LEE; Hyunbae

Patent Applications and Registrations

Patent applications and USPTO patent grants for LEE; Hyunbae.The latest application filed is for "integrated circuit chip including wiring structure".

Company Profile

3.7.10

LEE; Hyunbae - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated Circuit Chip Including Wiring Structure App 20220262738 - LEE; Jangeun ; et al.	2022-08-18
Semiconductor Device And Method Of Manufacturing The Same App 20220230956 - NOH; Sunyoung ; et al.	2022-07-21
Semiconductor Device App 20220208673 - LEE; EUI BOK ; et al.	2022-06-30
Semiconductor device Grant 11,374,001 - Noh , et al. June 28, 2	2022-06-28
Method Of Fabricating A Semiconductor Device App 20220139910 - KIM; Geunwoo ; et al.	2022-05-05
Semiconductor device with diffusion barrier in the active contact Grant 11,233,050 - Kim , et al. January 25, 2	2022-01-25
Semiconductor Device App 20210134793 - KIM; Geunwoo ; et al.	2021-05-06
Semiconductor Device App 20210066289 - NOH; Sunyoung ; et al.	2021-03-04
Method of manufacturing semiconductor device using a plurality of etch stop layers Grant 10,192,782 - Lee , et al. Ja	2019-01-29
Method Of Manufacturing Semiconductor Device Using A Plurality Of Etch Stop Layers App 20160133512 - LEE; Woojin ; et al.	2016-05-12
Semiconductor devices including interlayer conductive contacts and methods of forming the same Grant 8,404,593 - Hong , et al. March 26, 2	2013-03-26
Semiconductor Devices Including Interlayer Conductive Contacts And Methods Of Forming The Same App 20110097895 - Hong; Jongwon ; et al.	2011-04-28
Semiconductor devices including interlayer conductive contacts and methods of forming the same Grant 7,888,798 - Hong , et al. February 15, 2	2011-02-15
Semiconductor devices including interlayer conductive contacts and methods of forming the same App 20080284006 - Hong; Jongwon ; et al.	2008-11-20

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