Lee; Hyunmin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Hyunmin.The latest application filed is for "semiconductor memory devices".

Company Profile

3.8.10

Lee; Hyunmin - Seoul KR
Lee; Hyunmin - Seongnam-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor memory devices Grant 10,685,977 - Kim , et al.	2020-06-16
Display screen or portion thereof with transitional graphical user interface Grant D875,742 - Kang , et al. Feb	2020-02-18
Semiconductor Memory Devices App 20190148403 - KIM; JONGWON ; et al.	2019-05-16
Semiconductor memory devices Grant 10,186,519 - Kim , et al. Ja	2019-01-22
Reception device for wireless charging Grant 9,748,791 - Lee , et al. August 29, 2	2017-08-29
Semiconductor memory device and method of fabricating the same Grant 9,543,316 - Lee , et al. January 10, 2	2017-01-10
Semiconductor Memory Devices App 20160293626 - KIM; JONGWON ; et al.	2016-10-06
Semiconductor Memory Device And Method Of Fabricating The Same App 20160043100 - LEE; Hyunmin ; et al.	2016-02-11
Apparatus For Wirelessly Transmitting Power App 20150349545 - LEE; Hyunmin ; et al.	2015-12-03
Integrated circuit devices including interconnections insulated by air gaps and methods of fabricating the same Grant 9,165,820 - Kim , et al. October 20, 2	2015-10-20
Reception Device For Wireless Charging App 20150194840 - LEE; Hyunmin ; et al.	2015-07-09
Self-defense Spray And Method Of Controlling Electronic Device Using The Same App 20150133072 - JANG; SeWon ; et al.	2015-05-14
Integrated Circuit Devices Including Interconnections Insulated by Air Gaps and Methods of Fabricating the Same App 20140342548 - Kim; Jeeyong ; et al.	2014-11-20
Integrated circuit devices including interconnections insulated by air gaps and methods of fabricating the same Grant 8,829,682 - Kim , et al. September 9, 2	2014-09-09
Integrated Circuit Devices Including Interconnections Insulated By Air Gaps And Methods Of Fabricating The Same App 20130228934 - KIM; Jeeyong ; et al.	2013-09-05

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