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Patent applications and USPTO patent grants for Lee; Jeong Sam.The latest application filed is for "apparatus and method for reducing residual stress of semiconductor".
Patent | Date |
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Retraction system for laparoscopic surgery Grant 9,247,932 - Lee February 2, 2 | 2016-02-02 |
Apparatus And Method For Reducing Residual Stress Of Semiconductor App 20140193984 - PARK; Jae Dong ;   et al. | 2014-07-10 |
Retraction System For Laparoscopic Surgery App 20130190572 - Lee; Jeong Sam | 2013-07-25 |
Trocar System For Use In Laparoscopic Surgery App 20130178885 - Lee; Jeong Sam | 2013-07-11 |
Method of Fabricating Semiconductor Device App 20120108035 - Kim; Goon-Woo ;   et al. | 2012-05-03 |
Package substrate, semiconductor package having the package substrate Grant 8,013,432 - Kwak , et al. September 6, 2 | 2011-09-06 |
Package Substrate, Semiconductor Package Having The Package Substrate App 20100065957 - Kwak; Yong-Il ;   et al. | 2010-03-18 |
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