loadpatents
name:-0.033070087432861
name:-0.11394906044006
name:-0.0084500312805176
Lee; Jun-Der Patent Filings

Lee; Jun-Der

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Jun-Der.The latest application filed is for "stud bump and package structure thereof and method of manufacturing the same".

Company Profile
0.8.21
  • Lee; Jun-Der - Taichung TW
  • Lee; Jun-Der - Taichung City TW
  • LEE; Jun-Der - Lu-Chu Hsiang TW
  • Lee; Jun-Der - Tao-Yuan Hsieng TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Copper-based alloy wire and methods for manufaturing the same
Grant 9,997,488 - Chuang , et al. June 12, 2
2018-06-12
Stud bump structure and method for manufacturing the same
Grant 9,490,147 - Chuang , et al. November 8, 2
2016-11-08
Stud bump and package structure thereof and method of manufacturing the same
Grant 9,425,168 - Chuang , et al. August 23, 2
2016-08-23
Stud Bump And Package Structure Thereof And Method Of Manufacturing The Same
App 20150194409 - Chuang; Tung-Han ;   et al.
2015-07-09
Alloy wire and methods for manufacturing the same
Grant 8,940,403 - Lee , et al. January 27, 2
2015-01-27
Copper-based Alloy Wire And Methods For Manufaturing The Same
App 20140209215 - CHUANG; Tung-Han ;   et al.
2014-07-31
Stud Bump Structure And Method For Manufacturing The Same
App 20140124920 - CHUANG; Tung-Han ;   et al.
2014-05-08
Composite Wire Of Silver-palladium Alloy Coated With Metallic Thin Film And Method Thereof
App 20130233593 - LEE; Jun-Der ;   et al.
2013-09-12
Composite Wire Of Silver-gold-palladium Alloy Coated With Metal Thin Film And Method Thereof
App 20130233594 - LEE; Jun-Der ;   et al.
2013-09-12
Alloy Wire And Methods For Manufacturing The Same
App 20130171470 - LEE; Jun-Der ;   et al.
2013-07-04
Manufacturing Method For Composite Alloy Bonding Wire
App 20130160902 - LEE; Jun-Der
2013-06-27
Composite Alloy Bonding Wire
App 20130164169 - Lee; Jun-Der
2013-06-27
Composite Alloy Bonding Wire And Manufacturing Method Thereof
App 20120093681 - LEE; Jun-Der
2012-04-19
Manufacturing method for composite alloy bonding wire
Grant 8,101,030 - Lee January 24, 2
2012-01-24
Composite alloy bonding wire and manufacturing method thereof
Grant 8,101,123 - Lee January 24, 2
2012-01-24
Manufacturing Method For Composite Alloy Bonding Wire
App 20100319872 - LEE; Jun-Der
2010-12-23
Composite Alloy Bonding Wire And Manufacturing Method Thereof
App 20100239456 - LEE; Jun-Der
2010-09-23
Composite Alloy Bonding Wire And Manufacturing Method Thereof
App 20100239455 - LEE; Jun-Der
2010-09-23
Manufacturing Method For A Silver Alloy Bonding Wire And Products Thereof
App 20090297391 - LEE; Jun-Der
2009-12-03
Manufacturing Method For A Composite Metal Wire Used As A Packaging Wire And Products Thereof
App 20090191424 - LEE; Jun-Der
2009-07-30
Manufacturing Method For A Composite Metal Bonding Wire And Products Thereof
App 20090191088 - LEE; Jun-Der
2009-07-30

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