Lee; Meng-Han
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Meng-Han.The latest application filed is for "probe pad design for 3dic package yield analysis".
- Lee; Meng-Han - Taipei N/A TW
- Lee; Meng-Han - Taoyuan County TW
- Lee; Meng-Han - Taipei City TW
| Patent | Date |
|---|---|
| Probe pad design for 3DIC package yield analysis Grant 8,878,182 - Wang , et al. November 4, 2 | 2014-11-04 |
| Supporting substrate and method for fabricating the same Grant 8,450,624 - Lee , et al. May 28, 2 | 2013-05-28 |
| Probe Pad Design for 3DIC Package Yield Analysis App 20130092935 - Wang; Tzu-Yu ; et al. | 2013-04-18 |
| High density package substrate and method for fabricating the same Grant 8,058,567 - Lee , et al. November 15, 2 | 2011-11-15 |
| Supporting Substrate And Method For Fabricating The Same App 20110253440 - LEE; Meng-Han ; et al. | 2011-10-20 |
| Method for forming a wire bonding substrate Grant 7,877,873 - Lee , et al. February 1, 2 | 2011-02-01 |
| High Density Package Substrate And Method For Fabricating The Same App 20090283315 - Lee; Meng-Han ; et al. | 2009-11-19 |
| Wire Bonding Substrate And Fabrication Thereof App 20090206487 - Lee; Meng-Han ; et al. | 2009-08-20 |
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