Lee; Jonggi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Jonggi.The latest application filed is for "protection assembly for ear-mounted sound-output device".

Company Profile

1.11.11

Lee; Jonggi - Gwangju N/A KR
Lee; Jonggi - Hwaseong-si KR
Lee; Jonggi - Yongin-Si KR
- Yongin-Si KR
Lee; Jonggi - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Protection assembly for ear-mounted sound-output device Grant 9,736,565 - Lee August 15, 2	2017-08-15
Protection Assembly For Ear-mounted Sound-output Device App 20170055062 - LEE; Jonggi	2017-02-23
Semiconductor packages Grant 9,530,755 - Yang , et al. December 27, 2	2016-12-27
Semiconductor packages and methods of fabricating the same Grant 8,921,163 - Park , et al. December 30, 2	2014-12-30
Semiconductor packages and methods of fabricating the same Grant 08921163 -	2014-12-30
Semiconductor Packages App 20140239515 - YANG; SEUNG-YEOL ; et al.	2014-08-28
Semiconductor Packages and Methods of Fabricating the Same App 20130267066 - Park; Sangwook ; et al.	2013-10-10
Reflow method Grant 8,536,045 - Kim , et al. September 17, 2	2013-09-17
Semiconductor packages Grant 8,456,018 - Park , et al. June 4, 2	2013-06-04
Coil and semiconductor apparatus having the same Grant 8,420,989 - Kim , et al. April 16, 2	2013-04-16
Reflow Apparatus, Reflow Method, And Package Apparatus App 20130068731 - KIM; Minill ; et al.	2013-03-21
Reflow apparatus, reflow method, and package apparatus Grant 8,324,522 - Kim , et al. December 4, 2	2012-12-04
Semiconductor Packages And Methods Of Fabricating The Same App 20120104625 - Park; Sangwook ; et al.	2012-05-03
Circuit Boards, Methods Of Forming The Same And Semiconductor Packages Including The Same App 20120043125 - Kim; Taehoon ; et al.	2012-02-23
Circuit manufacturing apparatus Grant 8,051,555 - Kim , et al. November 8, 2	2011-11-08
Reflow apparatus, Reflow method, and package apparatus App 20100181293 - Kim; Minill ; et al.	2010-07-22
Circuit Manufacturing Apparatus And Method Of Manufacturing A Semiconductor Circuit App 20100115763 - Kim; Minill ; et al.	2010-05-13
Coil And Semiconductor Apparatus Having The Same App 20100117213 - KIM; Minill ; et al.	2010-05-13
Semiconductor package, semiconductor module, and method for fabricating the semiconductor package App 20100096754 - Lee; Jonggi ; et al.	2010-04-22

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