Lee; Jin Hui

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Jin Hui.The latest application filed is for "plant cultivation method using ultravioleta rays and plant cultivation system therefor".

Company Profile

4.11.13

Lee; Jin Hui - Cheongju-si KR
Lee; Jin Hui - Chungcheongbuk-do KR
Lee; Jin Hui - Seoul KR
Lee; Jin Hui - Gyeongsan-si KR
Lee; Jin Hui - Icheon-si N/A KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for enhancing growth and useful substances of leafy vegetables by using environmental stress Grant 11,395,461 - Oh , et al. July 26, 2	2022-07-26
Method for promoting growth and bioactive substances of Crepidiastrum denticulatum Grant 11,304,388 - Oh , et al. April 19, 2	2022-04-19
Device for UV and low-temperature treatment for enhancing functional material of plant Grant 11,202,414 - Oh , et al. December 21, 2	2021-12-21
Plant Cultivation Method Using Ultravioleta Rays And Plant Cultivation System Therefor App 20210092906 - Oh; Myung Min ; et al.	2021-04-01
Method For Enhancing Growth And Useful Substances Of Leafy Vegetables By Using Environmental Stress App 20200178474 - OH; Myung Min ; et al.	2020-06-11
Device For Uv And Low-temperature Treatment For Enhancing Functional Material Of Plant App 20190223390 - OH; Myung Min ; et al.	2019-07-25
Method For Promoting Growth And Bioactive Substances Of Crepidiastrum Denticulatum App 20190150378 - OH; Myung Min ; et al.	2019-05-23
Semiconductor device and stacked semiconductor package having the same Grant 9,515,054 - Lee , et al. December 6, 2	2016-12-06
Method for dual mode beamforming and apparatus for the same Grant 9,503,172 - Choi , et al. November 22, 2	2016-11-22
Method For Dual Mode Beamforming And Apparatus For The Same App 20160277086 - CHOI; Kwon Hue ; et al.	2016-09-22
Stacked semiconductor package Grant 9,136,249 - Kim , et al. September 15, 2	2015-09-15
Semiconductor chip and stacked semiconductor package having the same Grant 8,884,445 - Lee November 11, 2	2014-11-11
Semiconductor Device And Stacked Semiconductor Package Having The Same App 20140015110 - LEE; Jin Hui ; et al.	2014-01-16
Semiconductor chip to dissipate heat, semiconductor package including the same, and stack package using the same Grant 8,581,385 - Lee November 12, 2	2013-11-12
Semiconductor Chip And Stacked Semiconductor Package Having The Same App 20130292843 - LEE; Jin Hui	2013-11-07
Stacked Semiconductor Package App 20130099388 - KIM; Taek Joong ; et al.	2013-04-25
Semiconductor Chip And Method For Fabricating The Same App 20120007213 - CHOI; Hyeong Seok ; et al.	2012-01-12
Semiconductor Chip Designed To Dissipate Heat Effectively, Semiconductor Package Including The Same, And Stack Package Using The Same App 20110304038 - Lee; Jin Hui	2011-12-15
Semiconductor Chip With Through Electrodes And Method For Manufacturing The Same App 20110304027 - LEE; Jin Hui ; et al.	2011-12-15

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