Lee; Kyoung Woo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Kyoung Woo.The latest application filed is for "semiconductor device".

Company Profile

11.63.74

Lee; Kyoung Woo - Suwon-si KR
Lee; Kyoung Woo - Hwaseong-si KR
Lee; Kyoung-woo - Seoul KR
Lee; Kyoung-Woo - Seongnam-si N/A KR
Lee; Kyoung Woo - Incheon KR
Lee; Kyoung-woo - Gunpo-si KR
Lee; Kyoung-Woo - Hwasoeng-si KR
Lee; Kyoung Woo - Samsan-dong KR
Lee; Kyoung-Woo - Gyeonggi-do KR
Lee; Kyoung Woo - Fishkill NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Washing machine Grant 11,078,616 - Ryu , et al. August 3, 2	2021-08-03
Semiconductor device Grant 10,950,541 - Hwang , et al. March 16, 2	2021-03-16
Semiconductor device with multi-layered wiring and method for fabricating the same Grant 10,825,766 - Kim , et al. November 3, 2	2020-11-03
Semiconductor Device App 20200219808 - HWANG; Soon Gyu ; et al.	2020-07-09
Method Of Fabricating Interconnection Line Of Semiconductor Device App 20200083094 - DING; SHAO FENG ; et al.	2020-03-12
Semiconductor Device And Method For Fabricating The Same App 20200051909 - KIM; Ji Young ; et al.	2020-02-13
Interposer, method of manufacturing interposer, and method of manufacturing semiconductor package Grant 10,535,575 - Ding , et al. Ja	2020-01-14
Washing Machine App 20190330781 - RYU; Myung-Hee ; et al.	2019-10-31
User terminal device and method for recognizing user'S location using sensor-based behavior recognition Grant 10,341,981 - Yu , et al.	2019-07-02
Interposer, Method Of Manufacturing Interposer, And Method Of Manufacturing Semiconductor Package App 20190131194 - DING; Shaofeng ; et al.	2019-05-02
Wiring structures and semiconductor devices Grant 10,229,876 - Kim , et al.	2019-03-12
User Terminal Device And Method For Recognizing User's Location Using Sensor-based Behavior Recognition App 20180249435 - YU; Seung-hak ; et al.	2018-08-30
Wiring Structures And Semiconductor Devices App 20160343660 - KIM; Jun-Jung ; et al.	2016-11-24
Methods for fabricating semiconductor devices using liner layers to avoid damage to underlying patterns Grant 9,396,988 - Lee , et al. July 19, 2	2016-07-19
Methods for Fabricating Semiconductor Devices Using Liner Layers to Avoid Damage to Underlying Patterns App 20160079115 - Lee; Kyoung-Woo ; et al.	2016-03-17
Monitoring test element groups (TEGs) for etching process and methods of manufacturing a semiconductor device using the same Grant 8,697,455 - Lee , et al. April 15, 2	2014-04-15
Semiconductor device and methods of forming the same Grant 8,384,131 - Lee , et al. February 26, 2	2013-02-26
Absorbable bulky multi-filament draw textured yarn, manufacturing method thereof and medical use using them Grant 8,317,826 - Park , et al. November 27, 2	2012-11-27
Methods of forming wiring structures Grant 8,298,911 - Lee October 30, 2	2012-10-30
Monitoring Test Element Groups (tegs) For Etching Process And Methods Of Manufacturing A Semiconductor Device Using The Same App 20120231564 - LEE; KYOUNG-WOO ; et al.	2012-09-13
Wiring structures Grant 8,232,653 - Lee July 31, 2	2012-07-31
Methods of forming insulation layer patterns and methods of manufacturing semiconductor devices including insulation layer patterns Grant 7,989,335 - Lee , et al. August 2, 2	2011-08-02
Methods Of Forming Wiring Structures App 20110183516 - Lee; Kyoung-Woo	2011-07-28
Methods For Forming Self-aligned Dual Stress Liners For Cmos Semiconductor Devices App 20110163387 - Lee; Kyoung Woo ; et al.	2011-07-07
Interconnections having double capping layer and method for forming the same Grant 7,951,712 - Lee , et al. May 31, 2	2011-05-31
Actuator for holographic information storing apparatus Grant 7,916,371 - Cheong , et al. March 29, 2	2011-03-29
Methods for forming self-aligned dual stress liners for CMOS semiconductor devices Grant 7,911,001 - Lee , et al. March 22, 2	2011-03-22
Methods for forming contacts for dual stress liner CMOS semiconductor devices Grant 7,816,271 - Lee , et al. October 19, 2	2010-10-19
Methods of forming insulation layer patterns and methods of manufacturing semiconductor devices including insulation layer patterns App 20100248436 - Lee; Kyoung-Woo ; et al.	2010-09-30
Wiring structures App 20100244255 - Lee; Kyoung-Woo	2010-09-30
CMOS integrated circuit devices having stressed NMOS and PMOS channel regions therein Grant 7,800,134 - Lee , et al. September 21, 2	2010-09-21
Methods for removing gate sidewall spacers in CMOS semiconductor fabrication processes Grant 7,790,622 - Lee , et al. September 7, 2	2010-09-07
Methods of forming CMOS integrated circuits that utilize insulating layers with high stress characteristics to improve NMOS and PMOS transistor carrier mobilities Grant 7,781,276 - Lee , et al. August 24, 2	2010-08-24
Absorbable bulky multi-filament draw textured yarn, manufacturing method thereof and medical use using them App 20100087856 - Park; Young Hwan ; et al.	2010-04-08
Semiconductor device having crack stop structure Grant 7,687,915 - Lee , et al. March 30, 2	2010-03-30
Actuator Using Piezoelectric Element And Method Of Driving The Same App 20100060966 - Cheong; Young-min ; et al.	2010-03-11
Methods of Fabricating Semiconductor Devices Including Porous Insulating Layers App 20100007021 - Choo; Jae-Ouk ; et al.	2010-01-14
Interconnections Having Double Capping Layer and Method for Forming the Same App 20100003814 - Lee; Kyoung-woo ; et al.	2010-01-07
Actuator For Holographic Information Storing Apparatus App 20090323150 - Cheong; Young-min ; et al.	2009-12-31
Method for forming interconnection line in semiconductor device and interconnection line structure Grant 7,635,645 - Lee , et al. December 22, 2	2009-12-22
Method of manufacturing semiconductor device including ultra low dielectric constant layer App 20090280637 - Lee; Kyoung-woo ; et al.	2009-11-12
Interconnections having double capping layer and method for forming the same Grant 7,605,472 - Lee , et al. October 20, 2	2009-10-20
Method of fabricating dual damascene interconnection and etchant for stripping sacrificial layer Grant 7,598,168 - Han , et al. October 6, 2	2009-10-06
Semiconductor wafer having embedded electroplating current paths to provide uniform plating over wafer surface Grant 7,586,175 - Lee , et al. September 8, 2	2009-09-08
CMOS Integrated Circuit Devices Having Stressed NMOS and PMOS Channel Regions Therein App 20090194817 - Lee; Kyoung-woo ; et al.	2009-08-06
Method for deciding network manager in home network Grant 7,568,024 - Lee , et al. July 28, 2	2009-07-28
Integrated circuit capacitor structure Grant 7,560,332 - Lee , et al. July 14, 2	2009-07-14
Methods of forming CMOS integrated circuit devices having stressed NMOS and PMOS channel regions therein and circuits formed thereby Grant 7,534,678 - Lee , et al. May 19, 2	2009-05-19
Methods of Forming CMOS Integrated Circuits that Utilize Insulating Layers with High Stress Characteristics to Improve NMOS and PMOS Transistor Carrier Mobilities App 20090124093 - Lee; Kyoung-woo ; et al.	2009-05-14
Semiconductor device having crack stop structure App 20090096104 - Lee; Kyoung-woo ; et al.	2009-04-16
Methods For Forming Dual Damascene Wiring Using Porogen Containing Sacrificial Via Filler Material App 20090075474 - Lee; Kyoung Woo ; et al.	2009-03-19
Semiconductor Device And Methods Of Forming The Same App 20090039480 - LEE; KYOUNG-WOO ; et al.	2009-02-12
Methods For Removing Gate Sidewall Spacers In CMOS Semiconductor Fabrication Processes App 20090017625 - Lee; Kyoung Woo ; et al.	2009-01-15
Methods For Forming Self-Aligned Dual Stress Liners For CMOS Semiconductor Devices App 20090014808 - Lee; Kyoung-Woo ; et al.	2009-01-15
Methods For Forming Contacts For Dual Stress Liner CMOS Semiconductor Devices App 20090017630 - Lee; Kyoung Woo ; et al.	2009-01-15
Integrated Interface Apparatus And Method For Heterogeneous Sensor Networks App 20090006522 - KIM; Mal-Hee ; et al.	2009-01-01
Structure of a CMOS image sensor and method for fabricating the same Grant 7,462,507 - Lee , et al. December 9, 2	2008-12-09
Methods of forming integrated circuit devices having metal interconnect structures therein Grant 7,435,673 - Lee , et al. October 14, 2	2008-10-14
Methods of Forming CMOS Integrated Circuit Devices Having Stressed NMOS and PMOS Channel Regions Therein and Circuits Formed Thereby App 20080242015 - Lee; Kyoung-woo ; et al.	2008-10-02
Semiconductor device and method of manufacturing the same Grant 7,417,302 - Lee , et al. August 26, 2	2008-08-26
Dual damascene interconnection with metal-insulator-metal capacitor and method of fabricating Grant 7,399,700 - Lee , et al. July 15, 2	2008-07-15
Structure of a CMOS image sensor and method for fabricating the same Grant 7,400,003 - Lee , et al. July 15, 2	2008-07-15
Physical vapor deposition methods for forming hydrogen-stuffed trench liners for copper-based metallization Grant 7,387,962 - Lee , et al. June 17, 2	2008-06-17
CMOS Integrated Circuits that Utilize Insulating Layers with High Stress Characteristics to Improve NMOS and PMOS Transistor Carrier Mobilities and Methods of Forming Same App 20080116521 - Lee; Kyoung-woo ; et al.	2008-05-22
Methods of forming dual-damascene interconnect structures on semiconductor substrates using multiple planarization layers having different porosity characteristics Grant 7,365,025 - Lee , et al. April 29, 2	2008-04-29
Semiconductor Wafer Having Embedded Electroplating Current Paths To Provide Uniform Plating Over Wafer Surface App 20080093746 - Lee; Kyoung Woo ; et al.	2008-04-24
Method of fabricating dual damascene interconnections of microelectronic device using diffusion barrier layer against base material Grant 7,323,407 - Lee , et al. January 29, 2	2008-01-29
Dual damascene interconnection with metal-insulator-metal capacitor and method of fabricating App 20070298580 - Lee; Kyoung-woo ; et al.	2007-12-27
Method of forming a via contact structure using a dual damascene process Grant 7,307,014 - Kim , et al. December 11, 2	2007-12-11
Methods of forming integrated circuit devices having metal interconnect layers therein Grant 7,282,451 - Hong , et al. October 16, 2	2007-10-16
Dual damascene interconnection with metal-insulator-metal-capacitor and method of fabricating the same Grant 7,279,733 - Lee , et al. October 9, 2	2007-10-09
Methods of forming copper vias with argon sputtering etching in dual damascene processes App 20070202689 - Choi; Seung-Man ; et al.	2007-08-30
Methods of forming dual-damascene interconnect structures on semiconductor substrates using multiple planarization layers having different porosity characteristics App 20070184649 - Lee; Kyoung-Woo ; et al.	2007-08-09
Integrated Circuit Capacitor Structure App 20070184610 - Lee; Kyoung-woo ; et al.	2007-08-09
Interconnections having double capping layer and method for forming the same App 20070138642 - Lee; Kyoung-woo ; et al.	2007-06-21
Integrated circuit capacitor structure Grant 7,229,875 - Lee , et al. June 12, 2	2007-06-12
Physical vapor deposition methods for forming hydrogen-stuffed trench liners for copper-based metallization, and resultant structures App 20070087567 - Lee; Kyoung-Woo ; et al.	2007-04-19
Interconnections having double capping layer and method for forming the same Grant 7,205,666 - Lee , et al. April 17, 2	2007-04-17
Methods of forming integrated circuit devices having metal interconnect structures therein App 20070072406 - Lee; Kyoung Woo ; et al.	2007-03-29
Method of forming interconnection lines for semiconductor device Grant 7,192,864 - Lee , et al. March 20, 2	2007-03-20
Methods of forming integrated circuit devices having metal interconnect layers therein App 20070045123 - Hong; Duk Ho ; et al.	2007-03-01
Method of fabricating dual damascene interconnections of microelectronic device using hybrid low k-dielectric and carbon-free inorganic filler Grant 7,183,195 - Lee , et al. February 27, 2	2007-02-27
Method of forming metal interconnection layer of semiconductor device Grant 7,157,366 - Kim , et al. January 2, 2	2007-01-02
Selective copper alloy interconnections in semiconductor devices and methods of forming the same App 20060289999 - Lee; Hyo-Jong ; et al.	2006-12-28
Interconnections having double capping layer and method for forming the same App 20060163736 - Lee; Kyoung-woo ; et al.	2006-07-27
Method of forming dual damascene metal interconnection employing sacrificial metal oxide layer Grant 7,064,059 - Kim , et al. June 20, 2	2006-06-20
Methods for forming dual damascene wiring using porogen containing sacrificial via filler material App 20060121721 - Lee; Kyoung Woo ; et al.	2006-06-08
Interconnections having double capping layer and method for forming the same Grant 7,037,835 - Lee , et al. May 2, 2	2006-05-02
Dual damascene process Grant 7,033,944 - Park , et al. April 25, 2	2006-04-25
Method of forming dual damascene interconnection using low-k dielectric material Grant 7,022,600 - Kim , et al. April 4, 2	2006-04-04
Method of fabricating dual damascene interconnections of microelectronic device using diffusion barrier layer against base material App 20060063376 - Lee; Kyoung-woo ; et al.	2006-03-23
Semiconductor device and method of manufacturing the same App 20060009065 - Lee; Kyoung-Woo ; et al.	2006-01-12
Method of forming a via contact structure using a dual damascene process App 20060003574 - Kim; Jae-Hak ; et al.	2006-01-05
Void-free metal interconnection structure and method of forming the same Grant 6,953,745 - Ahn , et al. October 11, 2	2005-10-11
Method of fabricating semiconductor devices having low dielectric interlayer insulation layer Grant 6,936,533 - Kim , et al. August 30, 2	2005-08-30
Method of fabricating dual damascene interconnection and etchant for stripping sacrificial layer App 20050176243 - Han, Sang-cheol ; et al.	2005-08-11
Method of forming interconnection lines for semiconductor device App 20050176236 - Lee, Kyoung-Woo ; et al.	2005-08-11
Method for forming interconnection line in semiconductor device and interconnection line structure App 20050161821 - Lee, Kyoung-Woo ; et al.	2005-07-28
Method of forming dual damascene metal interconnection employing sacrificial metal oxide layer App 20050124149 - Kim, Jae-Hak ; et al.	2005-06-09
Structure of a CMOS image sensor and method for fabricating the same App 20050088551 - Lee, Soo-Geun ; et al.	2005-04-28
Structure of a CMOS image sensor and method for fabricating the same App 20050087784 - Lee, Soo-Genn ; et al.	2005-04-28
Method for forming metal wiring layer of semiconductor device Grant 6,861,347 - Lee , et al. March 1, 2	2005-03-01
Structure of a CMOS image sensor and method for fabricating the same Grant 6,861,686 - Lee , et al. March 1, 2	2005-03-01
Method of forming metal interconnection layer of semiconductor device App 20050037605 - Kim, Il-Goo ; et al.	2005-02-17
Method for forming a dual damascene wiring pattern in a semiconductor device Grant 6,855,629 - Kim , et al. February 15, 2	2005-02-15
Apparatus and method for providing file structure for multimedia streaming service Grant 6,856,997 - Lee , et al. February 15, 2	2005-02-15
Void-free metal interconnection steucture and method of forming the same App 20050029010 - Ahn, Jeong-hoon ; et al.	2005-02-10
Inter-metal dielectric patterns and method of forming the same Grant 6,849,536 - Lee , et al. February 1, 2	2005-02-01
Method of manufacturing interconnection line in semiconductor device Grant 6,828,229 - Lee , et al. December 7, 2	2004-12-07
Method for forming metal wiring layer of semiconductor device Grant 6,815,331 - Lee , et al. November 9, 2	2004-11-09
Dual damascene interconnection with metal-insulator-metal capacitor and method of fabricating the same App 20040197991 - Lee, Kyoung-woo ; et al.	2004-10-07
Structure of a CMOS image sensor and method for fabricating the same App 20040140564 - Lee, Soo-Geun ; et al.	2004-07-22
Interconnections having double capping layer and method for forming the same App 20040135261 - Lee, Kyoung-woo ; et al.	2004-07-15
Integrated circuit capacitor structure App 20040137694 - Lee, Kyoung-Woo ; et al.	2004-07-15
Method of fabricating dual damascene interconnections of microelectronic device using hybrid low k-dielectric and carbon-free inorganic filler App 20040132291 - Lee, Kyoung-woo ; et al.	2004-07-08
Method of forming dual damascene interconnection using low-k dielectric material App 20040067634 - Kim, Jae-Hak ; et al.	2004-04-08
Dual damamscene process App 20040058538 - Park, Wan-Jae ; et al.	2004-03-25
Method of patterning inter-metal dielectric layers App 20040029386 - Lee, Kwang Hee ; et al.	2004-02-12
Method for forming a dual damascene wiring pattern in a semiconductor device App 20040018721 - Kim, Jae-Hak ; et al.	2004-01-29
Inter-metal dielectric patterns and method of forming the same App 20030186538 - Lee, Soo-Geun ; et al.	2003-10-02
Method for forming dual damascene structure in semiconductor device Grant 6,627,540 - Lee September 30, 2	2003-09-30
Method for forming metal wiring layer of semiconductor device App 20030176056 - Lee, Kyoung-Woo ; et al.	2003-09-18
Method for deciding network manager in home network App 20030131101 - Lee, Kyoung-Woo ; et al.	2003-07-10
Method for forming dual damascene structure in semiconductor device App 20030109132 - Lee, Kyoung-woo	2003-06-12
Method for forming metal wiring layer of semiconductor device App 20020173143 - Lee, Kyoung-woo ; et al.	2002-11-21
Method of manufacturing interconnection line in semiconductor device App 20020168849 - Lee, Soo-geun ; et al.	2002-11-14
Method of setting up a display window App 20020149624 - Lee, Kyoung Woo ; et al.	2002-10-17
Method of fabricating semiconductor devices having low dielectric interlayer insulation layer App 20020106891 - Kim, Jae-Hak ; et al.	2002-08-08
File structure for streaming service, apparatus and method for providing streaming service using the same App 20020062313 - Lee, Kyoung Woo ; et al.	2002-05-23
Method and apparatus for monitoring network state App 20010005360 - Lee, Kyoung-Woo ; et al.	2001-06-28
Method for storing parity and rebuilding data contents of failed disks in an external storage subsystem and apparatus thereof Grant 6,158,017 - Han , et al. December 5, 2	2000-12-05