Lee; Kyoung Yeon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Kyoung Yeon.The latest application filed is for "semiconductor devices and methods of manufacturing semiconductor devices".

Company Profile

11.13.20

Lee; Kyoung Yeon - Incheon KR
Lee; Kyoung Yeon - Seoul KR
LEE; Kyoung Yeon - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and a method of manufacturing a semiconductor device Grant 11,417,589 - Cho , et al. August 16, 2	2022-08-16
Semiconductor Devices And Methods Of Manufacturing Semiconductor Devices App 20210376451 - Lee; Kyoung Yeon ; et al.	2021-12-02
Semiconductor Package With EMI Shield and Fabricating Method Thereof App 20210351137 - Shin; Doo Soub ; et al.	2021-11-11
Semiconductor devices and methods of manufacturing semiconductor devices Grant 11,101,540 - Lee , et al. August 24, 2	2021-08-24
Land Structure For Semiconductor Package And Method Therefor App 20210242113 - LEE; Kyoung Yeon ; et al.	2021-08-05
Semiconductor package with EMI shield and fabricating method thereof Grant 11,075,170 - Shin , et al. July 27, 2	2021-07-27
Land structure for semiconductor package and method therefor Grant 11,018,079 - Lee , et al. May 25, 2	2021-05-25
Semiconductor Device And A Method Of Manufacturing A Semiconductor Device App 20210111085 - Oh; Se Man ; et al.	2021-04-15
Semiconductor Devices And Methods Of Manufacturing Semiconductor Devices App 20210104809 - Lee; Kyoung Yeon ; et al.	2021-04-08
Semiconductor Device And A Method Of Manufacturing A Semiconductor Device App 20210090977 - Cho; Hyung Jun ; et al.	2021-03-25
Semiconductor Device And Method Of Manufacturing Semiconductor Device App 20210013136 - Cho; Hyung Jun ; et al.	2021-01-14
Semiconductor device and a method of manufacturing a semiconductor device Grant 10,840,169 - Cho , et al. November 17, 2	2020-11-17
Semiconductor device and a method of manufacturing a semiconductor device Grant 10,818,569 - Oh , et al. October 27, 2	2020-10-27
Semiconductor Device And A Method Of Manufacturing A Semiconductor Device App 20200266132 - Cho; Hyung Jun ; et al.	2020-08-20
Semiconductor Package With EMI Shield and Fabricating Method Thereof App 20200243459 - Shin; Doo Soub ; et al.	2020-07-30
Semiconductor Device And A Method Of Manufacturing A Semiconductor Device App 20200176345 - Oh; Se Man ; et al.	2020-06-04
Semiconductor package with EMI shield and fabricating method thereof Grant 10,553,542 - Shin , et al. Fe	2020-02-04
Semiconductor Package With EMI Shield and Fabricating Method Thereof App 20180197821 - Shin; Doo Soub ; et al.	2018-07-12
Semiconductor package and manufacturing method thereof Grant 10,020,263 - Lee , et al. July 10, 2	2018-07-10
Land Structure For Semiconductor Package And Method Therefor App 20180082932 - Lee; Kyoung Yeon ; et al.	2018-03-22
Land structure for semiconductor package and method therefor Grant 9,911,685 - Lee , et al. March 6, 2	2018-03-06
Semiconductor Device And Manufacturing Method Thereof App 20170323863 - Lee; Kyoung Yeon ; et al.	2017-11-09
Semiconductor Package And Manufacturing Method Thereof App 20170294412 - Lee; Kyoung Yeon ; et al.	2017-10-12
Lead frame package having discharge hole and method of manufacturing the same Grant 9,633,932 - Lee , et al. April 25, 2	2017-04-25
Land Structure For Semiconductor Package And Method Therefor App 20160172277 - Lee; Kyoung Yeon ; et al.	2016-06-16
Land structure for semiconductor package and method therefor Grant 9,293,398 - Lee , et al. March 22, 2	2016-03-22
Method Of Forming A Thin Substrate Chip Scale Package Device And Structure App 20150332991 - Lee; Kyoung Yeon ; et al.	2015-11-19
Lead Frame Package And Method For Manufacturing The Same App 20150279767 - Lee; Kyoung Yeon ; et al.	2015-10-01
Method of forming a thin substrate chip scale package device and structure Grant 9,129,975 - Lee , et al. September 8, 2	2015-09-08
Lead frame package having discharge holes and method of manufacturing the same Grant 9,054,089 - Lee , et al. June 9, 2	2015-06-09
Land Structure For Semiconductor Package And Method Therefor App 20140131848 - Lee; Kyoung Yeon ; et al.	2014-05-15
Lead Frame Package And Method For Manufacturing The Same App 20140042605 - Lee; Kyoung Yeon ; et al.	2014-02-13
Method Of Forming A Thin Substrate Chip Scale Package Device And Structure App 20130277815 - Lee; Kyoung Yeon ; et al.	2013-10-24

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