Lee; James C. K.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; James C. K..The latest application filed is for "sequential multilayer process for using fluorinated hydrocarbons as a dielectric".
- Lee; James C. K. - Santa Clara County CA
- Lee; James C. K. - Los Altos Hills CA
- Lee; James C. K. - Los Altos CA
- Lee; James C. K. - Santa Clara CA
| Patent | Date |
|---|---|
| Sequential multilayer process for using fluorinated hydrocarbons as a dielectric Grant 5,387,495 - Lee , et al. February 7, 1 | 1995-02-07 |
| Double-sided hybrid high density circuit board and method of making same Grant 5,072,075 - Lee , et al. December 10, 1 | 1991-12-10 |
| System for detachably mounting semiconductors on conductor substrate Grant 5,014,161 - Lee , et al. May 7, 1 | 1991-05-07 |
| Anisotropic elastomeric interconnecting system Grant 4,778,950 - Lee , et al. October 18, 1 | 1988-10-18 |
| Electrical connector for surface mounting and method of making thereof Grant 4,754,546 - Lee , et al. July 5, 1 | 1988-07-05 |
| Multiple chip interconnection system and package Grant 4,692,839 - Lee , et al. September 8, 1 | 1987-09-08 |
| Semiconductor chip interface Grant 4,667,219 - Lee , et al. May 19, 1 | 1987-05-19 |
| Semiconductor chip module interconnection system Grant 4,667,220 - Lee , et al. May 19, 1 | 1987-05-19 |
| Integrated circuit packaging systems with double surface heat dissipation Grant 4,620,215 - Lee October 28, 1 | 1986-10-28 |
| Module construction for semiconductor chip Grant 4,603,345 - Lee , et al. July 29, 1 | 1986-07-29 |
| Interconnected leadless package receptacle Grant 4,045,105 - Lee , et al. * August 30, 1 | 1977-08-30 |
| Leadless package receptacle Grant 3,951,495 - Donaher , et al. April 20, 1 | 1976-04-20 |
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