Lee; Ko-Yi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Ko-Yi.The latest application filed is for "package structures".
- Lee; Ko-Yi - Hsinchu TW
- LEE; KO-YI - New Taipei TW
- Lee; Ko-Yi - Hsin-Chu TW
- Lee; Ko-Yi - Hsinchu City TW
| Patent | Date |
|---|---|
| Package Structures App 20190139916 - Kuo; Hsi-Yu ; et al. | 2019-05-09 |
| Package structures Grant 10,283,468 - Kuo , et al. | 2019-05-07 |
| Split Touch Device, Touch Screen Data Transmission System And Method App 20180275812 - LEE; KO-YI ; et al. | 2018-09-27 |
| Data transmission system and communication method Grant 10,085,204 - Chiang , et al. September 25, 2 | 2018-09-25 |
| Data Transmission System And Communication Method App 20160278005 - CHIANG; CHI-KANG ; et al. | 2016-09-22 |
| Semiconductor device and method of forming the same Grant 9,431,356 - Kuo , et al. August 30, 2 | 2016-08-30 |
| Semiconductor Device And Method Of Forming The Same App 20140339676 - Kuo; Hsi-Yu ; et al. | 2014-11-20 |
| Test structure Grant 7,939,824 - Peng , et al. May 10, 2 | 2011-05-10 |
| Test Structure App 20090121222 - Peng; Ta-Chih ; et al. | 2009-05-14 |
| Test structure Grant 7,498,680 - Peng , et al. March 3, 2 | 2009-03-03 |
| Test structure App 20080135840 - Peng; Ta-Chih ; et al. | 2008-06-12 |
| Bonding Pad Structure And Method Of Forming The Same App 20070042593 - Lee; Jian-Hsing ; et al. | 2007-02-22 |
| Bonding pad structure and method of forming the same Grant 7,148,574 - Lee , et al. December 12, 2 | 2006-12-12 |
| Bonding pad structure and method of forming the same App 20050230847 - Lee, Jian-Hsing ; et al. | 2005-10-20 |
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