Lee; Kang-Feng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Kang-Feng.The latest application filed is for "transfer method of expanding pitches of device and an apparatus for performing the same".

Company Profile

2.4.9

Lee; Kang-Feng - Taipei TW
Lee; Kang-Feng - Taipei City TW
Lee; Kang-Feng - Hsinchu County TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Transfer method of expanding pitches of device and an apparatus for performing the same Grant 10,510,287 - Lee , et al. Dec	2019-12-17
Transfer Method Of Expanding Pitches Of Device And An Apparatus For Performing The Same App 20190043416 - Lee; Kang-Feng ; et al.	2019-02-07
Multi-diameter clamp for clamping on tires of different sizes Grant 10,040,498 - Sun , et al. August 7, 2	2018-08-07
Multi-diameter Clamp For Clamping On Tires Of Different Sizes App 20160176304 - SUN; Yuan-Heng ; et al.	2016-06-23
Combo Connector For Micro Sd And Micro Usb/ssic Thin Cards App 20150180147 - SUN; YUAN-HENG ; et al.	2015-06-25
Encapsulation film, package structure utilizing the same, and method for forming the package structure Grant 8,896,135 - Wang , et al. November 25, 2	2014-11-25
Uniform Magnetic Field Generating Equipment And Magnetic Field Generating Unit Thereof App 20120119858 - Lee; Kang-Feng ; et al.	2012-05-17
Plasma Enhanced Atomic Layer Deposition Apparatus And The Controlling Method Thereof App 20120070590 - Huang; Jen-Rong ; et al.	2012-03-22
Encapsulation Film, Package Structure Utilizing The Same, And Method For Forming The Package Structure App 20120032355 - Wang; Ching-Chiun ; et al.	2012-02-09
Magnetic Modue Of Electron Cyclotron Resonance And Electron Cyclotron Resonance Apparatus Using The Same App 20120001550 - Chang; Chih-Chen ; et al.	2012-01-05
Structure For Increasing Utilization Rate Of Target App 20110132758 - Lee; Kang-Feng ; et al.	2011-06-09
Transmission Device For Thin And Brittleness Substrate App 20100116623 - Du; Chen-Chung ; et al.	2010-05-13

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