loadpatents
Patent applications and USPTO patent grants for Lee; Koh Eun.The latest application filed is for "light-emitting element package and light-emitting element module including same".
Patent | Date |
---|---|
Semiconductor device package Grant 11,355,674 - Lee , et al. June 7, 2 | 2022-06-07 |
Semiconductor device package Grant 11,335,843 - Lee , et al. May 17, 2 | 2022-05-17 |
Light-emitting Element Package And Light-emitting Element Module Including Same App 20210305465 - LEE; Koh Eun | 2021-09-30 |
Semiconductor Device Package App 20210273148 - LEE; Koh Eun | 2021-09-02 |
Light-emitting device package Grant 11,101,250 - Lee August 24, 2 | 2021-08-24 |
Semiconductor Device Package App 20210217932 - LEE; Koh Eun | 2021-07-15 |
Semiconductor Device Package App 20210013378 - LEE; Seung Jae ;   et al. | 2021-01-14 |
Semiconductor device package Grant 10,886,449 - Lee January 5, 2 | 2021-01-05 |
Semiconductor Device Package App 20200350468 - LEE; Koh Eun ;   et al. | 2020-11-05 |
Semiconductor Device Package App 20190371991 - LEE; Koh Eun | 2019-12-05 |
Light-emitting Device Package App 20190363071 - LEE; Koh Eun | 2019-11-28 |
Light-emitting device and lighting device having same Grant 10,305,006 - Lee , et al. | 2019-05-28 |
Semiconductor Device Package App 20190074422 - LEE; Koh Eun ;   et al. | 2019-03-07 |
Light-emitting Device And Lighting Device Having Same App 20180315908 - LEE; Koh Eun ;   et al. | 2018-11-01 |
Light Emitting Device App 20170077354 - LEE; Koh Eun ;   et al. | 2017-03-16 |
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