| Patent | Date |
|---|
Camera Module
App 20220128888 - LEE; Jong Gi ; et al. | 2022-04-28 |
Optical Imaging System
App 20210157102 - SON; Ju Hwa ; et al. | 2021-05-27 |
Imaging Lens System
App 20210157103 - SON; Ju Hwa ; et al. | 2021-05-27 |
Optical Imaging System
App 20210096336 - SON; Ju Hwa ; et al. | 2021-04-01 |
Optical Imaging System
App 20210063704 - SON; Ju Hwa ; et al. | 2021-03-04 |
Optical Imaging System
App 20210063701 - SON; Ju Hwa ; et al. | 2021-03-04 |
Camera Module
App 20210063843 - LEE; Jong Gi ; et al. | 2021-03-04 |
Optical imaging system
Grant 10,901,184 - Son , et al. January 26, 2 | 2021-01-26 |
Optical Imaging System
App 20190250378 - SON; Ju Hwa ; et al. | 2019-08-15 |
Earphone protection device
Grant 10,257,605 - Lee | 2019-04-09 |
Earphone Protection Device
App 20190028798 - LEE; Jong Gi | 2019-01-24 |
In-line package apparatuses and methods
Grant 8,796,597 - Kim , et al. August 5, 2 | 2014-08-05 |
Multi-chip semiconductor package and method of fabricating the same
Grant 8,772,084 - Lee , et al. July 8, 2 | 2014-07-08 |
Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor package
Grant 8,664,762 - Lee , et al. March 4, 2 | 2014-03-04 |
Multi-chip Semiconductor Package And Method Of Fabricating The Same
App 20130078763 - LEE; Jong-Gi ; et al. | 2013-03-28 |
Semiconductor Package, Electrical And Electronic Apparatus Including The Semiconductor Package, And Method Of Manufacturing The Semiconductor Package
App 20120313244 - Lee; Jong-gi ; et al. | 2012-12-13 |
Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor package
Grant 8,288,210 - Lee , et al. October 16, 2 | 2012-10-16 |
Composition for manufacturing a carboxylic group-containing polymer and a polymer manufactured by using the same
Grant 8,283,430 - Ahn , et al. October 9, 2 | 2012-10-09 |
Mounting substrate
Grant 8,254,140 - Lee , et al. August 28, 2 | 2012-08-28 |
Semiconductor Package, Electrical And Electronic Apparatus Including The Semiconductor Package, And Method Of Manufacturing The Semiconductor Package
App 20110318876 - Lee; Jong-gi ; et al. | 2011-12-29 |
Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the same
Grant 7,759,795 - Kim , et al. July 20, 2 | 2010-07-20 |
Method Of Interconnecting Chips Using Capillary Motion
App 20100144137 - LEE; Kwang-yong ; et al. | 2010-06-10 |
Composition For Manufacturing A Carboxylic Group-containing Polymer And A Polymer Manufactured By Using The Same
App 20090318653 - Ahn; Kyo-Duck ; et al. | 2009-12-24 |
Semiconductor package including dummy board and method of fabricating the same
Grant 7,612,450 - Lee , et al. November 3, 2 | 2009-11-03 |
Mounting Substrate
App 20090188704 - LEE; Kwang-Yong ; et al. | 2009-07-30 |
In-line Package Apparatuses And Methods
App 20090127314 - KIM; Min-Ill ; et al. | 2009-05-21 |
Lead Frame, Semiconductor Package, And Stacked Semiconductor Package Having The Same
App 20090026596 - PARK; Sang-Wook ; et al. | 2009-01-29 |
Semiconductor packages including thermal stress buffers and methods of manufacturing the same
App 20080315379 - Kim; Ku-Young ; et al. | 2008-12-25 |
Stacked Semiconductor Package And Method Of Manufacturing The Same
App 20080308913 - PARK; Sang-Wook ; et al. | 2008-12-18 |
Semiconductor Package Having Molded Balls And Method Of Manufacturing The Same
App 20080290513 - BYUN; Hyung-Jik ; et al. | 2008-11-27 |
Method of fabricating electronic device having sacrificial anode, and electronic device fabricated by the same
App 20080122081 - Kim; Young-Lyong ; et al. | 2008-05-29 |
Printed Circuit Board Having Reliable Bump Interconnection Structure, Method Of Fabricating The Same, And Semiconductor Package Using The Same
App 20080054462 - KIM; Young-Lyong ; et al. | 2008-03-06 |
Semiconductor Package And Method Of Fabricating The Same
App 20080006949 - LEE; Jong-Gi ; et al. | 2008-01-10 |
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