Lee; Hyuekjae

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Hyuekjae.The latest application filed is for "semiconductor package and method of manufacturing the same".

Company Profile

5.8.19

Lee; Hyuekjae - Hwaseong-si KR
Lee; Hyuekjae - Hwasung N/A KR
Lee; Hyuekjae - Suwon-si N/A KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package including underfill material layer and method of forming the same Grant 11,404,395 - Hwang , et al. August 2, 2	2022-08-02
Semiconductor Package And Method Of Manufacturing The Same App 20220208649 - Oh; Seungyeol ; et al.	2022-06-30
Die-to-wafer Bonding Structure And Semiconductor Package Using The Same App 20220181285 - Hong; Jiseok ; et al.	2022-06-09
Semiconductor Package App 20220165722 - PARK; Sang Cheon ; et al.	2022-05-26
Semiconductor Package App 20220139880 - Lee; Hyuekjae ; et al.	2022-05-05
Integrated Circuit Chip Having Bs-pdn Structure App 20220139863 - Song; Eunseok ; et al.	2022-05-05
Semiconductor Package App 20220139874 - LEE; Sanghoon ; et al.	2022-05-05
Semiconductor Package Having Stacked Semiconductor Chips App 20220130801 - LEE; Hyuekjae ; et al.	2022-04-28
Die-to-wafer bonding structure and semiconductor package using the same Grant 11,289,438 - Hong , et al. March 29, 2	2022-03-29
Semiconductor Packages And Methods Of Manufacturing The Same App 20220068863 - HONG; JISEOK ; et al.	2022-03-03
Semiconductor package having stacked semiconductor chips Grant 11,244,927 - Lee , et al. February 8, 2	2022-02-08
Semiconductor Package App 20220028834 - LEE; HYUEKJAE ; et al.	2022-01-27
Packaged Multi-chip Semiconductor Devices And Methods Of Fabricating Same App 20210358875 - Lee; Hyuekjae ; et al.	2021-11-18
Semiconductor packages having improved reliability in bonds between connection conductors and pads Grant 11,158,594 - Hong , et al. October 26, 2	2021-10-26
Semiconductor Package Including Underfill Material Layer And Method Of Forming The Same App 20210151410 - HWANG; Jihwan ; et al.	2021-05-20
Semiconductor Packages And Methods Of Manufacturing The Same App 20210143116 - HONG; JISEOK ; et al.	2021-05-13
Stacked Semiconductor Package App 20210125955 - SUH; JIHWAN ; et al.	2021-04-29
Die-to-wafer Bonding Structure And Semiconductor Package Using The Same App 20210104482 - Hong; Jiseok ; et al.	2021-04-08
Semiconductor Package Having Stacked Semiconductor Chips App 20210028152 - LEE; Hyuekjae ; et al.	2021-01-28
Semiconductor Package And A Method For Manufacturing The Same App 20210028146 - LEE; HYUEKJAE ; et al.	2021-01-28
Substrate Treating Apparatus And A Method For Treating A Substrate App 20160314996 - KIM; IL HWAN ; et al.	2016-10-27
Method for wafer level package and semiconductor device fabricated using the same Grant 8,558,371 - Hong , et al. October 15, 2	2013-10-15
Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers Grant 8,399,987 - Kwon , et al. March 19, 2	2013-03-19
Method For Wafer Level Package and Semiconductor Device Fabricated Using The Same App 20110233706 - Hong; JiSun ; et al.	2011-09-29
Microelectronic Devices Including Conductive Vias, Conductive Caps And Variable Thickness Insulating Layers, And Methods Of Fabricating Same App 20110133333 - Kwon; Woonseong ; et al.	2011-06-09

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