loadpatents
Patent applications and USPTO patent grants for Lee; Hyoun-Young.The latest application filed is for "forming method for structure for reinforcement and structure for reinforcement".
Patent | Date |
---|---|
Forming Method For Structure For Reinforcement And Structure For Reinforcement App 20220097114 - Lee; Hyoun-Young ;   et al. | 2022-03-31 |
Forward portion of vehicle body Grant 9,650,073 - Kim , et al. May 16, 2 | 2017-05-16 |
Surface-treated Substrate And Substrate Surface Treatment Method For Same App 20160326654 - JEONG; Hyunju ;   et al. | 2016-11-10 |
Method of manufacturing multi physical properties part Grant 9,394,578 - Lee , et al. July 19, 2 | 2016-07-19 |
Forward Portion of Vehicle Body App 20150336614 - Kim; Jae-Hyun ;   et al. | 2015-11-26 |
Underbody for electric vehicle Grant 8,672,354 - Kim , et al. March 18, 2 | 2014-03-18 |
Method of Manufacturing Multi Physical Properties Part App 20130180633 - Lee; Hong-Woo ;   et al. | 2013-07-18 |
Underbody For Electric Vehicle App 20130175829 - Kim; Jae-Hyun ;   et al. | 2013-07-11 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.