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Patent applications and USPTO patent grants for Lee; Jae Wung.The latest application filed is for "device arrangement".
Patent | Date |
---|---|
Device arrangement Grant 10,669,152 - Singh , et al. | 2020-06-02 |
Device Arrangement App 20180312399 - SINGH; Navab ;   et al. | 2018-11-01 |
Method for thin film encapsulation (TFE) of a microelectromechanical system (MEMS) device and the MEMS device encapsulated thereof Grant 9,505,612 - Lee , et al. November 29, 2 | 2016-11-29 |
Thin Film Encapsulation of Electrodes App 20160289064 - Lee; Jae-Wung ;   et al. | 2016-10-06 |
Method For Thin Film Encapsulation (tfe) Of A Microelectromechanical System (mems) Device And The Mems Device Encapsulated Thereof App 20150175408 - Lee; Jae-Wung ;   et al. | 2015-06-25 |
Method Of Encapsulating A Micro-electromechanical (mems) Device App 20140147955 - Lee; Jae-Wung ;   et al. | 2014-05-29 |
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