loadpatents
Patent applications and USPTO patent grants for Lee; Ja-Yeon.The latest application filed is for "semiconductor device and semiconductor package having the same".
Patent | Date |
---|---|
Semiconductor device and package including modified region of less density at edge of device or substrate Grant 10,804,212 - Ko , et al. October 13, 2 | 2020-10-13 |
Semiconductor Device And Semiconductor Package Having The Same App 20200020641 - KO; YEONG-KWON ;   et al. | 2020-01-16 |
Apparatus And Method For Implementing User Interface Used For Group Communication App 20080209355 - Lee; Ju-Youn ;   et al. | 2008-08-28 |
Apparatus And Method Of Managing Content App 20080189331 - LEE; Ju-Youn ;   et al. | 2008-08-07 |
Method and apparatus for merging data objects App 20070198561 - Lee; Jung-bong ;   et al. | 2007-08-23 |
Method and apparatus for searching data in a mobile communication terminal App 20070156686 - Kim; Jae-Hwan ;   et al. | 2007-07-05 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.