loadpatents
name:-0.012434959411621
name:-0.0077090263366699
name:-0.0017440319061279
LEE; Jung Do Patent Filings

LEE; Jung Do

Patent Applications and Registrations

Patent applications and USPTO patent grants for LEE; Jung Do.The latest application filed is for "authentication system and method, and user equipment, authentication server, and service server for performing same method".

Company Profile
1.7.11
  • LEE; Jung Do - Seoul KR
  • Lee; Jung-Do - Uiwang-Si N/A KR
  • LEE; Jung-Do - Gyeonggi-do KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Authentication System And Method, And User Equipment, Authentication Server, And Service Server For Performing Same Method
App 20190190723 - LEE; Jung Do ;   et al.
2019-06-20
Semiconductor packages having a guide wall and related systems and methods
Grant 9,343,535 - Lee , et al. May 17, 2
2016-05-17
Semiconductor Packages Having a Guide Wall and Related Systems and Methods
App 20140084442 - Lee; Jung-Do ;   et al.
2014-03-27
Semiconductor Package And Method Of Manufacturing The Same
App 20140061890 - Lee; Jung-Do ;   et al.
2014-03-06
Semiconductor chips having guard rings and methods of fabricating the same
Grant 8,623,743 - Lee , et al. January 7, 2
2014-01-07
Semiconductor Package Having Protective Layer And Method Of Forming The Same
App 20130241044 - KIM; Hyun-Ki ;   et al.
2013-09-19
Semiconductor Chips Having Guard Rings And Methods Of Fabricating The Same
App 20130130472 - LEE; Jung-Do ;   et al.
2013-05-23
Semiconductor chips having guard rings and methods of fabricating the same
Grant 8,354,735 - Lee , et al. January 15, 2
2013-01-15
Semiconductor package and method for manufacturing the same
Grant 8,304,876 - Byun , et al. November 6, 2
2012-11-06
Electronic Device Having Stack-type Semiconductor Package And Method Of Forming The Same
App 20120199964 - LEE; JUNG-DO ;   et al.
2012-08-09
Electronic device having stack-type semiconductor package and method of forming the same
Grant 8,184,449 - Lee , et al. May 22, 2
2012-05-22
Semiconductor Chips Having Guard Rings And Methods Of Fabricating The Same
App 20110057297 - Lee; Jung-Do ;   et al.
2011-03-10
Semiconductor package and method for manufacturing the same
App 20100038765 - Byun; Hak-Kyoon ;   et al.
2010-02-18
Stack-type Semiconductor Package, Method Of Forming The Same And Electronic System Including The Same
App 20090085185 - BYUN; Hak-Kyoon ;   et al.
2009-04-02
Electronic Device Having Stack-type Semiconductor Package And Method Of Forming The Same
App 20090067143 - Lee; Jung-Do ;   et al.
2009-03-12

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