy die, and method of forming Grant 10,510,674 - Lin , et al. Dec	2019-12-17
Routing Design of Dummy Metal Cap and Redistribution Line App 20190341360 - Yu; Chen-Hua ; et al.	2019-11-07
Routing design of dummy metal cap and redistribution line Grant 10,354,961 - Yu , et al. July 16, 2	2019-07-16
Fan-Out Package Having a Main Die and a Dummy Die, and Method of Forming App 20190148305 - Lin; Yan-Fu ; et al.	2019-05-16
Fan-out package having a main die and a dummy die, and method of forming Grant 10,163,802 - Lin , et al. Dec	2018-12-25
Routing Design of Dummy Metal Cap and Redistribution Line App 20180261557 - Yu; Chen-Hua ; et al.	2018-09-13
Fan-Out Package Having a Dummy Die and Method of Forming App 20180151502 - Lin; Yan-Fu ; et al.	2018-05-31
Routing design of dummy metal cap and redistribution line Grant 9,972,581 - Yu , et al. May 15, 2	2018-05-15
Device and Method for UBM/RDL Routing App 20170338204 - Lee; Meng-Tsan ; et al.	2017-11-23

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