| Patent | Date |
|---|
Method of making leadframe strip
Grant 11,373,940 - Lee , et al. June 28, 2 | 2022-06-28 |
Spring bar leadframe, method and packaged electronic device with zero draft angle
Grant 11,264,310 - Lee , et al. March 1, 2 | 2022-03-01 |
Spring Bar Leadframe, Method And Packaged Electronic Device With Zero Draft Angle
App 20210384110 - Lee; Lee Han Meng Eugene ; et al. | 2021-12-09 |
Universal Semiconductor Package Molds
App 20210242038 - BIN ABDUL AZIZ; Anis Fauzi ; et al. | 2021-08-05 |
Leadframe Assembly
App 20210202356 - LIM; Chong Han ; et al. | 2021-07-01 |
Universal Semiconductor Package Molds
App 20210043466 - BIN ABDUL AZIZ; Anis Fauzi ; et al. | 2021-02-11 |
Method Of Making Leadframe Strip
App 20210005540 - Lee; Lee Han Meng@Eugene ; et al. | 2021-01-07 |
Method of making leadframe strip
Grant 10,784,190 - Lee , et al. Sept | 2020-09-22 |
Electronic Device With Lead Pitch Gap
App 20200235042 - Bin Abdul Aziz; Anis Fauzi ; et al. | 2020-07-23 |
Integrated Circuit Package With Lead Lock
App 20200176365 - Anis Fauzi; Bin Abdul Aziz ; et al. | 2020-06-04 |
Integrated circuit package having an IC die between top and bottom leadframes
Grant 10,381,293 - Lee , et al. A | 2019-08-13 |
Integrated Circuit Package With Lead Lock
App 20190206770 - Anis Fauzi; Bin Abdul Aziz ; et al. | 2019-07-04 |
Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns
Grant 10,115,660 - Lee , et al. October 30, 2 | 2018-10-30 |
Semiconductor Device Having Leadframe With Pressure-Absorbing Pad Straps
App 20180122724 - Lee; Lee Han Meng@Eugene ; et al. | 2018-05-03 |
Leadframe Strip With Vertically Offset Die Attach Pads Between Adjacent Vertical Leadframe Columns
App 20170358523 - Lee; Lee Han Meng@Eugene ; et al. | 2017-12-14 |
Leadframe Strip With Vertically Offset Die Attach Pads Between Adjacent Vertical Leadframe Columns
App 20170345743 - Lee; Lee Han Meng@Eugene ; et al. | 2017-11-30 |
Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns
Grant 9,741,643 - Lee , et al. August 22, 2 | 2017-08-22 |
Leadframe Strip With Vertically Offset Die Attach Pads Between Adjacent Vertical Leadframe Columns
App 20170213784 - Lee; Lee Han Meng@Eugene ; et al. | 2017-07-27 |
Integrated Circuit Package
App 20170213781 - Lee; Lee Han Meng@Eugene ; et al. | 2017-07-27 |
Method Of Minimizing Mold Flash During Dambar Cut
App 20150144389 - Lee; Lee Han Meng @Eugene ; et al. | 2015-05-28 |
Making an integrated circuit module with dual leadframes
Grant 9,029,194 - Lee , et al. May 12, 2 | 2015-05-12 |
Integrated circuit package and method of making
Grant 9,013,028 - Lee , et al. April 21, 2 | 2015-04-21 |
Integrated circuit module with dual leadframe
Grant 8,884,414 - Lee , et al. November 11, 2 | 2014-11-11 |
Exposed die package that helps protect the exposed die from damage
Grant 8,847,370 - Lee , et al. September 30, 2 | 2014-09-30 |
Making An Integtated Circuit Module With Dual Leadframes
App 20140242755 - Lee; Lee Han Meng@Eugene ; et al. | 2014-08-28 |
Flexible routing for high current module application
Grant 8,779,566 - Lee , et al. July 15, 2 | 2014-07-15 |
Integrated Circuit Package And Method Of Making
App 20140191380 - Lee; Lee Han Meng@Eugene ; et al. | 2014-07-10 |
Integrated Circuit Module With Dual Leadframe
App 20140191381 - Lee; Lee Han Meng@Eugene ; et al. | 2014-07-10 |
Delamination resistant device package having raised bond surface and mold locking aperture
Grant 8,736,042 - Li , et al. May 27, 2 | 2014-05-27 |
Two Level Leadframe With Upset Ball Bonding Surface And Device Package
App 20130127029 - LEE; Lee Han Meng @ Eugene ; et al. | 2013-05-23 |
Design For Exposed Die Package
App 20130087901 - LEE; Lee Han Meng @ Eugene ; et al. | 2013-04-11 |
Flexible Routing For High Current Module Application
App 20130045572 - Lee; Lee Han Meng @ Eugene ; et al. | 2013-02-21 |
Module package with embedded substrate and leadframe
Grant 8,304,887 - Lee , et al. November 6, 2 | 2012-11-06 |
Tie bar and mold cavity bar arrangements for multiple leadframe stack package
Grant 8,203,199 - Lee , et al. June 19, 2 | 2012-06-19 |
Delamination Resistant Device Package Having Raised Bond Surface And Mold Locking Aperture
App 20120080781 - LI; Felix C. ; et al. | 2012-04-05 |
Three piece mold cavity design for packaging integrated circuits
Grant 8,105,063 - Lee January 31, 2 | 2012-01-31 |
Delamination resistant device package having low moisture sensitivity
Grant 8,097,934 - Li , et al. January 17, 2 | 2012-01-17 |
Leadframe packages having enhanced ground-bond reliability
Grant 8,093,707 - Lee , et al. January 10, 2 | 2012-01-10 |
Dap Ground Bond Enhancement
App 20110140253 - LEE; Shaw Wei ; et al. | 2011-06-16 |
Module Package With Embedded Substrate And Leadframe
App 20110140262 - LEE; Lee Han Meng @ Eugene ; et al. | 2011-06-16 |
Tie Bar And Mold Cavity Bar Arrangements For Multiple Leadframe Stack Package
App 20110140249 - LEE; Lee Han Meng Eugene ; et al. | 2011-06-16 |
Leadframe Packages Having Enhanced Ground-bond Reliability
App 20110089556 - LEE; Shaw Wei ; et al. | 2011-04-21 |
TO263 device package having low moisture sensitivity
Grant 7,838,980 - Lee , et al. November 23, 2 | 2010-11-23 |
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