| Patent | Date |
|---|
Semiconductor Packages With Embedded Interconnects
App 20220302005 - Lee; Kyu Oh ; et al. | 2022-09-22 |
Methods to selectively embed magnetic materials in substrate and corresponding structures
Grant 11,450,471 - Xu , et al. September 20, 2 | 2022-09-20 |
Substrate assembly with encapsulated magnetic feature
Grant 11,443,892 - Lee , et al. September 13, 2 | 2022-09-13 |
Microelectronic Assemblies Having Conductive Structures With Different Thicknesses On A Core Substrate
App 20220278038 - Park; Ji Yong ; et al. | 2022-09-01 |
Methods for attaching large components in a package substrate for advanced power delivery
Grant 11,432,405 - Jain , et al. August 30, 2 | 2022-08-30 |
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures
Grant 11,417,614 - Xu , et al. August 16, 2 | 2022-08-16 |
Methods to incorporate thin film capacitor sheets (TFC-S) in the build-up films
Grant 11,410,921 - Jain , et al. August 9, 2 | 2022-08-09 |
Techniques For An Inductor At A First Level Interface
App 20220230800 - Xu; Cheng ; et al. | 2022-07-21 |
Semiconductor packages with embedded interconnects
Grant 11,393,745 - Lee , et al. July 19, 2 | 2022-07-19 |
Phase change material in substrate cavity
Grant 11,387,224 - Xu , et al. July 12, 2 | 2022-07-12 |
Microelectronic assemblies having conductive structures with different thicknesses on a core substrate
Grant 11,380,609 - Xu , et al. July 5, 2 | 2022-07-05 |
Novel Lga Architecture For Improving Reliability Performance Of Metal Defined Pads
App 20220199503 - DUBEY; Manish ; et al. | 2022-06-23 |
Embedding magnetic material, in a cored or coreless semiconductor package
Grant 11,355,459 - Lee , et al. June 7, 2 | 2022-06-07 |
Porous Fli Bumps For Reducing Bump Thickness Variation Sensitivity To Enable Bump Pitch Scaling
App 20220165695 - AHMED; Numair ; et al. | 2022-05-26 |
Techniques for an inductor at a first level interface
Grant 11,322,290 - Xu , et al. May 3, 2 | 2022-05-03 |
Methods Of Embedding Magnetic Structures In Substrates
App 20220130748 - Vadlamani; Sai ; et al. | 2022-04-28 |
High density package substrate formed with dielectric bi-layer
Grant 11,276,634 - Pietambaram , et al. March 15, 2 | 2022-03-15 |
Methods of embedding magnetic structures in substrates
Grant 11,251,113 - Vadlamani , et al. February 15, 2 | 2022-02-15 |
Semiconductor package having a coaxial first layer interconnect
Grant 11,244,912 - Vadlamani , et al. February 8, 2 | 2022-02-08 |
Galvanic corrosion protection for semiconductor packages
Grant 11,217,534 - Xu , et al. January 4, 2 | 2022-01-04 |
Die Interconnect Substrates, A Semiconductor Device And A Method For Forming A Die Interconnect Substrate
App 20210398941 - JAIN; Rahul ; et al. | 2021-12-23 |
Package With Underfill Containment Barrier
App 20210391232 - Jain; Rahul ; et al. | 2021-12-16 |
Package with underfill containment barrier
Grant 11,158,558 - Jain , et al. October 26, 2 | 2021-10-26 |
Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate
Grant 11,139,264 - Jain , et al. October 5, 2 | 2021-10-05 |
Techniques for an inductor at a second level interface
Grant 11,031,360 - Xu , et al. June 8, 2 | 2021-06-08 |
Package With Underfill Containment Barrier
App 20210111088 - Jain; Rahul ; et al. | 2021-04-15 |
Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same
Grant 10,971,492 - Xu , et al. April 6, 2 | 2021-04-06 |
Indium solder metallurgy to control electro-migration
Grant 10,957,667 - Lee , et al. March 23, 2 | 2021-03-23 |
Semiconductor Packages With Embedded Interconnects
App 20210082797 - Lee; Kyu Oh ; et al. | 2021-03-18 |
Techniques For An Inductor At A Second Level Interface
App 20200373257 - Xu; Cheng ; et al. | 2020-11-26 |
Methods To Pattern Tfc And Incorporation In The Odi Architecture And In Any Build Up Layer Of Organic Substrate
App 20200294938 - JAIN; Rahul ; et al. | 2020-09-17 |
Techniques for an inductor at a second level interface
Grant 10,777,514 - Xu , et al. Sept | 2020-09-15 |
Thermal Management Solutions For Integrated Circuit Packages
App 20200273776 - Xu; Cheng ; et al. | 2020-08-27 |
Galvanic Corrosion Protection For Semiconductor Packages
App 20200266149 - XU; Cheng ; et al. | 2020-08-20 |
Package-embedded Thin-film Capacitors, Package-integral Magnetic Inductors, And Methods Of Assembling Same
App 20200251467 - Kind Code | 2020-08-06 |
Microelectronic Assemblies Having A Cooling Channel
App 20200211927 - Wan; Zhimin ; et al. | 2020-07-02 |
Inorganic interposer for multi-chip packaging
Grant 10,692,847 - Sobieski , et al. | 2020-06-23 |
Effective Heat Conduction From Hotspot To Heat Spreader Through Package Substrate
App 20200185300 - Xu; Cheng ; et al. | 2020-06-11 |
Magnetic Core Inductors
App 20200168384 - Zhao; Junnan ; et al. | 2020-05-28 |
Semiconductor Package Having A Coaxial First Layer Interconnect
App 20200168569 - VADLAMANI; Sai ; et al. | 2020-05-28 |
Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same
Grant 10,643,994 - Xu , et al. | 2020-05-05 |
Phase Change Material In Substrate Cavity
App 20200118990 - Xu; Cheng ; et al. | 2020-04-16 |
In-situ Formation Of A Thermoelectric Device In A Substrate Packaging
App 20200119250 - Xu; Cheng ; et al. | 2020-04-16 |
High Density Package Substrate Formed With Dielectric Bi-layer
App 20200075473 - Pietambaram; Srinivas V. ; et al. | 2020-03-05 |
Cavity Structures In Integrated Circuit Package Supports
App 20200066543 - Jain; Rahul ; et al. | 2020-02-27 |
Methods To Incorporate Thin Film Capacitor Sheets (tfc-s) In The Build-up Films
App 20200066622 - JAIN; Rahul ; et al. | 2020-02-27 |
Die Interconnect Substrates, A Semiconductor Device And A Method For Forming A Die Interconnect Substrate
App 20200027856 - JAIN; Rahul ; et al. | 2020-01-23 |
Chip Package And Method Of Manufacturing
App 20200006210 - Xu; Cheng ; et al. | 2020-01-02 |
Methods For Attaching Large Components In A Package Substrate For Advanced Power Delivery
App 20200008302 - JAIN; Rahul ; et al. | 2020-01-02 |
Substrate Assembly With Encapsulated Magnetic Feature
App 20200005994 - LEE; Kyu-Oh ; et al. | 2020-01-02 |
Package-embedded Thin-film Capacitors, Package-integral Magnetic Inductors, And Methods Of Assembling Same
App 20190393217 - Xu; Cheng ; et al. | 2019-12-26 |
Techniques For An Inductor At A First Level Interface
App 20190385780 - Xu; Cheng ; et al. | 2019-12-19 |
Techniques For An Inductor At A Second Level Interface
App 20190385959 - Xu; Cheng ; et al. | 2019-12-19 |
Creating A Cavity Using Plasma Gas
App 20190373736 - Jain; Rahul ; et al. | 2019-12-05 |
Embedding Magnetic Material In A Cored Or Coreless Semiconductor Package
App 20190355675 - LEE; Kyu-Oh ; et al. | 2019-11-21 |
Microelectronic Assemblies Having Conductive Structures With Different Thicknesses On A Core Substrate
App 20190355654 - Xu; Cheng ; et al. | 2019-11-21 |
Semiconductor packages with embedded bridge interconnects
Grant 10,468,352 - Lee No | 2019-11-05 |
Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate
Grant 10,468,374 - Jain , et al. No | 2019-11-05 |
Semiconductor packages with embedded bridge interconnects
Grant 10,446,500 - Lee Oc | 2019-10-15 |
Methods To Embed Magnetic Material As First Layer On Coreless Substrates And Corresponding Structures
App 20190304933 - XU; Cheng ; et al. | 2019-10-03 |
Methods To Selectively Embed Magnetic Materials In Substrate And Corresponding Structures
App 20190304661 - Xu; Cheng ; et al. | 2019-10-03 |
Integrated circuit structures with recessed conductive contacts for package on package
Grant 10,424,561 - Lee , et al. Sept | 2019-09-24 |
Methods for forming a substrate structure for an electrical component and an apparatus for applying pressure to an electrically insulating laminate located on a core substrate
Grant 10,384,431 - Park , et al. A | 2019-08-20 |
Nickel-tin Microbump Structures And Method Of Making Same
App 20190244922 - JAIN; Rahul ; et al. | 2019-08-08 |
Tin-zinc microbump structures and method of making same
Grant 10,373,900 - Chavali , et al. | 2019-08-06 |
Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same
Grant 10,373,951 - Xu , et al. | 2019-08-06 |
Release Layer-assisted Selective Embedding Of Magnetic Material In Cored And Coreless Organic Substrates
App 20190221345 - Vadlamani; Sai ; et al. | 2019-07-18 |
Missing Bump Prevention From Galvanic Corrosion By Copper Bump Sidewall Protection
App 20190206822 - PARK; Ji Yong ; et al. | 2019-07-04 |
Methods Of Embedding Magnetic Structures In Substrates
App 20190198436 - Vadlamani; Sai ; et al. | 2019-06-27 |
Indium Solder Metallurgy To Control Electro-migration
App 20190189582 - LEE; Kyu Oh ; et al. | 2019-06-20 |
Copper seed layer and nickel-tin microbump structures
Grant 10,297,563 - Jain , et al. | 2019-05-21 |
Semiconductor Packages With Embedded Bridge Interconnects
App 20190081002 - LEE; Kyu-Oh | 2019-03-14 |
Lead-Free Solder Alloy
App 20190076966 - Ohnishi; Tsukasa ; et al. | 2019-03-14 |
Surface finishes for interconnection pads in microelectronic structures
Grant 10,121,752 - Pietambaram , et al. November 6, 2 | 2018-11-06 |
Methods for forming a substrate structure for an electrical component and an apparatus for applying pressure to an electrically insulating laminate located on a core substrate
App 20180281374 - Park; Ji Yong ; et al. | 2018-10-04 |
Die Interconnect Substrates, a Semiconductor Device and a Method for Forming a Die Interconnect Substrate
App 20180286812 - Jain; Rahul ; et al. | 2018-10-04 |
Lead-free solder alloy
Grant 10,076,808 - Ohnishi , et al. September 18, 2 | 2018-09-18 |
Inorganic Interposer For Multi-chip Packaging
App 20180240788 - Sobieski; Daniel ; et al. | 2018-08-23 |
Integrated Circuit Structures With Recessed Conductive Contacts For Package On Package
App 20180226381 - LEE; KYU-OH ; et al. | 2018-08-09 |
Package substrate having noncircular interconnects
Grant 10,026,691 - Darmawikarta , et al. July 17, 2 | 2018-07-17 |
Surface finishes for interconnection pads in microelectronic structures
Grant 9,947,631 - Pietambaram , et al. April 17, 2 | 2018-04-17 |
Tin-zinc Microbump Structures And Method Of Making Same
App 20180076119 - Chavali; Sri Chaitra J. ; et al. | 2018-03-15 |
Nickel-tin Microbump Structures And Method Of Making Same
App 20180076161 - Jain; Rahul ; et al. | 2018-03-15 |
Package with bi-layered dielectric structure
Grant 9,917,044 - Zhou , et al. March 13, 2 | 2018-03-13 |
Surface Finishes For Interconnection Pads In Microelectronic Structures
App 20180019219 - Pietambaram; Srinivas V. ; et al. | 2018-01-18 |
Integrated circuit structures with recessed conductive contacts for package on package
Grant 9,865,568 - Lee , et al. January 9, 2 | 2018-01-09 |
Package Substrate Having Noncircular Interconnects
App 20170358528 - Darmawikarta; Kristof Kuwawi ; et al. | 2017-12-14 |
Tin-zinc microbump structures
Grant 9,837,341 - Chavali , et al. December 5, 2 | 2017-12-05 |
Electronic Package And Method Forming An Electrical Package
App 20170318669 - Darmawikarta; Kristof ; et al. | 2017-11-02 |
Magnet placement for integrated sensor packages
Grant 9,791,470 - Eid , et al. October 17, 2 | 2017-10-17 |
Semiconductor Packages With Embedded Bridge Interconnects
App 20170271264 - LEE; Kyu-Oh | 2017-09-21 |
Integrated Circuit Structures With Recessed Conductive Contacts For Package On Package
App 20170207196 - LEE; KYU-OH ; et al. | 2017-07-20 |
Integrated Circuit Structures With Interposers Having Recesses
App 20170170109 - LEE; KYU-OH ; et al. | 2017-06-15 |
Surface Finishes For Interconnection Pads In Microelectronic Structures
App 20170110422 - Pietambaram; Srinivas V. ; et al. | 2017-04-20 |
Package With Bi-layered Dielectric Structure
App 20170103941 - Zhou; Zheng ; et al. | 2017-04-13 |
Reliable microstrip routing for electronics components
Grant 9,607,947 - Karhade , et al. March 28, 2 | 2017-03-28 |
Electronic Package And Method Forming An Electrical Package
App 20170064821 - Darmawikarta; Kristof ; et al. | 2017-03-02 |
Methods of forming sensor integrated packages and structures formed thereby
Grant 9,505,607 - Lee , et al. November 29, 2 | 2016-11-29 |
Integration of pressure sensors into integrated circuit fabrication and packaging
Grant 9,501,068 - Lee , et al. November 22, 2 | 2016-11-22 |
Reliable Microstrip Routing For Electronics Components
App 20160300796 - Karhade; Omkar G. ; et al. | 2016-10-13 |
Methods Of Forming Sensor Integrated Packages And Structures Formed Thereby
App 20160280535 - Lee; Kyu Oh ; et al. | 2016-09-29 |
Reliable microstrip routing for electronics components
Grant 9,391,025 - Karhade , et al. July 12, 2 | 2016-07-12 |
Integration Of Pressure Sensors Into Integrated Circuit Fabrication And Packaging
App 20160161957 - LEE; KYU OH ; et al. | 2016-06-09 |
Device packaging with substrates having embedded lines and metal defined pads
Grant 9,355,952 - Hlad , et al. May 31, 2 | 2016-05-31 |
Integration of pressure or inertial sensors into integrated circuit fabrication and packaging
Grant 9,260,294 - Lee , et al. February 16, 2 | 2016-02-16 |
In-package Temperature Sensor And Methods Therefor
App 20150355035 - Eid; Feras ; et al. | 2015-12-10 |
Device Packaging With Substrates Having Embedded Lines And Metal Defined Pads
App 20150318238 - HLAD; Mark S. ; et al. | 2015-11-05 |
Reliable Microstrip Routing For Electronics Components
App 20150228583 - Karhade; Omkar G. ; et al. | 2015-08-13 |
Device packaging with substrates having embedded lines and metal defined pads
Grant 9,093,313 - Hlad , et al. July 28, 2 | 2015-07-28 |
Integration Of Pressure Or Inertial Sensors Into Integrated Circuit Fabrication And Packaging
App 20150183635 - Lee; Kyu Oh ; et al. | 2015-07-02 |
Magnet Placement For Integrated Sensor Packages
App 20150185247 - Eid; Feras ; et al. | 2015-07-02 |
Reliable microstrip routing for electronics components
Grant 9,041,205 - Karhade , et al. May 26, 2 | 2015-05-26 |
Lead-Free Solder Alloy
App 20150037088 - Ohnishi; Tsukasa ; et al. | 2015-02-05 |
Lead-Free Solder Alloy
App 20150037087 - Tachibana; Ken ; et al. | 2015-02-05 |
Device Packaging With Substrates Having Embedded Lines And Metal Defined Pads
App 20150008578 - Hlad; Mark S. ; et al. | 2015-01-08 |
Reliable Microstrip Routing For Electronics Components
App 20150001733 - Karhade; Omkar G. ; et al. | 2015-01-01 |
Device packaging with substrates having embedded lines and metal defined pads
Grant 8,835,217 - Hlad , et al. September 16, 2 | 2014-09-16 |
Device Packaging With Substrates Having Embedded Lines And Metal Defined Pads
App 20120161330 - Hlad; Mark S. ; et al. | 2012-06-28 |
| 