loadpatents
Patent applications and USPTO patent grants for LEE; Jun Hong.The latest application filed is for "grinding powder refill cosmetic container".
Patent | Date |
---|---|
Grinding Powder Refill Cosmetic Container App 20210378382 - LEE; Jun Hong ;   et al. | 2021-12-09 |
Heating apparatus Grant 10,145,583 - Leow , et al. De | 2018-12-04 |
Heating Apparatus App 20130272685 - LEOW; Yuen Kee ;   et al. | 2013-10-17 |
Sliding opening and closing device and a portable terminal having the same Grant 8,369,909 - Park , et al. February 5, 2 | 2013-02-05 |
Apparatus For Generating Control Data App 20120051495 - HWANG; Jong-Tae ;   et al. | 2012-03-01 |
Sliding mechanism for opening and closing of cellular phone Grant 7,869,844 - Lee , et al. January 11, 2 | 2011-01-11 |
Sliding mechanism of portable communication terminals Grant 7,774,033 - Lee August 10, 2 | 2010-08-10 |
Sliding Opening And Closing Device And A Portable Terminal Having The Same App 20100029348 - Lee; Jun-Hong ;   et al. | 2010-02-04 |
Sliding opening and closing device and a portable terminal having the same Grant 7,599,723 - Lee , et al. October 6, 2 | 2009-10-06 |
Slide-Up Opening and Closing Mechanism For Portable Terminal App 20080161075 - Kim; Si-Wan ;   et al. | 2008-07-03 |
Sliding Mechanism for Opening and Closing of Cellular Phone App 20080058039 - Lee; Jun-Hong ;   et al. | 2008-03-06 |
Sliding mechanism or portable communication terminals App 20070128904 - Kang; Kyung-Seok ;   et al. | 2007-06-07 |
Singulation method used in leadless packaging process Grant 7,205,658 - Lee , et al. April 17, 2 | 2007-04-17 |
Sliding opening and closing device and a portalbe terminal having the same App 20070032278 - Lee; Jun-Hong ;   et al. | 2007-02-08 |
Multi-chip image sensor package module App 20060016973 - Yang; Jun-Young ;   et al. | 2006-01-26 |
Singulation method used in leadless packaging process App 20050037618 - Lee, Jun Hong ;   et al. | 2005-02-17 |
Singulation method used in leadless packaging process Grant 6,773,961 - Lee , et al. August 10, 2 | 2004-08-10 |
Method for packaging a semiconductor chip Grant 6,242,284 - Kang , et al. June 5, 2 | 2001-06-05 |
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