LEE; KWAN-JAi

Patent Applications and Registrations

Patent applications and USPTO patent grants for LEE; KWAN-JAi.The latest application filed is for "chip on film package and display device including the same".

Company Profile

0.15.15

LEE; KWAN-JAi - YONGIN-SI KR
Lee; Kwan-jai - Gyeonggi-do N/A KR
Lee; Kwan-Jai - Cheonan-si KR
Lee; Kwan-Jai - Chungcheongnam-do KR
Lee; Kwan Jai - Cheonan KR
Lee, Kwan Jai - Cheonan-city KR
Lee, Kwan-Jai - Chungcheongnam KR
Lee; Kwan Jai - Suwon KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chip On Film Package And Display Device Including The Same App 20160162091 - HA; JEONG-KYU ; et al.	2016-06-09
Chip on film package and display device including the same Grant 9,280,182 - Ha , et al. March 8, 2	2016-03-08
Tape wiring substrate and chip-on-film package including the same Grant 9,113,545 - Han , et al. August 18, 2	2015-08-18
Chip on film (COF) substrate, COF package and display device including the same Grant 9,059,162 - Ha , et al. June 16, 2	2015-06-16
Chip on film package including test pads and semiconductor devices including the same Grant 8,853,694 - Han , et al. October 7, 2	2014-10-07
Chip On Film Package And Display Device Including The Same App 20140246687 - Ha; Jeong-Kyu ; et al.	2014-09-04
Semiconductor package Grant 8,803,301 - Cho , et al. August 12, 2	2014-08-12
Chip on Film (COF) Substrate, COF Package and Display Device Including the Same App 20140054793 - Ha; Jeong-Kyu ; et al.	2014-02-27
Semiconductor chip package Grant 8,629,547 - Cho , et al. January 14, 2	2014-01-14
Chip On Film Package Including Test Pads And Semiconductor Devices Including The Same App 20130175528 - Han; Sang-Uk ; et al.	2013-07-11
Tape Wiring Substrate And Chip-on-film Package Including The Same App 20130148312 - Han; Sang-Uk ; et al.	2013-06-13
Semiconductor Package App 20120274868 - Cho; Kyong-soon ; et al.	2012-11-01
Semiconductor Chip Package App 20120074540 - CHO; Kyong-Soon ; et al.	2012-03-29
Method Of Fabricating Film Circuit Substrate And Method Of Fabricating Chip Package Including The Same App 20120021600 - Han; Sang-Uk ; et al.	2012-01-26
Tape circuit substrate and semiconductor apparatus employing the same Grant 7,339,262 - Son , et al. March 4, 2	2008-03-04
Tape circuit substrate having wavy beam leads and semiconductor chip package using the same Grant 7,247,936 - Son , et al. July 24, 2	2007-07-24
Tape circuit substrate and semiconductor apparatus employing the same App 20050093114 - Son, Dae-Woo ; et al.	2005-05-05
Thin stacked package and manufacturing method thereof Grant 6,878,570 - Lyu , et al. April 12, 2	2005-04-12
Thin stacked package Grant 6,849,949 - Lyu , et al. February 1, 2	2005-02-01
Thin stacked package and manufacturing method thereof App 20050003581 - Lyu, Ju Hyun ; et al.	2005-01-06
Solid-state imaging apparatus and method for making the same App 20040263667 - Lee, Kwan-Jai ; et al.	2004-12-30
Tape circuit substrate having wavy beam leads and semiconductor chip package using the same App 20040178501 - Son, Dae-Woo ; et al.	2004-09-16
Three-dimensional multi-chip package having chip selection pads and manufacturing method thereof Grant 6,448,661 - Kim , et al. September 10, 2	2002-09-10
Three-dimensional Multi-chip Package Having Chip Selection Pads And Manufacturing Method Thereof App 20020109236 - Kim, Hyeong-Seob ; et al.	2002-08-15
Semiconductor chip stack package and fabrication method thereof App 20020084519 - Choi, Ill-Heung ; et al.	2002-07-04
Multi-chip package Grant 6,087,722 - Lee , et al. July 11, 2	2000-07-11

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