Lee; In Kyung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; In Kyung.The latest application filed is for "cmp slurry composition for barrier polishing for manufacturing copper interconnects, polishing method using the composition, and semiconductor device manufactured by the method".

Company Profile

0.10.11

Lee; In Kyung - Euiwang-si N/A KR
Lee; In Kyung - Kyoungki-do KR
LEE; In Kyung - Uiwang-si KR
Lee; In Kyung - Kyoungi-Do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Slurry composition for chemical mechanical polishing of metal and polishing method using the same Grant 9,695,347 - Chou , et al. July 4, 2	2017-07-04
Chemical mechanical polishing slurry composition for polishing phase-change memory device and method for polishing phase-change memory device using the same Grant 8,586,464 - Lee , et al. November 19, 2	2013-11-19
Chemical mechanical polishing slurry compositions, methods of preparing the same and methods of using the same Grant 8,512,593 - Choung , et al. August 20, 2	2013-08-20
CMP Slurry Composition for Barrier Polishing for Manufacturing Copper Interconnects, Polishing Method Using the Composition, and Semiconductor Device Manufactured by the Method App 20100164106 - LEE; Tae Young ; et al.	2010-07-01
Chemical mechanical polishing slurry compositions, methods of preparing the same and methods of using the same Grant 7,708,900 - Choung , et al. May 4, 2	2010-05-04
Slurry composition for chemical mechanical polishing and precursor composition thereof Grant 7,695,637 - Park , et al. April 13, 2	2010-04-13
Chemical Mechanical Polishing Slurry Composition for Polishing Phase-Change Memory Device and Method for Polishing Phase-Change Memory Device Using the Same App 20090294749 - Lee; Tae Young ; et al.	2009-12-03
Polishing slurry composition and method of using the same Grant 7,601,273 - Roh , et al. October 13, 2	2009-10-13
Slurry composition for secondary polishing of silicon wafer Grant 7,534,277 - Roh , et al. May 19, 2	2009-05-19
Slurry Composition for Chemical Mechanical Polishing of Metal and Polishing Method Using the Same App 20090095939 - CHOU; Homer ; et al.	2009-04-16
Chemical Mechanical Polishing Slurry Composition for Polishing Phase-Change Memory Device and Method for Polishing Phase-Change Memory Device Using the Same App 20090001340 - LEE; Tae Young ; et al.	2009-01-01
Chemical Mechanical Polishing Slurry Composition for Polishing Phase-Change Memory Device and Method for Polishing Phase-Change Memory Device Using the Same App 20090001339 - LEE; Tae Young ; et al.	2009-01-01
Slurry Composition for Final Polishing of Silicon Wafers and Method for Final Polishing of Silicon Wafers Using the Same App 20080127573 - Roh; Hyun Soo ; et al.	2008-06-05
Slurry Composition for Chemical Mechanical Polishing and Precursor Composition Thereof App 20080121839 - PARK; Tae Won ; et al.	2008-05-29
Chemical mechanical polishing slurry compositions, methods of preparing the same and methods of using the same App 20070101659 - Choung; Jae Hoon ; et al.	2007-05-10
Chemical mechanical polishing slurry compositions, methods of preparing the same and methods of using the same App 20070102664 - Choung; Jae Hoon ; et al.	2007-05-10
Slurry composition for secondary polishing of silicon wafer App 20060242912 - Roh; Hyun Soo ; et al.	2006-11-02
Polishing slurry composition and method of using the same App 20060196850 - Roh; Hyun Soo ; et al.	2006-09-07

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