Lee; Lisa Yung Hui
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Lisa Yung Hui.The latest application filed is for "package warpage control".
- Lee; Lisa Yung Hui - Sibu MY
- Lee; Lisa Yung Hui - Sarawak MY
| Patent | Date |
|---|---|
| Package Warpage Control App 20070205501 - Lee; Michael Keat Lye ; et al. | 2007-09-06 |
| Package Warpage Control App 20070155059 - Lee; Michael Keat Lye ; et al. | 2007-07-05 |
| Package warpage control Grant 7,208,342 - Lee , et al. April 24, 2 | 2007-04-24 |
| Heat spreader lid cavity filled with cured molding compound App 20050224953 - Lee, Michael Keat Lye ; et al. | 2005-10-13 |
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