LEE; Keunhyuk

Patent Applications and Registrations

Patent applications and USPTO patent grants for LEE; Keunhyuk.The latest application filed is for "power module and related methods".

Company Profile

6.10.18

LEE; Keunhyuk - Suzhou CN
Lee; Keunhyuk - Jiangsu CN
Lee; Keunhyuk - Bucheon-si KR
Lee; Keunhyuk - Bucheon City KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Power Module And Related Methods App 20220208654 - BAEK; Jonghwan ; et al.	2022-06-30
Dual Cool Power Module With Stress Buffer Layer App 20220199602 - BAEK; Jonghwan ; et al.	2022-06-23
Module With Substrate Recess For Conductive-bonding Component App 20220189848 - GU; Leo ; et al.	2022-06-16
Leadframe with sockets for solderless pins Grant 11,315,856 - Maldo , et al. April 26, 2	2022-04-26
Isolated 3d Semiconductor Device Package App 20220020740 - MALDO; Tiburcio A. ; et al.	2022-01-20
Power semiconductor device package Grant 11,222,832 - Maldo , et al. January 11, 2	2022-01-11
High power module semiconductor package with multiple submodules Grant 11,127,651 - Chang , et al. September 21, 2	2021-09-21
Power Module Package And Method Of Manufacturing The Same Related Application App 20210265175 - LEE; Keunhyuk ; et al.	2021-08-26
Semiconductor Clip And Related Methods App 20210159157 - LEE; Keunhyuk ; et al.	2021-05-27
Power module package Grant 11,004,698 - Lee , et al. May 11, 2	2021-05-11
Press-fit Power Module And Related Methods App 20210021065 - CHANG; Jie ; et al.	2021-01-21
Leadframe With Sockets For Solderless Pins App 20200365493 - MALDO; Tiburcio ; et al.	2020-11-19
Press-fit power module and related methods Grant 10,804,626 - Chang , et al. October 13, 2	2020-10-13
Power Semiconductor Device Package App 20200258824 - A1	2020-08-13
Leadframe with sockets for solderless pins Grant 10,741,480 - Maldo , et al. A	2020-08-11
High Power Module Semiconductor Package With Multiple Submodules App 20200194336 - Chang; Jie ; et al.	2020-06-18
Press-fit Power Module And Related Methods App 20200144744 - CHANG; Jie ; et al.	2020-05-07
Press-fit power module and related methods Grant 10,566,713 - Chang , et al. Feb	2020-02-18
High power module semiconductor package with multiple submodules Grant 10,553,517 - Chang , et al. Fe	2020-02-04
Leadframe With Sockets For Solderless Pins App 20190304883 - MALDO; Tiburcio ; et al.	2019-10-03
High Power Module Semiconductor Package With Multiple Submodules App 20190221493 - CHANG; Jie ; et al.	2019-07-18
Press-fit Power Module And Related Methods App 20190214749 - CHANG; Jie ; et al.	2019-07-11
Power Module Package And Method Of Manufacturing The Same App 20150103498 - Lee; Keunhyuk ; et al.	2015-04-16
Power module package having excellent heat sink emission capability and method for manufacturing the same Grant 8,890,310 - Lee , et al. November 18, 2	2014-11-18
Power Module Package Having Excellent Heat Sink Emission Capability And Method For Manufacturing The Same App 20100176498 - Lee; Keunhyuk ; et al.	2010-07-15
Power Module Package Having Excellent Heat Sink Emission Capability And Method For Manufacturing The Same App 20100013070 - Lee; Joosang ; et al.	2010-01-21
Power module package having excellent heat sink emission capability and method for manufacturing the same App 20060056213 - Lee; Joosang ; et al.	2006-03-16

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