Lee; Kuei-Pin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Kuei-Pin.The latest application filed is for "device and method for reducing contact resistance of a metal".
- Lee; Kuei-Pin - New Taipei TW
- LEE; Kuei-Pin - New Taipei City TW
| Patent | Date |
|---|---|
| Device and method for reducing contact resistance of a metal Grant 11,177,168 - Lee , et al. November 16, 2 | 2021-11-16 |
| Device And Method For Reducing Contact Resistance Of A Metal App 20190252247 - LEE; Ya-Lien ; et al. | 2019-08-15 |
| Device and method for reducing contact resistance of a metal Grant 10,276,431 - Lee , et al. | 2019-04-30 |
| Device and Method for Reducing Contact Resistance of a Metal App 20180174898 - Lee; Ya-Lien ; et al. | 2018-06-21 |
| Device and method for reducing contact resistance of a metal Grant 9,892,963 - Lee , et al. February 13, 2 | 2018-02-13 |
| Device and Method for Reducing Contact Resistance of a Metal App 20160111327 - Lee; Ya-Lien ; et al. | 2016-04-21 |
| Device and method for reducing contact resistance of a metal Grant 9,159,666 - Lee , et al. October 13, 2 | 2015-10-13 |
| Barrier layer for copper interconnect Grant 9,064,934 - Lin , et al. June 23, 2 | 2015-06-23 |
| Barrier Layer for Copper Interconnect App 20150044867 - Lin; Yu-Hung ; et al. | 2015-02-12 |
| Device and Method for Reducing Contact Resistance of a Metal App 20140332962 - Lee; Ya-Lien ; et al. | 2014-11-13 |
| Barrier layer for copper interconnect Grant 8,872,342 - Lin , et al. October 28, 2 | 2014-10-28 |
| Method for forming seed layer structure Grant 8,778,801 - Chiang , et al. July 15, 2 | 2014-07-15 |
| Barrier Layer for Copper Interconnect App 20140191402 - Lin; Yu-Hung ; et al. | 2014-07-10 |
| Barrier layer for copper interconnect Grant 8,722,531 - Lin , et al. May 13, 2 | 2014-05-13 |
| Barrier Layer For Copper Interconnect App 20140117547 - Lin; Yu-Hung ; et al. | 2014-05-01 |
| Seed Layer Structure and Method App 20140084470 - Chiang; Chen-Bin ; et al. | 2014-03-27 |
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