Lee; Kuang-Shin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Kuang-Shin.The latest application filed is for "method for manufacturing gold bumps".
- Lee; Kuang-Shin - Hsinchu TW
- Lee; Kuang-Shin - Hsin-Chu City TW
- Lee; Kuang-Shin - Hsinchu City TW
- Lee; Kuang-Shin - Hsin-Chu TW
| Patent | Date |
|---|---|
| Camera module Grant 7,663,693 - Sun , et al. February 16, 2 | 2010-02-16 |
| Manufacturing method of a quad flat no-lead package structure Grant 7,531,381 - Pan , et al. May 12, 2 | 2009-05-12 |
| Quad flat no-lead package structure and manufacturing method thereof Grant 7,291,908 - Pan , et al. November 6, 2 | 2007-11-06 |
| Method for Manufacturing Gold Bumps App 20060211232 - Liu; Mei-Jen ; et al. | 2006-09-21 |
| Manufacturing Method Of A Quad Flat No-lead Package Structure App 20060131723 - Pan; Jui-Hsiang ; et al. | 2006-06-22 |
| Image sensor and fabricating method thereof Grant 7,060,592 - Pan , et al. June 13, 2 | 2006-06-13 |
| Image Sensor And Fabricating Method Thereof App 20060057764 - Pan; Jui-Hsiang ; et al. | 2006-03-16 |
| Chip on photosensitive device package structure and electrical connection thereof Grant 7,009,287 - Sun , et al. March 7, 2 | 2006-03-07 |
| Chip on photosensitive device package structure and electrical connection thereof App 20050189624 - Sun, Cheng-Kuang ; et al. | 2005-09-01 |
| Camera module App 20050190290 - Sun, Cheng-Kuang ; et al. | 2005-09-01 |
| Package structure for optical image sensing integrated circuits Grant 6,930,398 - Sun , et al. August 16, 2 | 2005-08-16 |
| Process for manufacturing photosensitive module Grant 6,921,681 - Sun , et al. July 26, 2 | 2005-07-26 |
| Process for manufacturing semiconductor device App 20050095739 - Sun, Cheng-Kuang ; et al. | 2005-05-05 |
| [quad Flat No-lead Package Structure And Manufacturing Method Thereof] App 20050073055 - Pan, Jui-Hsiang ; et al. | 2005-04-07 |
| Process for manufacturing semiconductor device App 20050074916 - Sun, Cheng-Kuang ; et al. | 2005-04-07 |
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