Lee; Kian Chai

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Kian Chai.The latest application filed is for "balanced semiconductor device packages including lead frame with floating leads and associated methods".

Company Profile

0.14.16

Lee; Kian Chai - Singapore SG
Lee; Kian Chai - Sinagpore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Balanced semiconductor device packages including lead frame with floating leads and associated methods Grant 8,084,846 - Lee , et al. December 27, 2	2011-12-27
Apparatus for flip-chip packaging providing testing capability Grant 7,915,718 - Lee , et al. March 29, 2	2011-03-29
Balanced semiconductor device packages including lead frame with floating leads and associated methods App 20080122072 - Lee; Teck Kheng ; et al.	2008-05-29
Methods for designing carrier substrates with raised terminals Grant 7,368,391 - Tan , et al. May 6, 2	2008-05-06
Double bumping of flexible substrate for first and second level interconnects Grant 7,320,933 - Lee , et al. January 22, 2	2008-01-22
Method and apparatus for flip-chip packaging providing testing capability App 20060240595 - Lee; Teck Kheng ; et al.	2006-10-26
BOC BGA package for die with I-shaped bond pad layout Grant 7,112,048 - Lim , et al. September 26, 2	2006-09-26
Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks Grant 7,061,124 - Tan , et al. June 13, 2	2006-06-13
Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods Grant 7,018,871 - Tan , et al. March 28, 2	2006-03-28
Method for package reduction in stacked chip and board assemblies Grant 7,005,316 - Lee , et al. February 28, 2	2006-02-28
Methods for designing carrier substrates with raised terminals App 20050287702 - Victor Tan, Cher Khng ; et al.	2005-12-29
Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks App 20050029676 - Tan, Cher Khng Victor ; et al.	2005-02-10
Double bumping of flexible substrate for first and second level interconnects App 20040198033 - Lee, Teck Kheng ; et al.	2004-10-07
Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks Grant 6,787,923 - Tan , et al. September 7, 2	2004-09-07
Apparatus for package reduction in stacked chip and board assemblies Grant 6,787,917 - Lee , et al. September 7, 2	2004-09-07
Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods App 20040077109 - Tan, Cher Khng Victor ; et al.	2004-04-22
BOC BGA package for die with I-shaped bond pad layout Grant 6,720,666 - Lim , et al. April 13, 2	2004-04-13
Double bumping of flexible substrate for first and second level interconnects App 20040036170 - Lee, Teck Kheng ; et al.	2004-02-26
BOC BGA package for die with I-shaped bond pad layout Grant 6,692,987 - Lim , et al. February 17, 2	2004-02-17
Method and apparatus for distributing mold material in a mold for packaging microelectronic devices Grant 6,656,769 - Lee , et al. December 2, 2	2003-12-02
BOC BGA package for die with I-shaped bond pad layout App 20030211659 - Lim, Thiam Chye ; et al.	2003-11-13
BOC BGA package for die with I-shaped bond pad layout App 20030211660 - Lim, Thiam Chye ; et al.	2003-11-13
Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods App 20030193092 - Tan, Cher Khng Victor ; et al.	2003-10-16
Apparatus for package reduction in stacked chip and board assemblies App 20030164550 - Lee, Teck Kheng ; et al.	2003-09-04
Method and apparatus for flip-chip packaging providing testing capability App 20030164551 - Lee, Teck Kheng ; et al.	2003-09-04
BOC BGA package for die with I-shaped bond pad layout App 20030148557 - Lim, Thiam Chye ; et al.	2003-08-07
Apparatus for package reduction in stacked chip and board assemblies Grant 6,583,502 - Lee , et al. June 24, 2	2003-06-24
Method and apparatus for package reduction in stacked chip and board assemblies App 20030102546 - Lee, Teck Kheng ; et al.	2003-06-05
Method and apparatus for package reduction in stacked chip and board assemblies App 20020149097 - Lee, Teck Kheng ; et al.	2002-10-17
Method and apparatus for distributing mold material in a mold for packaging microelectronic devices App 20020072153 - Lee, Kian Chai ; et al.	2002-06-13

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